Fault isolation and performance characterization of high speed digital multichip modules

D. Keezer
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引用次数: 3

Abstract

This paper describes two methods for testing high performance digital multichip modules (MCMs). The first technique provides a method for multiplexing automatic test system channels so that clock and data rates can be extended beyond the normal frequency limits of the Automatic Test Equipment (ATE). The multiplexing method has been successfully applied at rates up to 1.6 GHz using 200 MHz ATE. The second approach utilizes an electron beam probe system operating in the voltage contrast mode to measure electrical signals within the MCM. The e-beam probe can be used to supplement scan-based techniques for isolating faults. It can also be used for characterizing signal quality (rise-time, overshoot, crosstalk, reflections) and measurement of relative delays in high performance MCMs.
高速数字多芯片模块的故障隔离与性能表征
本文介绍了两种测试高性能数字多芯片模块(mcm)的方法。第一种技术提供了一种多路复用自动测试系统信道的方法,使时钟和数据速率可以扩展到自动测试设备(ATE)的正常频率限制之外。该多路复用方法已成功应用于高达1.6 GHz的速率,使用200 MHz ATE。第二种方法利用在电压对比模式下操作的电子束探针系统来测量MCM内的电信号。电子束探头可以作为基于扫描的故障隔离技术的补充。它还可用于表征信号质量(上升时间、超调、串扰、反射)和测量高性能mcm中的相对延迟。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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