Materials Science in Semiconductor Processing最新文献

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New insights into I-line stepper based InGaAs/InP double-heterojunction bipolar transistors (DHBTs) 基于i线步进的InGaAs/InP双异质结双极晶体管(dhbt)的新见解
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-17 DOI: 10.1016/j.mssp.2025.110076
Soo Cheol Kang , Jin Chul Cho , Jun-Hwan Shin , Dong Woo Park , Eui Su Lee
{"title":"New insights into I-line stepper based InGaAs/InP double-heterojunction bipolar transistors (DHBTs)","authors":"Soo Cheol Kang ,&nbsp;Jin Chul Cho ,&nbsp;Jun-Hwan Shin ,&nbsp;Dong Woo Park ,&nbsp;Eui Su Lee","doi":"10.1016/j.mssp.2025.110076","DOIUrl":"10.1016/j.mssp.2025.110076","url":null,"abstract":"<div><div>InGaAs/InP double heterojunction bipolar transistors (DHBTs) are considered promising candidates for high-frequency power amplifier applications in wireless communication, aerospace, and radar systems. Although emitter scaling is essential to enhance the cut-off frequency (<em>f</em><sub><em>T</em></sub>), the conventional use of electron beam lithography increases process complexity, production cost and reliability issues. As a cost-effective and yield-improving alternative, I-line stepper photolithography has recently regained attention. In this study, an InGaAs/InP DHBT with an emitter width (<em>W</em><sub><em>E</em></sub>) of 1 μm, an emitter length (<em>L</em><sub><em>E</em></sub>) of 10 μm and a base width (<em>W</em><sub><em>B</em></sub>) of 0.5 μm was fabricated using I-line stepper photolithography. By employing optimized epitaxial layers and Ohmic contact formation process, the device exhibits a current gain (<em>β</em>) of 40.7 at <em>V</em><sub><em>CE</em></sub> = 0 V and an open-base common-emitter breakdown voltage (<em>BV</em><sub><em>CEO</em></sub>) of 5.1 V at <em>J</em><sub><em>C</em></sub> = 1 kA/cm<sup>2</sup>. The fabricated InP DHBTs with <em>W</em><sub><em>E</em></sub> = 1 μm demonstrate an <em>f</em><sub><em>T</em></sub> = 262 GHz, indicating potential for applications in ICs operating data rates up to 80 Gbit/s ICs.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110076"},"PeriodicalIF":4.6,"publicationDate":"2025-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145106542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Metal oxide-modified Janus HfSSe monolayers for SF6 decomposition gas detection: A DFT investigation 用于SF6分解气体检测的金属氧化物修饰Janus HfSSe单层膜:DFT研究
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-17 DOI: 10.1016/j.mssp.2025.110055
Min Huang , Hao Cui , Xin He , Hang Zhao , Zhiming Shi , Mingjin Yang
{"title":"Metal oxide-modified Janus HfSSe monolayers for SF6 decomposition gas detection: A DFT investigation","authors":"Min Huang ,&nbsp;Hao Cui ,&nbsp;Xin He ,&nbsp;Hang Zhao ,&nbsp;Zhiming Shi ,&nbsp;Mingjin Yang","doi":"10.1016/j.mssp.2025.110055","DOIUrl":"10.1016/j.mssp.2025.110055","url":null,"abstract":"<div><div>Accurate detection of gases in gas-insulated switchgear (GIS) is essential for maintaining the safe and stable operation of power systems. Density functional theory (DFT) was employed to investigate the adsorption behavior of typical SF<sub>6</sub> decomposition gases (H<sub>2</sub>S, SO<sub>2</sub>, SOF<sub>2</sub>, and SO<sub>2</sub>F<sub>2</sub>) on NiO-, ZnO-, and Ag<sub>2</sub>O-modified Janus HfSSe monolayers. All three metal oxides preferentially bind to sulfur sites on the HfSSe surface, forming energetically stable configurations. These modifications significantly enhance the monolayer's conductivity, yielding reduced band gaps of 0.45 eV (NiO), 0.42 eV (ZnO), and 0.37 eV (Ag<sub>2</sub>O), while simultaneously improving sensitivity and selectivity toward the target gases. At room temperature (298 K), NiO-HfSSe exhibits favorable desorption times for H<sub>2</sub>S (6.38 s), SO<sub>2</sub> (2.95 s), and SOF<sub>2</sub> (0.03 s), whereas ZnO- and Ag<sub>2</sub>O-HfSSe show optimal desorption for SO<sub>2</sub> at 0.58 s and 15.67 s, respectively. Combined with short recovery times and significant band gap modulation, NiO-, ZnO-, and Ag<sub>2</sub>O-modified HfSSe monolayers demonstrate strong potential as reusable, room-temperature gas sensors. This study provides theoretical insight into the application of these modified monolayers for evaluating the insulation status of GIS equipment, laying the groundwork for future experimental validation and optimization of monolayer-based sensors in practical GIS monitoring applications.