Avoiding dispersion in distributed RLC lines by shaping

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI:10.1109/MCMC.1995.512013

J. Roychowdhury

引用次数: 5

Abstract

The shaping of RLC lines for delay reduction is investigated. It is shown that inductance can act to diminish dispersion, to the extent of reducing delay to its theoretical time-of-flight minimum even in the presence of substantial loss in the line. Simulations predict significant delay improvement (25%-38%) for long MCM lines propagating high-speed signals.

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通过整形避免分布式RLC线路中的色散

研究了RLC线的整形以降低延迟。结果表明，电感可以起到减小色散的作用，即使在线路中存在大量损耗的情况下，也可以将延迟降低到理论飞行时间的最小值。模拟预测，对于传播高速信号的长MCM线路，延迟显著改善(25%-38%)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)

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