{"title":"通过整形避免分布式RLC线路中的色散","authors":"J. Roychowdhury","doi":"10.1109/MCMC.1995.512013","DOIUrl":null,"url":null,"abstract":"The shaping of RLC lines for delay reduction is investigated. It is shown that inductance can act to diminish dispersion, to the extent of reducing delay to its theoretical time-of-flight minimum even in the presence of substantial loss in the line. Simulations predict significant delay improvement (25%-38%) for long MCM lines propagating high-speed signals.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Avoiding dispersion in distributed RLC lines by shaping\",\"authors\":\"J. Roychowdhury\",\"doi\":\"10.1109/MCMC.1995.512013\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The shaping of RLC lines for delay reduction is investigated. It is shown that inductance can act to diminish dispersion, to the extent of reducing delay to its theoretical time-of-flight minimum even in the presence of substantial loss in the line. Simulations predict significant delay improvement (25%-38%) for long MCM lines propagating high-speed signals.\",\"PeriodicalId\":223500,\"journal\":{\"name\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-01-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1995.512013\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1995.512013","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Avoiding dispersion in distributed RLC lines by shaping
The shaping of RLC lines for delay reduction is investigated. It is shown that inductance can act to diminish dispersion, to the extent of reducing delay to its theoretical time-of-flight minimum even in the presence of substantial loss in the line. Simulations predict significant delay improvement (25%-38%) for long MCM lines propagating high-speed signals.