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110055"},"PeriodicalIF":4.6,"publicationDate":"2025-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145106541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A high-sensitivity terahertz SPR biosensor with machine learning optimization for colorectal cancer detection 基于机器学习优化的高灵敏度太赫兹SPR生物传感器用于结直肠癌检测
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-16 DOI: 10.1016/j.mssp.2025.110064
Jacob Wekalao , Ahmed Mehaney , May Bin-Jumah , Nassir Saad Alarifi , Mostafa R. Abukhadra , Hussein A. Elsayed , Amuthakkannan Rajakannu , K. Vijayalakshmi
{"title":"A high-sensitivity terahertz SPR biosensor with machine learning optimization for colorectal cancer detection","authors":"Jacob Wekalao ,&nbsp;Ahmed Mehaney ,&nbsp;May Bin-Jumah ,&nbsp;Nassir Saad Alarifi ,&nbsp;Mostafa R. Abukhadra ,&nbsp;Hussein A. Elsayed ,&nbsp;Amuthakkannan Rajakannu ,&nbsp;K. Vijayalakshmi","doi":"10.1016/j.mssp.2025.110064","DOIUrl":"10.1016/j.mssp.2025.110064","url":null,"abstract":"<div><div>This study presents a terahertz-based surface plasmon resonance (SPR) sensor developed for colorectal cancer detection. The device employs a distinctive multi-resonator design that integrates gold, silver, and graphene. Structurally, the sensor comprises an elliptical ring resonator coated with silver, surrounded by a gold-coated circular ring on a silicon dioxide substrate, while a graphene layer is incorporated to enhance sensing performance. Performance analysis was conducted using COMSOL Multiphysics simulations under varying conditions, including graphene chemical potential, incident angles, and resonator dimensions. The proposed sensor demonstrated a maximum sensitivity of 1100 GHz/RIU across a refractive index range of 1.329–1.348 RIU, achieving an optimal figure of merit of 17.460 RIU<sup>−1</sup> at 0.719 THz. Additionally, a Random Forest Regression model was used to optimize sensor parameters, achieving up to 100 % accuracy in predicting sensor responses. The device also demonstrated potential as a 2-bit binary encoder, highlighting its versatility for both biosensing and data encoding applications.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110064"},"PeriodicalIF":4.6,"publicationDate":"2025-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145106539","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fe3O4@PEG/Ag nanocomposite with improved HER activity for Raman and upconversion spectroscopy-based dual-mode enhancer Fe3O4@PEG/Ag纳米复合材料与提高HER活性的拉曼和上转换光谱为基础的双模增强
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-16 DOI: 10.1016/j.mssp.2025.110069
Abhishek Kumar Soni, Najeena K S, Kirti
{"title":"Fe3O4@PEG/Ag nanocomposite with improved HER activity for Raman and upconversion spectroscopy-based dual-mode enhancer","authors":"Abhishek Kumar Soni,&nbsp;Najeena K S,&nbsp;Kirti","doi":"10.1016/j.mssp.2025.110069","DOIUrl":"10.1016/j.mssp.2025.110069","url":null,"abstract":"<div><div>Raman and upconversion spectroscopy signals are inherently weak due to scattering and nonlinear optical effects. To enhance Raman and upconversion spectroscopy signals, silver (Ag) incorporated nanocomposites are currently in demand due to their better synergistic enhancement strategies through surface plasmon resonance (SPR). Fe<sub>3</sub>O<sub>4</sub>@PEG/Ag nanocomposite has been synthesized and characterized by using X-ray diffraction (XRD), Fourier Transform Infrared Spectroscopy (FTIR), UV–visible, Field Emission Scanning Electron Microscopy (FESEM), Energy dispersive X-ray spectroscopy (EDS), Zeta