Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)最新文献

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Oscillation Built-In-Self-Test for ADC linearity testing in deep submicron CMOS technology 深亚微米CMOS技术中ADC线性度测试的振荡内置自检
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-10-24 DOI: 10.1109/ASQED.2013.6643589
Koay Soon Chan, Nuzrul Fahmi Nordin, Kim Chon Chan, Terk Zyou Lok, C. W. Yong, A. Osseiran
{"title":"Oscillation Built-In-Self-Test for ADC linearity testing in deep submicron CMOS technology","authors":"Koay Soon Chan, Nuzrul Fahmi Nordin, Kim Chon Chan, Terk Zyou Lok, C. W. Yong, A. Osseiran","doi":"10.1109/ASQED.2013.6643589","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643589","url":null,"abstract":"This paper proposes an Oscillation BIST (OBIST) that is meant to test ADCs fabricated in sub 100nm processes. The design is intended to be capable of testing a 10-bit ADC that was designed in 40nm CMOS. The design scheme presents a simple analog stimulus generator that was designed in 40nm CMOS together with schematic based simulation results. There is also a description of a calibration circuit and a highlevel implementation of a BIST control system to run the BIST and to calculate static parameters such as Differential Non-linearity (DNL) and Integral Non-linearity (INL). Simulation results for the analog stimulus generator suggest that OBIST might still be a viable method to test ADCs despite device scaling to sub 100nm processes.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129251449","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An efficient metric for detecting timing failure region due to crosstalk noise 一种检测串扰噪声引起的时序失效区域的有效度量
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-10-24 DOI: 10.1109/ASQED.2013.6643607
Hyoeon Yang, Young Hwan Kim
{"title":"An efficient metric for detecting timing failure region due to crosstalk noise","authors":"Hyoeon Yang, Young Hwan Kim","doi":"10.1109/ASQED.2013.6643607","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643607","url":null,"abstract":"Crosstalk noise is a critical issue in the deep submicron circuit design, since it causes functional failures in IC chips. This paper proposes an efficient approach to find the timing region of the circuit that timing failure occurs in an IC chip. The proposed method efficiently finds timing failure region by using CGOV metric without iterative simulations. In the experimental results, the proposed method shows 5.4 % average error rate, and 12 % maximum error rate compared with spice simulation results.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123424922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A low-power circuit architecture for transistor electrical overstress (EOS) protection 一种晶体管电过压(EOS)保护的低功耗电路结构
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-10-24 DOI: 10.1109/ASQED.2013.6643601
Aw Chee Hong
{"title":"A low-power circuit architecture for transistor electrical overstress (EOS) protection","authors":"Aw Chee Hong","doi":"10.1109/ASQED.2013.6643601","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643601","url":null,"abstract":"As the transistor dimension keeps shrinking following trend predicted by Moore's Law, the voltage that transistor can sustain reliably is also reducing. For certain serial interface protocols (like the ubiquitous Universal Serial Bus (USB)) and some legacy input/output interfaces, high voltages like 1.8V, 3.3V and even 5.0V are still being used for protocol compliance. It is costly in silicon fabrication to provide transistors with different gate-oxide thickness to cater for various high voltage and speed requirements. In order to minimize the type of gate oxide thickness in advanced silicon process, circuit innovation is usually required to enable transistor to operate with voltage higher than its reliability limit, yet protected from electrical overstress (EOS). This paper discusses a new circuit architecture that is able to detect voltage source as well as to switch between external source and internal biasing voltage to ensure all transistors operating with high voltage are not exposed to the voltage limit. This circuit is low power in nature since it does not consume static current. By having this protection scheme, this would enable the use of transistor to support high-voltage application without incurring cost of having additional thicker gate-oxide transistor. In terms of application, this architecture can be used in integrated chip design involving various high-voltage supplies.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131668752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Tunable stochastic computing using layered synthesis and temperature adaptive voltage scaling 基于分层合成和温度自适应电压标度的可调随机计算
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-10-24 DOI: 10.1109/ASQED.2013.6643572
Neel Gala, V. Devanathan, V. Visvanathan, Virat Gandhi, V. Kamakoti
