A novel 2-sided multi-chip-module used to create a 50,000 gate programmable logic device

Abstract

A 32-layer ceramic multi-chip-module was created to support a 50,000-gate programmable logic device. The high gate-count was achieved by combining four 12,500-gate PLDs and one programmable interconnect on both sides of a 32-layer ceramic substrate. A known-good-die process has been developed for one of the active components by using the module itself as a test bed. In addition, an assembly process has been developed which maximizes rework yield. Made possible with MCM technology, this high-density device is intended for gate array prototyping.