potential, Fluorescence microscopy, and Raman spectroscopy. Fe<sub>3</sub>O<sub>4</sub>@PEG/Ag nanocomposite-based substrate shows dual-mode Raman and upconversion enhancer capability by probing RhB and Er<sub>2</sub>O<sub>3</sub>, respectively. Raman enhancer study has been done by monitoring the RhB characteristic peak at ∼1660 cm<sup>−1</sup> and explained on the basis of surface-enhanced Raman scattering (SERS) under a 532 nm green laser irradiation. Whereas, in the upconversion emission study, an improved Er<sup>3+</sup> ion transition is detected under 980 nm NIR laser diode excitation via multiphoton absorption. Interestingly, amplification of the signal intensity has been achieved, as SERS with low fluorescence background under green laser excitation and improved upconversion arise from the nonlinear optical effects due to the interaction of 980 nm NIR laser photons with the surface plasmon resonance of Ag ions available in the Fe<sub>3</sub>O<sub>4</sub>@PEG/Ag nanocomposite. Improved HER activity of Fe<sub>3</sub>O<sub>4</sub>@PEG/Ag with a lower overpotential value (230 mV) as compared to Fe<sub>3</sub>O<sub>4</sub> has been obtained by electrocatalytic performance. Experimental studies carried out in this work show that the synthesized Fe<sub>3</sub>O<sub>4</sub>@PEG/Ag nanocomposite with improved HER activity may be suitable for next-generation Raman and upconversion spectroscopy-based dual-mode enhancer.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110069"},"PeriodicalIF":4.6,"publicationDate":"2025-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145107129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study on substitutional doped GaSe monolayers using hybrid functional: Electronic, optoelectronic, and photocatalytic applications 基于杂化功能的取代掺杂GaSe单层膜的研究:电子、光电和光催化应用
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-16 DOI: 10.1016/j.mssp.2025.110068
Mohamed M. Fadlallah , Safwat Abdel-Azeim
{"title":"Study on substitutional doped GaSe monolayers using hybrid functional: Electronic, optoelectronic, and photocatalytic applications","authors":"Mohamed M. Fadlallah ,&nbsp;Safwat Abdel-Azeim","doi":"10.1016/j.mssp.2025.110068","DOIUrl":"10.1016/j.mssp.2025.110068","url":null,"abstract":"<div><div>GaSe monolayer suffers in electronic and photocatalytic applications due to its large bandgap (3.50 eV). In this study, we employed the hybrid density functional, the Heyd-Scuseria-Ernzerhof hybrid (HSE), to explore the effect of substitutional metal single doping (M = Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ge, As, In, Sn, Sb) at the Ga-site on the structural stability, electronic, magnetic, optical, and photocatalytic properties. Our findings indicate that the bond lengths M-Ga/Se increase as the atomic radius of the dopant increases. Most of the doped structures are found to be thermodynamically stable. The introduction of metal and non-metal dopants significantly alters the magnetic properties of GaSe nanosheets, with dopings of Ti, V, Cr, Mn, Fe, Ni, and Co, as well as Zn, resulting in diluted magnetic semiconductors. In contrast, dopings with Sc, Cu, As, In, and Sb maintained semiconductor characteristics. The As- and Sb-doping resulted in the narrowest bandgap of 2.1 eV, while Ge- and Sn-doped GaSe monolayers revealed promise for two-dimensional spintronic applications. Although most dopants enhanced visible-light absorption, many proved unsuitable for photocatalysis due to the created mid-gap states and unfavorable valence band edges. The study showed that V-doped GaSe monolayer is a promising two-dimensional material for photocatalytic water-splitting and CO<sub>2</sub> reduction under visible light, making it a potential material for clean fuel production.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110068"},"PeriodicalIF":4.6,"publicationDate":"2025-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145106540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Deep-reactive-ion-etching in X-ray grating fabrication: a review 深反应刻蚀在x射线光栅制造中的研究进展
