Materials Science in Semiconductor Processing

SCI期刊
Materials Science in Semiconductor Processing
中文名称:
半导体加工中的材料科学
期刊缩写:
Mater. Sci. Semicond. Process.
影响因子:
4.2
ISSN:
print: 1369-8001
研究领域:
工程技术-材料科学:综合
h-index:
49
自引率:
4.90%
Gold OA文章占比:
5.21%
原创研究文献占比:
97.45%
SCI收录类型:
Science Citation Index Expanded (SCIE) || Scopus (CiteScore)
期刊介绍英文:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
期刊介绍中文:
《半导体加工中的材料科学》为讨论用于(光)电子学、传感器、探测器、生物技术和绿色能源的功能材料和器件的新型加工、应用和理论研究提供了一个独特的论坛。 每一期的目标是简要介绍微电子学、能量转换和存储、通信、生物技术、(光)催化、纳米和薄膜技术、混合和复合材料、化学加工、气相沉积、器件制造和建模等不同领域的当前见解、新成就、突破和未来趋势,这些都是先进半导体加工和应用的支柱。
CiteScore:
CiteScoreSJRSNIPCiteScore排名
8.00.7320.992
学科
排名
百分位
大类:Engineering
小类:Mechanical Engineering
87 / 672
87%
大类:Physics and Astronomy
小类:Condensed Matter Physics
59 / 434
86%
大类:Engineering
小类:Mechanics of Materials
60 / 398
85%
大类:Materials Science
小类:General Materials Science
100 / 463
78%
发文信息
中科院SCI期刊分区
大类 小类 TOP期刊 综述期刊
3区 工程技术
3区 工程:电子与电气 ENGINEERING, ELECTRICAL & ELECTRONIC
3区 材料科学:综合 MATERIALS SCIENCE, MULTIDISCIPLINARY
3区 物理:应用 PHYSICS, APPLIED
3区 物理:凝聚态物理 PHYSICS, CONDENSED MATTER
WOS期刊分区
学科分类
Q2ENGINEERING, ELECTRICAL & ELECTRONIC
Q2MATERIALS SCIENCE, MULTIDISCIPLINARY
Q2PHYSICS, APPLIED
Q2PHYSICS, CONDENSED MATTER
历年影响因子
2015年2.2640
2016年2.3590
2017年2.5930
2018年2.7220
2019年3.0850
2020年3.9270
2021年4.6440
2022年4.1000
2023年4.2000
历年发表
2012年110
2013年313
2014年521
2015年756
2016年536
2017年603
2018年429
2019年490
2020年527
2021年737
2022年780
投稿信息
出版周期:
Bimonthly
出版语言:
English
出版国家(地区):
ENGLAND
接受率:
24%
初审时长:
17 days
审稿时长:
42 days
发表时长:
11 days
出版商:
Elsevier Ltd
编辑部地址:
ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB

Materials Science in Semiconductor Processing - 最新文献

Dislocations in 4H-SiC epilayers for power devices: Identification, formation, and regulation

Pub Date : 2024-11-26 DOI: 10.1016/j.mssp.2024.109147 Yifei Li , Pengxiang Hou , Shuangyuan Pan , Pin Wang , Weiwei Cheng , Jing Wang , Le Yu , Zheyang Li , Rui Jin

Electronic, optical, and magnetic properties of defect-engineered 1T-PdS2 monolayer: A first-principles investigation

Pub Date : 2024-11-26 DOI: 10.1016/j.mssp.2024.109144 Muhammad Yar Khan , Tariq Usman , Asif Ilyas , Arzoo Hassan , Umer Younis , Atta Ullah , Syed Awais Ahmad , Abdullah Al Souwaileh

The effects of α-sodium alkenesulfonate and alkylphenol polyoxyethylene ether phosphate on the inhibition of copper chemical mechanical polishing

Pub Date : 2024-11-25 DOI: 10.1016/j.mssp.2024.109145 Tongtong Zhang , Yuling Liu , Hongdong Zhao , Xiaodong Luan , Chong Luo
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