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Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)最新文献

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Fault isolation and performance characterization of high speed digital multichip modules 高速数字多芯片模块的故障隔离与性能表征
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.511999
D. Keezer
{"title":"Fault isolation and performance characterization of high speed digital multichip modules","authors":"D. Keezer","doi":"10.1109/MCMC.1995.511999","DOIUrl":"https://doi.org/10.1109/MCMC.1995.511999","url":null,"abstract":"This paper describes two methods for testing high performance digital multichip modules (MCMs). The first technique provides a method for multiplexing automatic test system channels so that clock and data rates can be extended beyond the normal frequency limits of the Automatic Test Equipment (ATE). The multiplexing method has been successfully applied at rates up to 1.6 GHz using 200 MHz ATE. The second approach utilizes an electron beam probe system operating in the voltage contrast mode to measure electrical signals within the MCM. The e-beam probe can be used to supplement scan-based techniques for isolating faults. It can also be used for characterizing signal quality (rise-time, overshoot, crosstalk, reflections) and measurement of relative delays in high performance MCMs.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133210107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Design and characterization of three-dimensional aluminum nitride multichip modules 三维氮化铝多芯片模块的设计与表征
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512023
S. Palmquist, R. Jensen, W. F. Jacobsen, R. Spielberger
{"title":"Design and characterization of three-dimensional aluminum nitride multichip modules","authors":"S. Palmquist, R. Jensen, W. F. Jacobsen, R. Spielberger","doi":"10.1109/MCMC.1995.512023","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512023","url":null,"abstract":"A three-dimensional packaging technology based on stacked multi-layer aluminum nitride (AlN) multichip modules (MCMs) has been demonstrated by Honeywell and Coors Electronic Package Company, under sponsorship of the Naval Command, Control and Ocean Surveillance Center. The concept increases chip density by stacking single-or double-sided AlN MCMs that have internal metal layers for signal interconnection and power distribution. Prototype Technology Characterization Vehicles (TCVs) have been fabricated to verify key fabrication and assembly processes, and to characterize the electrical, thermal, and mechanical performance of the 3D structures. Exceptional thermal performance has been predicted by finite element models and corroborated by experimental measurements for single and stacked MCMs. The electrical characteristics of AlN interconnections for the TCV are also discussed. A demonstration system consisting of a GVSC 1750A processor MCM and a double-sided memory MCM has been designed and fabricated. A prototype of the demonstration system is shown.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124966831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A novel low cost MCM-D technology 一种新颖的低成本MCM-D技术
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512022
A. M. Almeida, M. Barnett, C. Finardi, A. Flacker, A.C. Gozzi, J. P. Molina, A. Pagotto, M. Santos
{"title":"A novel low cost MCM-D technology","authors":"A. M. Almeida, M. Barnett, C. Finardi, A. Flacker, A.C. Gozzi, J. P. Molina, A. Pagotto, M. Santos","doi":"10.1109/MCMC.1995.512022","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512022","url":null,"abstract":"Interconnection technology has also been a key to success in the modern telecommunication systems, which are demanding more and more services, mobility, and reliability. As one knows, different technologies has been applied to solve the needs on electronic packaging, each one with its advantages and disadvantages. Telebras has evaluated them and decided to investigate an own solution. The paper describes a technological solution for fabricating MCMs developed at Telebras. It presents as main features: low cost, process simplification, reproducibility and SMD and COB assembly compatibility. This innovative approach is based on a electro-chemical copper deposition onto ceramics and conventional lithography. A general description of the processing is provided and some results and modules fabricated on alumina 96% are shown.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127463079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Design considerations for implementing a modularly configured attached processor in a multi chip module 在多芯片模块中实现模块化配置的附加处理器的设计考虑
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512005
J. Singh, Buck W. Gremel, Vijay Singh, G. Gibson
{"title":"Design considerations for implementing a modularly configured attached processor in a multi chip module","authors":"J. Singh, Buck W. Gremel, Vijay Singh, G. Gibson","doi":"10.1109/MCMC.1995.512005","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512005","url":null,"abstract":"Implementation of a novel modularly configured attached processor (MCAP) architecture was evaluated using 1 /spl mu/m CMOS logic on an MCM-D The transistor count was approximately ten million transistors, distributed on twenty-five chip dice. Delay, area, and power calculations were performed using the SUSPENS model. Rent's rule was found to be not applicable. Speed was calculated to be in the 100 MHz range. The module foot print was found to be 90 cm/sup 2/. Power dissipation per unit area was low enough to allow air cooling.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114206256","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Application of capacitive coupling to switch fabrics 电容耦合在开关织物中的应用
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512026
D. Salzman, T. Knight, P. Franzon
{"title":"Application of capacitive coupling to switch fabrics","authors":"D. Salzman, T. Knight, P. Franzon","doi":"10.1109/MCMC.1995.512026","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512026","url":null,"abstract":"In this paper, we look beyond conductive coupling to the fundamental opportunity for passing signals between chips by non-conductive means. Capacitively coupled interconnects afford a number of advantages over conventional, conductive junctions in flipped chip MCM designs. The main focus of this paper is to describe a conceptual design for a switch fabric that employs the unique advantages of capacitively coupled multichip modules. A secondary focus is to describe current experiments-in-progress intended to demonstrate the utility and advantages of capacitive coupling.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115373004","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