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-15 DOI: 10.1016/j.mssp.2025.110041
Zhitian Shi , Konstantins Jefimovs , Joan Vila-Comamala , Alexandre Pereira , Daniel Josell , Marco Stampanoni , Lucia Romano
{"title":"Deep-reactive-ion-etching in X-ray grating fabrication: a review","authors":"Zhitian Shi ,&nbsp;Konstantins Jefimovs ,&nbsp;Joan Vila-Comamala ,&nbsp;Alexandre Pereira ,&nbsp;Daniel Josell ,&nbsp;Marco Stampanoni ,&nbsp;Lucia Romano","doi":"10.1016/j.mssp.2025.110041","DOIUrl":"10.1016/j.mssp.2025.110041","url":null,"abstract":"<div><div>The development of grating fabrication shares its journey with the development of X-ray phase contrast imaging. Indeed, the fabrication of gratings with features of sufficiently high aspect ratio is one of the bottlenecks preventing the widespread application of phase contrast imaging in X-ray diagnostics, material science and security. The silicon platform that underlies modern manufacture of integrated circuits, with its well-established technologies for lithography, etching and metal deposition, has the potential to provide high yields and volumes for industrial fabrication of both phase and absorption gratings used in a grating-based X-ray imaging systems. This review article introduces recent developments in the fabrication of high aspect ratio X-ray gratings using ubiquitous clean-room manufacturing tools, focusing on deep reactive ion etching processes. It summarizes the most challenging issues for fabricating features with aspect ratios reaching 70:1, proposing approaches to overcome processing problems and improve product quality.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110041"},"PeriodicalIF":4.6,"publicationDate":"2025-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145060290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Molecular engineering of acetylenic dithieno[3,2-b:2′,3′-d]thiophene derivatives for organic field-effect transistors [3,2-b:2 ',3 ' -d]噻吩衍生物在有机场效应晶体管中的分子工程
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-15 DOI: 10.1016/j.mssp.2025.110051
Junyeop Yoo , EunJeong Lee , Sejoong Kim , Ming-Chou Chen , Choongik Kim , SungYong Seo
{"title":"Molecular engineering of acetylenic dithieno[3,2-b:2′,3′-d]thiophene derivatives for organic field-effect transistors","authors":"Junyeop Yoo ,&nbsp;EunJeong Lee ,&nbsp;Sejoong Kim ,&nbsp;Ming-Chou Chen ,&nbsp;Choongik Kim ,&nbsp;SungYong Seo","doi":"10.1016/j.mssp.2025.110051","DOIUrl":"10.1016/j.mssp.2025.110051","url":null,"abstract":"<div><div>In this study, we report a series of dithieno[3,2-b:2′,3′-d]thiophene (DTT)-based small molecules featuring five different end-capping substituents: 2-octyl-6-(5-(phenylethynyl)thiophen-2-yl)dithieno[3,2-b:2′,3′-d]thiophene (compound <strong>1</strong>), triisopropyl((5-(6-octyldithieno[3,2-b:2′,3′-d]thiophen-2-yl)thiophen-2-yl)ethynyl)silane (compound <strong>2</strong>), 2-octyl-6-(5-(thiophen-2-ylethynyl)thiophen-2-yl)dithieno[3,2-b:2′,3′-d]thiophene (compound <strong>3</strong>), 2-octyl-6-(5-((5-octylthiophen-2-yl)ethynyl)thiophen-2-yl)dithieno[3,2-b:2′,3′-d]thiophene (compound <strong>4</strong>), and 2-(5-((5-(2-ethylhexyl)thiophen-2-yl)ethynyl)thiophen-2-yl)-6-octyldithieno[3,2-b:2′,3′-d]thiophene (compound <strong>5</strong>). To enhance solubility, one-sided linear octyl chain was introduced on the DTT core, while extended π-conjugation was achieved through the incorporation of additional thiophene rings and acetylenic linkages to promote effective charge transport. The thermal stability, optical absorption, and redox characteristics of the synthesized molecules were studied via thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), UV–vis spectroscopy, and cyclic voltammetry (CV). The DTT thin films formed via solution shearing were characterized by atomic force microscopy (AFM) and X-ray diffraction (XRD) to examine surface topology and molecular arrangement. When implemented as active materials in organic field-effect transistors (OFETs), all five compounds displayed p-type semiconducting behavior. Among them, compound <strong>3</strong>, which possesses a thienyl terminal group without bulky alkyl side chains, exhibited the most favorable charge transport characteristics under ambient atmosphere, attaining a carrier mobility of 0.036 cm<sup>2</sup> V<sup>−1</sup> s<sup>−1</sup> and an on/off current ratio above 10<sup>6</sup>. These observations underscore the importance of rational side-chain modification in optimizing molecular assembly and film crystallinity to enhance OFET performance.