电沉积聚氨酯胶粘剂在MEMS中的应用

Yuli Wang, M. Bachman, Guann-Pyng Li
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引用次数: 3

摘要

介绍了一种在导电基板上制备微尺寸胶粘剂的聚合物电沉积工艺,并对其在微机电系统(MEMS)中的应用进行了论证。紫外光固化聚氨酯胶乳首次用于阴极电沉积工艺。然后在25 V下电沉积聚氨酯水性乳胶1分钟,将聚氨酯保形涂覆在导电基板上。涂覆的聚氨酯薄膜具有粘附性,因此它可以作为粘合剂粘合其他微结构。聚氨酯胶粘剂可通过紫外线照射2分钟进一步固化。利用光刻技术在导电基板上涂上光刻胶层,有助于将聚合物电沉积定位在特定的表面位置。通过调整图案尺寸和电沉积时间,可以将沉积的粘合剂体积控制在10飞升量级。电沉积聚氨酯胶粘剂可用于MEMS键合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrodeposition of polyurethane adhesive for MEMS application
This paper presents a polymer electrodeposition process to prepare micro-size adhesive on electrically conductive substrates, and demonstrates its application for microelectromechanical systems (MEMS). UV-curable polyurethane latex was first formulated for cathodic electrodeposition process. Polyurethane was then conformally coated onto the conductive substrates by electrodeposition of polyurethane aqueous latex at 25 V for 1 minute. The coated polyurethane films is adherent, as a result it can be used as adhesive to bond other microstructures. The polyurethane adhesive can be further solidified by UV radiation for 2 minutes. Photolithography was used to pattern the conductive substrates with photoresist layer, which help to localize the polymer electrodeposition at specific surface locations. The deposited adhesive volume is able to be controlled in the magnitude of 10 femtoliters by adjusting the pattern size and the electrodeposition time. The electrodeposited polyurethane adhesive is useful for MEMS bonding.
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