{"title":"Tunable stochastic computing using layered synthesis and temperature adaptive voltage scaling","authors":"Neel Gala, V. Devanathan, V. Visvanathan, Virat Gandhi, V. Kamakoti","doi":"10.1109/ASQED.2013.6643572","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643572","url":null,"abstract":"With increasing computing power in mobile devices, conserving battery power (or extending battery life) has become crucial. This together with the fact that most applications running on these mobile devices are increasingly error tolerant, has created immense interest in stochastic (or inexact) computing. In this paper, we present a framework wherein, the devices can operate at varying error tolerant modes while significantly reducing the power dissipated. Further, in very deep sub-micron technologies, temperature has a crucial role in both performance and power. The proposed framework presents a novel layered synthesis optimization coupled with temperature aware supply and body bias voltage scaling to operate the design at various “tunable” error tolerant modes. We implement the proposed technique on a H.264 decoder block in industrial 28nm low leakage technology node, and demonstrate reductions in total power varying from 30% to 45%, while changing the operating mode from exact computing to inaccurate/error-tolerant computing.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131513824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Implementation of a physical unclonable function (PUF) with transmission line crosstalk in a chip 在芯片中实现具有传输线串扰的物理不可克隆功能
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-10-24 DOI: 10.1109/ASQED.2013.6643594
Kyoungrok Cho, Kwan-hee Lee, Seung-Yul Kim, Sang-Jin Lee, Younggap You
{"title":"Implementation of a physical unclonable function (PUF) with transmission line crosstalk in a chip","authors":"Kyoungrok Cho, Kwan-hee Lee, Seung-Yul Kim, Sang-Jin Lee, Younggap You","doi":"10.1109/ASQED.2013.6643594","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643594","url":null,"abstract":"A physically unclonable function (PUF) is a promising technology that provides the ability to identify network components. Conventional PUF circuitry suffers from a reliability problem in which a consistent output value is not guaranteed because of environmental changes such as the power supply voltage and operating temperature. This paper introduces a PUF circuit that yields consistent responses that overcome fluctuations in the operating conditions. The proposed PUF is based on the variation in the crosstalk between adjacent transmission lines, which reflects the random physical structure of interconnected lines. The proposed PUF cell comprises three transmission lines and a sense amplifier. The sense amplifier catches the crosstalk differences between two adjacent transmission lines. The crosstalk differences reflect a physical structure variation, which is immune to changes in the operating environment. The proposed PUF circuit yields a well-balanced distribution probability, (100/2n)%, for each challenge bit with σ = 1%. The identification generated by the PUF can be regarded as core functionality for authentication and encryption in security applications.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"263 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123100786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A coverage driven test generation methodology using consistency algorithm 使用一致性算法的覆盖驱动测试生成方法
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-10-24 DOI: 10.1109/ASQED.2013.6643559
M. P. J. George, O. Mohamed
{"title":"A coverage driven test generation methodology using consistency algorithm","authors":"M. P. J. George, O. Mohamed","doi":"10.1109/ASQED.2013.6643559","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643559","url":null,"abstract":"Coverage is a metric used to obtain information about execution of hardware description language (HDL) statements. Coverage helps to determine how well the input stimulus verifies the design under verification. Coverage directed test generation (CDTG) techniques analyze coverage results and adapt the input stimuli (for verification) generation process to improve the coverage. One of the important components of CDTG technique is the constraint solver. The CDTG constraint solvers require large amount of memory and time to generate solution. To overcome these limitations we propose a methodology based on consistency algorithm to attain faster coverage. In order to demonstrate the practical effectiveness of the methodology, we used it to test some benchmark constraint satisfaction problems (CSPs) and Xbar switch. The results show an increase in coverage along with a reduction in time required to generate the test cases.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114199581","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Innovative solutions for Package on Package test 创新的包装测试解决方案
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-10-24 DOI: 10.1109/ASQED.2013.6643580
Chin Chien Tee, Siang Soh
{"title":"Innovative solutions for Package on Package test","authors":"Chin Chien Tee, Siang Soh","doi":"10.1109/ASQED.2013.6643580","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643580","url":null,"abstract":"Package on Package (PoP) structures are an enabling technology for mobile devices, but they present unusual challenges in final test. Since the packaging technology is 3D, the test contactor must also take a multi-dimensional approach to the package. In final test applications a fairly standardized approach to the situation has been developed; while significant engineering challenges exist, methods for solving them are well known to top-tier socket manufacturers. System level and engineering characterization applications present much more diverse requirements, and require dynamic innovation in socketing. This paper describes the unusual requirements of contactors for final, system-level, and engineering characterization test in detail, and presents innovative solutions for resolving them.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125555205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On using IEEE 1500 standard for functional testing 关于使用IEEE 1500标准进行功能测试