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110051"},"PeriodicalIF":4.6,"publicationDate":"2025-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145060295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Boosted photoelectrochemical water splitting activity by construction of a novel FeVO4/AgVO3 p-n heterostructure 通过构建新型FeVO4/AgVO3 p-n异质结构提高光电化学水分解活性
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-15 DOI: 10.1016/j.mssp.2025.110023
Hong Tian , Yumin Li , Qingping Dai , Shunlang Wei , Bing Lv , Jun Wei , Yupei Qiao
{"title":"Boosted photoelectrochemical water splitting activity by construction of a novel FeVO4/AgVO3 p-n heterostructure","authors":"Hong Tian ,&nbsp;Yumin Li ,&nbsp;Qingping Dai ,&nbsp;Shunlang Wei ,&nbsp;Bing Lv ,&nbsp;Jun Wei ,&nbsp;Yupei Qiao","doi":"10.1016/j.mssp.2025.110023","DOIUrl":"10.1016/j.mssp.2025.110023","url":null,"abstract":"<div><div>FeVO<sub>4</sub> is recognized as a potential photoelectrode material on account of its relatively narrow bandgap and suitable conduction and valence band positions. However, its photoelectrochemical water splitting performance remains unsatisfactory owing to rapid carrier recombination and poor charge transport capabilities. Herein, a novel p-n FeVO<sub>4</sub>/AgVO<sub>3</sub> heterostructure photoanode was developed by depositing p-type AgVO<sub>3</sub> nanowires onto n-type FeVO<sub>4</sub> nanoporous structures, boosting the PEC properties of the base material. The incorporated AgVO<sub>3</sub> nanostructures enhance light absorption in the visible spectrum, facilitate effective electron-hole separation through optimized interfacial charge transport pathways, and simultaneously extend the carrier lifetime. The built-in electric field in the p-n heterostructure promotes more effective separation and directional motion of photoinduced charge carriers. As a result, the transient photocurrent density of the FeVO<sub>4</sub>/AgVO<sub>3</sub> heterojunction photoanode reaches 0.22 mA cm<sup>−2</sup>, which is 3.35 times that of bare FeVO<sub>4</sub> (0.06 mA cm<sup>−2</sup>). Notably, the incorporation of AgVO<sub>3</sub> nanowires significantly improves the photostability of the FeVO<sub>4</sub> photoanode. This work provides a feasible strategy from the perspective of interface engineering for designing high-performance FeVO<sub>4</sub>-based photoelectrodes to enhance photoconversion efficiency.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110023"},"PeriodicalIF":4.6,"publicationDate":"2025-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145060291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal-moisture interaction effects on delamination reliability of advanced fan-out packages 热-湿相互作用对先进扇出封装分层可靠性的影响
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-15 DOI: 10.1016/j.mssp.2025.110037
Meng-Kai Shih , Yi-Hao Chen , Bo-Rui Ding , Chin-Ju Hsieh , I-Hung Lin , Tom Ni
