{"title":"用于倒装芯片组装的热声键合","authors":"S. Kang, T. McLaren, Wenge Zhang, Y.C. Lee","doi":"10.1109/MCMC.1995.512007","DOIUrl":null,"url":null,"abstract":"Thermosonic flip-chip bonding is a new, solderless technology for area-array connections. Its simple, clean, and dry process may significantly reduce the assembly cost for prototyping and manufacturing of MCMs. The feasibility of the technology has been demonstrated by our studies on 64-I/O GaAs-on-silicon test vehicles. But, the repeatability of the bonding quality needs to be controlled. Two process control variables, force and ultrasonic power applied to the chip, will be discussed.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":"{\"title\":\"Thermosonic bonding for flip-chip assembly\",\"authors\":\"S. Kang, T. McLaren, Wenge Zhang, Y.C. Lee\",\"doi\":\"10.1109/MCMC.1995.512007\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermosonic flip-chip bonding is a new, solderless technology for area-array connections. Its simple, clean, and dry process may significantly reduce the assembly cost for prototyping and manufacturing of MCMs. The feasibility of the technology has been demonstrated by our studies on 64-I/O GaAs-on-silicon test vehicles. But, the repeatability of the bonding quality needs to be controlled. Two process control variables, force and ultrasonic power applied to the chip, will be discussed.\",\"PeriodicalId\":223500,\"journal\":{\"name\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-01-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"22\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1995.512007\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1995.512007","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermosonic flip-chip bonding is a new, solderless technology for area-array connections. Its simple, clean, and dry process may significantly reduce the assembly cost for prototyping and manufacturing of MCMs. The feasibility of the technology has been demonstrated by our studies on 64-I/O GaAs-on-silicon test vehicles. But, the repeatability of the bonding quality needs to be controlled. Two process control variables, force and ultrasonic power applied to the chip, will be discussed.
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