High temperature Cu-Sn joints manufactured by a 250/spl deg/C fluxless bonding process 高温Cu-Sn接头由250/spl℃无熔焊工艺制造
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512028
Yi-Chia Chen, S.J. Lee, C.C. Lee
{"title":"High temperature Cu-Sn joints manufactured by a 250/spl deg/C fluxless bonding process","authors":"Yi-Chia Chen, S.J. Lee, C.C. Lee","doi":"10.1109/MCMC.1995.512028","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512028","url":null,"abstract":"A 250/spl deg/C bonding process is developed to manufacture Cu-Sn joints that can withstand up to 415/spl deg/C. This is made possible by solid-liquid interdiffusion in the mixture of Cu, Sn, and Sn liquid that contacts with Cu coated on a substrate. The mixture is produced by heating the Sn-Cu multilayer composite that is deposited on semiconductor in high vacuum to inhibit tin oxidation. Upon deposition, Cu interacts with Sn to become Sn-Cu/sub 6/Sn/sub 5/ composite where Cu/sub 6/Sn/sub 5/, prevents the Sn layer from oxidation in atmosphere. Thus no flux is needed. This is a fluxless, lead-free, low cost, low temperature process that provides high temperature joints.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129732248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Micro heat spreader enhanced heat transfer in MCMs 微型散热器增强了mcm的传热
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512025
D. Shen, R. Mitchell, D. Dobranich, D. Adkins, M. Tuck
{"title":"Micro heat spreader enhanced heat transfer in MCMs","authors":"D. Shen, R. Mitchell, D. Dobranich, D. Adkins, M. Tuck","doi":"10.1109/MCMC.1995.512025","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512025","url":null,"abstract":"The peak thermal power generated in microelectronics assemblies has risen from less than 1 W/cm/sup 2/ in 1980 to greater than 40 W/cm/sup 2/ today, due primarily to increasing densities at both the IC and packaging levels. We have demonstrated enhanced heat transfer in a prototype Si substrate with a backside micro heat channel structure. Unlike conventional micro heat pipes, these channels are biaxial with a greater capacity for fluid transfer. Thermal modeling and preliminary experiments have shown an equivalent increase in substrate thermal conductivity to over 500 W/m.K, or a four times improvement. Optimization of the structure and alternative liquids will further increase the thermal conductivity of the micro heat channel substrate with the objective being polycrystalline diamond, or about 1200 W/m.K. The crucial design parameters for the micro heat channel system and the thermal characteristics of the system are covered.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129908953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Inductance calculations for MCM system design and simulation 电感计算用于MCM系统的设计与仿真
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512008
N. Klemmer
{"title":"Inductance calculations for MCM system design and simulation","authors":"N. Klemmer","doi":"10.1109/MCMC.1995.512008","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512008","url":null,"abstract":"Inductors are necessary for the realization of high frequency subsystems particularly as multi chip modules. Characterization and optimization of high pin-count packages requires the knowledge of self and mutual inductances for the various pin-to-pad paths. Improvement of assembly techniques needs accurate models for bond wires and their coupling. Calculations based on a full three dimensional analytical solution for the mutual inductance of general current filaments and parallel rectangular current segments are given. Finite cross sections in the case of nonparallel segments are numerically calculated from the analytical solution for current filaments. The influence of strong skin effect on the inductance values is demonstrated Applications to planar inductors and bond wires are shown. The effects of single and dual ground planes near to the structures are calculated and applied to signal paths within typical high pin count packages.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"36 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129234101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Comparisons of bus transfer operations using PPS (pulsed power supply) and conventional CMOS in PWB and MCM environments 在PWB和MCM环境下使用PPS(脉冲电源)和传统CMOS的总线传输操作的比较
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512014
T. Gabara, B. Fischer
{"title":"Comparisons of bus transfer operations using PPS (pulsed power supply) and conventional CMOS in PWB and MCM environments","authors":"T. Gabara, B. Fischer","doi":"10.1109/MCMC.1995.512014","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512014","url":null,"abstract":"A comparison of I/O power dissipation is compared for an adiabatic technique called PPS CMOS and conventional CMOS. The simulated results evaluated either a PWB or an MCM environment. A 32 bit bus with 8 loads on each bus is the model used for this paper. The results indicate that power and noise reductions are possible using PPS I/O buffers. Furthermore, the MCM is an optimum environment for the adiabatic logic family.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"194 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124317257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An MCM-D memory module in an overmolded plastic package MCM-D内存条采用塑料封装
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512000
A. Bet-Shliemoun, Nien-Tsu Shen, D. Malladi, D. Towne, A. Tam
{"title":"An MCM-D memory module in an overmolded plastic package","authors":"A. Bet-Shliemoun, Nien-Tsu Shen, D. Malladi, D. Towne, A. Tam","doi":"10.1109/MCMC.1995.512000","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512000","url":null,"abstract":"In this paper, a PQFP package design which holds a thin film MCM with four memory dice is described. The substrate design is briefly mentioned. We describe the strategy to integrate the MCM-D Al substrate into an existing standard package (i.e. 160 lead PQFP) with minimum cost to meet manufacturability and reliability requirements. This was achieved through minimal modifications to existing assembly processes, fixtures, and materials. Also discussed is material selection to meet the reliability stress tests goals with respect to thin film MCM corrosion and stress relief on high aspect ratio die sizes. Choice of molding compound, die attach and stress relief coatings and their impact on reliability are discussed. The proper selection of materials can eliminate a few assembly steps. The reliability qualification requirements and the qualification test results are also presented.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125631639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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