Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.最新文献_第3页

Electrodeposition of polyurethane adhesive for MEMS application 电沉积聚氨酯胶粘剂在MEMS中的应用

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432052

Yuli Wang, M. Bachman, Guann-Pyng Li

引用次数: 3

A novel measuring method of testing ITO protective coatings for use in mobile phone LCD's 一种测试手机液晶屏用ITO保护涂层的新方法

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432065

M. Raes, M. Smeets

{"title":"A novel measuring method of testing ITO protective coatings for use in mobile phone LCD's","authors":"M. Raes, M. Smeets","doi":"10.1109/ISAPM.2005.1432065","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432065","url":null,"abstract":"In liquid crystal displays (LCD's) for mobile phones various functional coatings are used. Besides optimized for the function they are applied for, these coatings need to fulfill reliability requirements. To avoid unexpected problems during lifetime, insight in the behavior of the materials is obtained using model studies. Important aspects to study are the interactions of the materials with other ambient materials and the protective function under influence of temperature and humidity. The advantage of model studies is that a specific aspect can be investigated and side effects can be excluded. More statistically sounded conclusions can be drawn and interactions, which occur at a low frequency, can be studied. An interesting aspect is the translation of the model studies to effects occurring on module level and in the application like a mobile phone. A typical example of a functional coating is a protection layer applied on the tin-doped indium oxide (ITO) tracks outside the active area of the display. Effects of humidity condensation and temperature play an important role in the functionality of the material whereas also interactions with other materials to which the protection layer is in contact are essential parameters. In this article we have investigated a new measuring method to shorten the evaluation time of the protective coatings at various ambient conditions.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"122 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116359495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Effect of underfill materials on Pb-free flip chip package reliability 底填材料对无铅倒装芯片封装可靠性的影响

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432090

Jamin Ling, Tie Wang, M. Ying, T. Tessier, I. Shim

{"title":"Effect of underfill materials on Pb-free flip chip package reliability","authors":"Jamin Ling, Tie Wang, M. Ying, T. Tessier, I. Shim","doi":"10.1109/ISAPM.2005.1432090","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432090","url":null,"abstract":"In this study, Sn/Ag/Cu Pb-free solder paste was printed and reflowed onto a thin film Al/Ni(V)/Cu under bump metallization (UBM) on a 4mm /spl times/ 5mm die and, packaged in a 5mm /spl times/ 6mm LGA (land grid array) package using four different underfill materials with a range of different material properties. The packages were then examined after 1, 3 and 6 reflow cycles in addition to various standard package reliability tests. Package level Finite Element Analysis (FEA) was also conducted to simulate the solder creep strain under various strain rates of temperature cycling (TC) or thermal shock (TS) at. In addition, SEM and concurrent Elementary Mapping were used to characterize the integrity of the UBM. The FEA results show that underfill materials with a high Tg and a low coefficient of thermal expansion (CTE) could substantially minimize the solder's maximum equivalent creep strain under cyclical stress excursions. This conclusion was in agreement with actual package level reliability results. By selecting the appropriate underfill properties, this Pb-free flip chip package has passed moisture sensitivity level (MSL-3) with 3 reflow cycles at peak temperature of 260/spl deg/C, followed by TC 1500 cycles, low temperature thermal shock (LTS) 800 /spl times/ and unbiased highly accelerated stress test (UHAST) 168h. Additional observations noted include that the Cu was nearly completely consumed after these package assembly reflows. It was also found that Ni diffused into bulk solder after the aforementioned multiple reflow cycles.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114612498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Molecular vapor deposition (MVD/spl trade/) - a new method of applying moisture barriers for packaging applications 分子气相沉积(MVD/spl trade/) -一种用于包装应用的防潮屏障的新方法

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432063

M. Wanebo, B. Kobrin, F. Helmrich, J. Chinn

引用次数: 8

Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications 用于超细间距玻璃上芯片应用的各向异性导电薄膜(ACFs)

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432074

M. Yim, Jin-Sang Hwang, K. Paik

{"title":"Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications","authors":"M. Yim, Jin-Sang Hwang, K. Paik","doi":"10.1109/ISAPM.2005.1432074","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432074","url":null,"abstract":"This paper describes the development of anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) application. In order to have reliable COG using ACF at fine pitch, the number of conductive particles trapped between the bump and substrate pad should be enough and less conductive particle between adjacent bumps. The anisotropic conductive film is double layered structure, in which ACF and NCF layer thickness is optimized, to have as many conductive particle as possible on bump after COG bonding. In ACF layer, non-conductive particles of diameter 1/5 times smaller than the conductive particles are added to prevent an electrical short between the bumps of COG assembly. The conductive particles are naturally insulated by the nonconductive particles even though conductive particles are flowed into and agglomerated in narrow gap between bumps during COG bonding. Also, flow property of the conductive particles is restrained due to nonconductive particles, and results the number of the conductive particles constantly maintained. To ensure the insulation property at 10 /spl mu/m gap, insulating coated conductive particles were used in ACF layer composition. The double-layered ACF using low temperature curable binder system is also effective in reducing the warpage level of COG assembly due to low modulus and low bonding temperature.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127078661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 73

Deformation behavior of solder alloys under variable strain rate shearing & creep conditions 变应变速率剪切和蠕变条件下焊料合金的变形行为

