Inductance calculations for MCM system design and simulation

Abstract

Inductors are necessary for the realization of high frequency subsystems particularly as multi chip modules. Characterization and optimization of high pin-count packages requires the knowledge of self and mutual inductances for the various pin-to-pad paths. Improvement of assembly techniques needs accurate models for bond wires and their coupling. Calculations based on a full three dimensional analytical solution for the mutual inductance of general current filaments and parallel rectangular current segments are given. Finite cross sections in the case of nonparallel segments are numerically calculated from the analytical solution for current filaments. The influence of strong skin effect on the inductance values is demonstrated Applications to planar inductors and bond wires are shown. The effects of single and dual ground planes near to the structures are calculated and applied to signal paths within typical high pin count packages.