{"title":"纳米压痕诱导电化学刻蚀制备锥形凹坑","authors":"Wang He, Tingting Chen, Xuancheng Zhu, Yanlin Jiang, Jianliang Wang, Linmao Qian, Bingjun Yu","doi":"10.1016/j.mssp.2025.109682","DOIUrl":null,"url":null,"abstract":"<div><div>Conical micro-pits are of significant importance in a wide range of advanced applications, including space exploration, surveillance systems, biomedical engineering, earth science research, defense technologies, and material processing. However, the fabrication methods of conical micro-pits still need to be further investigated to meet the increasing demand for advanced optics. Nanoindentation combined with electrochemical etching demonstrates powerful ability in micro-pits manufacturing; however, the underlying mechanisms of this method remain unclear, which hinders further development of the fabrication for micro-pits. This study develops a controllable fabrication strategy for conical micro-pits via synergistic nanoindentation and electrochemical etching. Key findings reveal that nanoindentation-induced crystal damage zones act as preferential initiation sites for electrochemical etching, enabling precise control of micro-pit dimensions by tuning mechanical parameters (normal load, cycle number) and electrochemical conditions (voltage, time). This method achieves independent regulation of conical pit diameter and depth, overcoming the limitations of conventional single-mechanism methods. Integrated with PDMS nanoimprinting, the process enables high-fidelity and rapid replication of conical pist arrays on polymer surfaces.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"197 ","pages":"Article 109682"},"PeriodicalIF":4.2000,"publicationDate":"2025-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fabrication of conical pits via nanoindentation-induced electrochemical etching\",\"authors\":\"Wang He, Tingting Chen, Xuancheng Zhu, Yanlin Jiang, Jianliang Wang, Linmao Qian, Bingjun Yu\",\"doi\":\"10.1016/j.mssp.2025.109682\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Conical micro-pits are of significant importance in a wide range of advanced applications, including space exploration, surveillance systems, biomedical engineering, earth science research, defense technologies, and material processing. However, the fabrication methods of conical micro-pits still need to be further investigated to meet the increasing demand for advanced optics. Nanoindentation combined with electrochemical etching demonstrates powerful ability in micro-pits manufacturing; however, the underlying mechanisms of this method remain unclear, which hinders further development of the fabrication for micro-pits. This study develops a controllable fabrication strategy for conical micro-pits via synergistic nanoindentation and electrochemical etching. Key findings reveal that nanoindentation-induced crystal damage zones act as preferential initiation sites for electrochemical etching, enabling precise control of micro-pit dimensions by tuning mechanical parameters (normal load, cycle number) and electrochemical conditions (voltage, time). This method achieves independent regulation of conical pit diameter and depth, overcoming the limitations of conventional single-mechanism methods. Integrated with PDMS nanoimprinting, the process enables high-fidelity and rapid replication of conical pist arrays on polymer surfaces.</div></div>\",\"PeriodicalId\":18240,\"journal\":{\"name\":\"Materials Science in Semiconductor Processing\",\"volume\":\"197 \",\"pages\":\"Article 109682\"},\"PeriodicalIF\":4.2000,\"publicationDate\":\"2025-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science in Semiconductor Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1369800125004196\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125004196","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Fabrication of conical pits via nanoindentation-induced electrochemical etching
Conical micro-pits are of significant importance in a wide range of advanced applications, including space exploration, surveillance systems, biomedical engineering, earth science research, defense technologies, and material processing. However, the fabrication methods of conical micro-pits still need to be further investigated to meet the increasing demand for advanced optics. Nanoindentation combined with electrochemical etching demonstrates powerful ability in micro-pits manufacturing; however, the underlying mechanisms of this method remain unclear, which hinders further development of the fabrication for micro-pits. This study develops a controllable fabrication strategy for conical micro-pits via synergistic nanoindentation and electrochemical etching. Key findings reveal that nanoindentation-induced crystal damage zones act as preferential initiation sites for electrochemical etching, enabling precise control of micro-pit dimensions by tuning mechanical parameters (normal load, cycle number) and electrochemical conditions (voltage, time). This method achieves independent regulation of conical pit diameter and depth, overcoming the limitations of conventional single-mechanism methods. Integrated with PDMS nanoimprinting, the process enables high-fidelity and rapid replication of conical pist arrays on polymer surfaces.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.