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432039

J. Liang, N. Dariavach, D. Shangguan

引用次数: 6

Weld clip design for minimization of welding-induced-alignment-distortion in butterfly laser module packages 减小蝴蝶激光模块封装中焊接致对准畸变的焊接夹设计

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432036

Yaomin Lin, F. Shi

{"title":"Weld clip design for minimization of welding-induced-alignment-distortion in butterfly laser module packages","authors":"Yaomin Lin, F. Shi","doi":"10.1109/ISAPM.2005.1432036","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432036","url":null,"abstract":"The welding-induced-alignment-distortion (WIAD) or post-weld-shift (PWS) is a serious issue in assembling of fiberoptic components using laser welding, which may significantly affect the packaging yield. Our previous investigations have revealed that an elimination or minimization of the WIAD in butterfly laser module packaging is possible if laser welding sequence and pulse shape of the welding lasers can be optimized. This work represents our further attempt in minimizing the WIAD by design of welding tools: the weld clip. By means of numerical simulations, the influence of seven different types of weld clip on the WIAD in the assembly of the butterfly laser module packages has been investigated. A realistic physics based laser-materials interaction model is employed and the model combines the spatal and temporal characteristics of the laser beam and the thermophysical properties of the material. The results show that the design of weld clip is important in packaging of the butterfly modules and the alignment distortion induced during the laser welding process can be controlled within the minimal range by proper design of weld clip and selection of process parameters such as the welding sequence.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129305126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Characterization of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive 各向异性导电胶粘剂用金属包覆聚合物球的力学性能表征

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432077

H. Kristiansen, Z.L. Zhang, J. Liu

{"title":"Characterization of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive","authors":"H. Kristiansen, Z.L. Zhang, J. Liu","doi":"10.1109/ISAPM.2005.1432077","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432077","url":null,"abstract":"Metal coated small (micron sized) polymer particles are used in developing anisotropic conductive adhesives (ACA). The mechanical properties of polymer particles are of crucial importance both to assembly process and the reliability of ACA. Tn this paper we present a method to determine the mechanical properties of polymer sphere particles by using inverse indentation test - soft elastic sphere against rigid flat. Finite element analyses have been carried out to study the large deformation contact between the sphere particle and a rigid flat. The classical Hertz solution works only for small sphere deformation. A modification has been made to the Hertz contact force-displacement solution and an approximate equation is presented. A capacitance based experimental setup for particle indentation has been built. The proposed method has been applied to determine the elastic properties of typical polymer particles used for conductive adhesives. For the metal plated polymer particles tested, it has been found that a linear elastic model seems to hold for a large range of deformation.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127059798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Stabilizing contact resistance of conductive adhesives on Sn surface by novel corrosion inhibitors 新型缓蚀剂稳定锡表面导电胶粘剂的接触电阻

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432053

Yi Li, K. Moon, C. Wong

{"title":"Stabilizing contact resistance of conductive adhesives on Sn surface by novel corrosion inhibitors","authors":"Yi Li, K. Moon, C. Wong","doi":"10.1109/ISAPM.2005.1432053","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432053","url":null,"abstract":"Electrically conductive adhesives (ECAs) have been proposed as one of the major alternatives for tin/lead solders in electronic packaging. However, some critical limitations of this technology, such as lower electrical conductivity and unstable contact resistance during elevated temperature and humidity aging, have slowed its potentially wide applications in electronics industry. In this study, novel organic corrosion inhibitors were discovered and introduced into a typical ECA formulation. With the incorporation of small amount of the additives, much lower bulk resistivity of ECAs and significantly stabilized contact resistance on Sn surfaces could be achieved. Contact angle and FTIR characterization indicated the affinity and interaction between the corrosion inhibitors and the metal surfaces. Therefore, a barrier passivation layer could form on Sn surfaces for ECA with the effective corrosion inhibitors. X-ray diffraction analyses confirmed that such a passivation layer could protect the Sn surface and prevent oxidation and corrosion under the elevated temperature and humidity environment.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125620021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications 电子应用中各向异性导电胶粘接技术本体的发展

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432076

J. Liu, Yu Wang, J. Morris, H. Kristiansen

{"title":"Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications","authors":"J. Liu, Yu Wang, J. Morris, H. Kristiansen","doi":"10.1109/ISAPM.2005.1432076","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432076","url":null,"abstract":"Anisotropic conductive adhesive (ACA) technology is one of the most important technologies for interconnect of electronics hardware. During the last 20 years, tremendous research and development effort has been spent on this. The purpose of this paper is to present ontology of the publications within the ACA technology since 1980. The following search fields are used for this study: ACA/ACF on glass, flexible circuits (polyester or polyimide), rigid board (FR-4), ceramic substrate, flexible circuitry interconnect to rigid, ACA/ACF on smart card applications, ACF/ACA on organic display, reliability, stress, process optimization and environmental issues. The search sources that were used are: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Inspec, Electronic Components and Technology Conference series proceedings, Journal of Electronics Packaging, Soldering and Surface Mount Technology and Circuit World. Over 150 papers have been found covering the above mentioned topics. The paper presents a list of the publications and abstracts of the searched results along with some comments about the importance of the paper in the topic. The purpose is simply to pinpoint the most important papers that have played significant role for the advancement of the ACA technology.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123709901","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11