{"title":"Thermal-moisture interaction effects on delamination reliability of advanced fan-out packages","authors":"Meng-Kai Shih ,&nbsp;Yi-Hao Chen ,&nbsp;Bo-Rui Ding ,&nbsp;Chin-Ju Hsieh ,&nbsp;I-Hung Lin ,&nbsp;Tom Ni","doi":"10.1016/j.mssp.2025.110037","DOIUrl":"10.1016/j.mssp.2025.110037","url":null,"abstract":"<div><div>—Fan-out (FO) packages are critical for achieving high I/O density and miniaturization in advanced electronic products. However, their complex material interfaces and exposure to harsh hygrothermal conditions pose significant reliability concerns, particularly interfacial delamination. Accordingly, this study experimentally evaluated the interfacial adhesion at the polyimide (PI)/copper interface of a typical FO package following moisture exposure, using double cantilever beam (DCB) tests to determine the critical strain energy release rate GC. In addition, a comprehensive three-dimensional finite element (FE) model accounting for the effects of moisture diffusion, thermal loading, and mechanical stress was developed to simulate the hygrothermal behavior of the package. The model was validated by comparing the simulated results for the package warpage with the experimental measurements. The virtual crack closure technique (VCCT) was then applied to further analyze the delamination behavior of the FO package at the critical interfaces under combined hygrothermal loading. Finally, the Taguchi method was employed to evaluate the effects of the key structural design parameters of the FO package, such as the PI thickness and epoxy molding compound (EMC) material, on the strain energy release rate (GI) and to identify the optimal package configuration. The results showed that increasing the PI thickness and using an EMC with a compatible coefficient of thermal expansion significantly reduced GI and thus mitigated the risk of delamination. The findings presented in this study offer practical design guidance for enhancing the mechanical reliability of FO packages in humid and thermally demanding environments.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110037"},"PeriodicalIF":4.6,"publicationDate":"2025-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145060293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dual-stage temporal laser stealth dicing of silicon carbide wafers with continuous crack propagation 具有连续裂纹扩展的碳化硅晶圆双级瞬态激光隐形切割
IF 4.6 3区 工程技术
Materials Science in Semiconductor Processing Pub Date : 2025-09-15 DOI: 10.1016/j.mssp.2025.110067
Jie Li , Bo Liu , Yi Zhang
{"title":"Dual-stage temporal laser stealth dicing of silicon carbide wafers with continuous crack propagation","authors":"Jie Li ,&nbsp;Bo Liu ,&nbsp;Yi Zhang","doi":"10.1016/j.mssp.2025.110067","DOIUrl":"10.1016/j.mssp.2025.110067","url":null,"abstract":"<div><div>To address the difficulty of simultaneously regulating surface chipping damage and surface heat accumulation damage in laser stealth cutting (LSD) of silicon carbide (SiC) wafers, a novel dual-stage temporal laser stealth dicing (DLSD) method is proposed in this work. This method employs a two-stage laser process: first, a low-power modifying laser generates pre-modified SiC layers, followed by a high-power-inducing laser that promotes continuous crack propagation. Compared with traditional LSD methods, the DLSD method can achieve continuous propagation of induced cracks, thereby reducing surface chipping damage, without causing thermal accumulation damage on the surface, further improving wafer cutting quality. The mechanism of continuous crack propagation induced by the DLSD method is analyzed in detail. The pre-modified layer of amorphous SiC generated by the modifying laser enhances the absorption of the inducing laser, resulting in an increase in the length of the modified layer and promoting continuous crack propagation. The influence of inducing laser power and scanning speed on cutting quality is also thoroughly investigated. Results show that increasing the inducing laser power and scanning speed improves the length of the modified layer and induces continuous crack propagation. Specifically, when the modified laser power is 0.14 W, the induced laser power is 0.18 W, and the scanning speed is 800 mm/s, the maximum chipping width and sidewall surface roughness reach their minimum values of 6.0 μm and 1.15 μm, respectively.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110067"},"PeriodicalIF":4.6,"publicationDate":"2025-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145060294","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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