{"title":"The design and implementation of NASA's advanced flight computing module","authors":"L. Alkalaj, B. Jarvis","doi":"10.1109/MCMC.1995.512001","DOIUrl":null,"url":null,"abstract":"This paper describes the first MCM module of the AFC program which implements the functionality of a 32-bit RISC radiation hardened space flight computer. This module was designed jointly by engineers at JPL and TRW using a collaborative partnership agreement. The MCM was fabbed at nCHIP Corporation. The AFC program also plans to design, develop, and fab two more MCM modules: the Mass Memory MCM, and Programmable I/O MCM. These three MCMs will then be stacked as part of a scalable (stackable) core avionics architecture. The flight computer MCM described in this pager contains 33 die in a single 2 by 4 inch AlN package from Coors, with a total of 442 pins. The MCM uses nCHIP's die stack approach for both SRAM and EEPROM.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1995.512001","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
This paper describes the first MCM module of the AFC program which implements the functionality of a 32-bit RISC radiation hardened space flight computer. This module was designed jointly by engineers at JPL and TRW using a collaborative partnership agreement. The MCM was fabbed at nCHIP Corporation. The AFC program also plans to design, develop, and fab two more MCM modules: the Mass Memory MCM, and Programmable I/O MCM. These three MCMs will then be stacked as part of a scalable (stackable) core avionics architecture. The flight computer MCM described in this pager contains 33 die in a single 2 by 4 inch AlN package from Coors, with a total of 442 pins. The MCM uses nCHIP's die stack approach for both SRAM and EEPROM.