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-10-24 DOI: 10.1109/ASQED.2013.6643561
Ghazanfar Ali, F. Hussin, N. Ali, N. H. Hamid
{"title":"On using IEEE 1500 standard for functional testing","authors":"Ghazanfar Ali, F. Hussin, N. Ali, N. H. Hamid","doi":"10.1109/ASQED.2013.6643561","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643561","url":null,"abstract":"In core based design (i.e. System on Chip) testing, IEEE 1500 standard has become a widely used option because of its completeness and easy to use approach, but this standard is only supported in the test mode as it stays transparent in the functional mode. In this paper, a proposed method to enhance the IEEE 1500 standard for functional testing in order to increase observability during functional test is discussed. As a case study, the proposed enhanced IEEE 1500 standard is implemented and validated on SAYEH processor in order to test it using embedded Software Based Self-Testing (SBST) technique. The case study demonstrated that the modification to the IEEE 1500 standard enables it to be used for functional testing, with increased observability.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115211500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Heat transfer in high-power LED with thermally conductive particle-filled epoxy composite as thermal interface material for system-level analysis 以导热颗粒填充环氧复合材料为热界面材料的大功率LED传热系统级分析
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-08-01 DOI: 10.1109/ASQED.2013.6643610
P. Anithambigai, S. Shanmugan, D. Mutharasu, K. Ibrahim
{"title":"Heat transfer in high-power LED with thermally conductive particle-filled epoxy composite as thermal interface material for system-level analysis","authors":"P. Anithambigai, S. Shanmugan, D. Mutharasu, K. Ibrahim","doi":"10.1109/ASQED.2013.6643610","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643610","url":null,"abstract":"This paper elucidates the thermal behaviour of an LED employing different particles filled epoxy as thermal interface material (TIM) for enhanced heat dissipation. Highly thermal conductive metal filler of aluminium (Al) and ceramic fillers of aluminium nitride (AlN) and aluminium oxide (Al2O3) were incorporated in bisphenol A diglycidylether (DGEBA) epoxy resin to identify the effect of the filler materials as TIM on the thermal performance of high power LEDs. From the thermal transient analysis of a 3W warm white LED, it was observed that the Al filled composite exhibits the lowest junction temperature of 38.3 °C compared to the other two fillers. The total thermal resistance of the package with AlN filled composite and Al2O3 filled composite were 13.77 and 15.50K/W respectively. This paper too suggests that the total thermal resistance of the LED package increases when the particle size of the fillers decrease.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132946075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Logic emulation with forced assertions: A methodology for rapid functional verification and debug 带有强制断言的逻辑仿真:一种用于快速功能验证和调试的方法
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013) Pub Date : 2013-08-01 DOI: 10.1109/ASQED.2013.6643605
Somnath Banerjee, T. Gupta, Sanjay Gupta
{"title":"Logic emulation with forced assertions: A methodology for rapid functional verification and debug","authors":"Somnath Banerjee, T. Gupta, Sanjay Gupta","doi":"10.1109/ASQED.2013.6643605","DOIUrl":"https://doi.org/10.1109/ASQED.2013.6643605","url":null,"abstract":"To improve debugging turnaround time of complex System-on-chip (SoC) designs on FPGA based logic emulation systems, it is important to minimize the iterations through design recompilation or FPGA reconfiguration process for validating repeated debugging changes. This paper presents a methodology for modeling debugging changes in terms of standalone assertion statements and evaluating their effect by running emulation without requiring any design modification or recompilation step, during emulation based debug. The set of assertions representing debugging changes are transformed into a set of constraints that are directly programmed into the emulator and an associated logic analyzer. When emulation is resumed from a bug-free state, these constraints are enforced by automatically forcing necessary signals to desired values, according to the specified assertions. Multiple debugging changes can thus be verified before eventually porting the fixes to design RTL followed by recompilation and emulation rerun. The proposed methodology also facilitates block based SoC development, by allowing a designer to enforce the correct functional behavior of some other block whose output affects the behavior of the block he is working on. Application of the proposed debugging system to debugging of real industry standard designs has been seen to reduce debugging turn-around time significantly.","PeriodicalId":198881,"journal":{"name":"Fifth Asia Symposium on Quality Electronic Design (ASQED 2013)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124871152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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