A. M. Almeida, M. Barnett, C. Finardi, A. Flacker, A.C. Gozzi, J. P. Molina, A. Pagotto, M. Santos
{"title":"一种新颖的低成本MCM-D技术","authors":"A. M. Almeida, M. Barnett, C. Finardi, A. Flacker, A.C. Gozzi, J. P. Molina, A. Pagotto, M. Santos","doi":"10.1109/MCMC.1995.512022","DOIUrl":null,"url":null,"abstract":"Interconnection technology has also been a key to success in the modern telecommunication systems, which are demanding more and more services, mobility, and reliability. As one knows, different technologies has been applied to solve the needs on electronic packaging, each one with its advantages and disadvantages. Telebras has evaluated them and decided to investigate an own solution. The paper describes a technological solution for fabricating MCMs developed at Telebras. It presents as main features: low cost, process simplification, reproducibility and SMD and COB assembly compatibility. This innovative approach is based on a electro-chemical copper deposition onto ceramics and conventional lithography. A general description of the processing is provided and some results and modules fabricated on alumina 96% are shown.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A novel low cost MCM-D technology\",\"authors\":\"A. M. Almeida, M. Barnett, C. Finardi, A. Flacker, A.C. Gozzi, J. P. Molina, A. Pagotto, M. Santos\",\"doi\":\"10.1109/MCMC.1995.512022\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Interconnection technology has also been a key to success in the modern telecommunication systems, which are demanding more and more services, mobility, and reliability. As one knows, different technologies has been applied to solve the needs on electronic packaging, each one with its advantages and disadvantages. Telebras has evaluated them and decided to investigate an own solution. The paper describes a technological solution for fabricating MCMs developed at Telebras. It presents as main features: low cost, process simplification, reproducibility and SMD and COB assembly compatibility. This innovative approach is based on a electro-chemical copper deposition onto ceramics and conventional lithography. A general description of the processing is provided and some results and modules fabricated on alumina 96% are shown.\",\"PeriodicalId\":223500,\"journal\":{\"name\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-01-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1995.512022\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1995.512022","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnection technology has also been a key to success in the modern telecommunication systems, which are demanding more and more services, mobility, and reliability. As one knows, different technologies has been applied to solve the needs on electronic packaging, each one with its advantages and disadvantages. Telebras has evaluated them and decided to investigate an own solution. The paper describes a technological solution for fabricating MCMs developed at Telebras. It presents as main features: low cost, process simplification, reproducibility and SMD and COB assembly compatibility. This innovative approach is based on a electro-chemical copper deposition onto ceramics and conventional lithography. A general description of the processing is provided and some results and modules fabricated on alumina 96% are shown.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
