Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.最新文献

Electrical contact resistance of silver with different coatings 不同镀层银的电接触电阻

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432050

B. Su, J. Qu

引用次数: 3

Epoxy/BaTiO/sub 3/ (SrTiO/sub 3/) composite films for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates 环氧树脂/BaTiO/sub - 3/ (SrTiO/sub - 3/)复合薄膜用于高介电常数和低容限的有机衬底嵌入式电容器的制造

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432080

K. Paik, Sung-Dong Cho, Jin-Gul Hyun, Sangyong Lee, Hyungsoo Kim, Joungho Kim

{"title":"Epoxy/BaTiO/sub 3/ (SrTiO/sub 3/) composite films for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates","authors":"K. Paik, Sung-Dong Cho, Jin-Gul Hyun, Sangyong Lee, Hyungsoo Kim, Joungho Kim","doi":"10.1109/ISAPM.2005.1432080","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432080","url":null,"abstract":"Epoxy/BaTiO/sub 3/ composite embedded capacitor films (ECFs) were newly designed for high dielectric constant and low tolerance (less than /spl plusmn/5%) embedded capacitor fabrication in organic substrates. In terms of material formulation, ECFs were composed of specially formulated epoxy resin and latent curing agent. And in terms of coating process, a comma roll coating method was used for a uniform film thickness over large area. Dielectric constants of BaTiO/sub 3/ & SrTiO/sub 3/ composite ECFs were measured with MIM (metal-insulator-metal) capacitors at 100 kHz using LCR meter. Dielectric constants of BaTiO/sub 3/ ECFs were larger than these of SrTiO/sub 3/ ECFs, due to the difference of permittivity of BaTiO/sub 3/ and SrTiO/sub 3/ particles. Dielectric constants of BaTiO-, & SrTiO/sub 3/ ECFs at high frequency range (0.5/spl sim/10GHz) were measured using a cavity resonance method. For both powders, dielectric constants in high frequency range were about 3/4 of the dielectric constants at 1 MHz. This difference is mainly due to the decrease of dielectric constant of epoxy matrix. For BaTiO/sub 3/ ECFs, there was a dielectric relaxation at 5/spl sim/9GHz presumably due to the polarization mode change of BaTiO/sub 3/ powder. However in case of SrTiO/sub 3/ ECFs, there was no relaxation up to 10GHz.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115341467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An engineering model for moisture degradation of polymer/metal interfacial fracture toughness 聚合物/金属界面断裂韧性的水分降解工程模型

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432093

T. P. Ferguson, J. Qu

引用次数: 4

Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates 多层有机衬底上的嵌入式电阻和电容器的设计、制造和可靠性评估

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432084

K. Lee, S. Bhattacharya, M. Varadarajan, L. Wan, I. R. Abothu, V. Sundaram, P. Muthana, D. Balaraman, P. Raj, M. Swaminathan, S. Sitaraman, R. Tummala, P. Viswanadham, S. Dunford, J. Lauffer

{"title":"Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates","authors":"K. Lee, S. Bhattacharya, M. Varadarajan, L. Wan, I. R. Abothu, V. Sundaram, P. Muthana, D. Balaraman, P. Raj, M. Swaminathan, S. Sitaraman, R. Tummala, P. Viswanadham, S. Dunford, J. Lauffer","doi":"10.1109/ISAPM.2005.1432084","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432084","url":null,"abstract":"Embedded passives provide a practical solution to microelectronics miniaturization. In a typical circuit, over 80 percent of the electronic components are passives such as resistors, inductors, and capacitors that could take up to 50 percent of the entire printed circuit board area. By integrating passive components within the substrate, embedded passives reduce the system real estate, eliminate the need for discrete components and assembly of same, enhance electrical performance and reliability, and potentially reduce the overall cost. Moreover, it is lead free. Even with these advantages, embedded passive technology is at a relatively immature stage and more characterization and optimization are needed for practical applications leading to its commercialization. This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on multilayered microvia organic substrate. Two test vehicles focusing on resistors and capacitors have been designed and fabricated by Packaging Research Center (PRC) and Endicott Interconnect Technologies (EI). Resistors are carbon ink based polymer thick film (PTF) and NiCrAlSi, and capacitors are made with polymer/ceramic nanocomposite material. High frequency measurement of these capacitors was performed. Furthermore, reliability assessments of thermal shock and temperature humidity tests based on JED EC standards are presented.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125343036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems 柔性电子系统用卷对卷加工精细节距图案的研究

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432062

A. Drost, G. Klink, M. Feil, K. Bock

引用次数: 8

3D integration of electronics and mechanics 电子和机械的三维集成

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432035

T. Peltola, P. Mansikkamaki, E. Ristolainen

{"title":"3D integration of electronics and mechanics","authors":"T. Peltola, P. Mansikkamaki, E. Ristolainen","doi":"10.1109/ISAPM.2005.1432035","DOIUrl":"https://doi.org/10.1109/ISAPM.2005.1432035","url":null,"abstract":"Nowadays, the design is one of the key features for all consumer products. All the novel functions must be available inside fashionable covers. However, the most interesting product shapes are not always possible due the restriction of the traditional rigid printed wiring board (PWB). To achieve a real design freedom, a formable multilayer PWB structure is needed. This paper introduces the three-dimensional printed wiring board and the 3D integration of electronics and mechanics. The 3D integration of electronics and mechanics increases design freedom and space utilization efficiency e.g. in portable devices. The 3D integration technology is enabled by thermoplastic PWB material innovations and a new kind of system integration process. Thermoplastics are formable and they are widely used in many fields, but as a substrate for a multilayer PWB, they are rather new. Furthermore, this paper discusses the benefits and challenges of the 3D integration of electronics and mechanics and the special characteristics of its system design process. Integration of electronics and mechanics has an effect on the design process management. Design phases must be coherent and teamwork needs to be well organized. In addition, special requirements for testing are presented.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131777521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Electromigration in eutectic tin-lead solder lines at the device temperature 在器件温度下共晶锡铅焊锡线的电迁移

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432069

R. Agarwal, K. Tu

引用次数: 1

The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite 自组装单层(SAM)在银纳米颗粒导电纳米复合材料中的作用

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432087

Hongjin Jiang, K. Moon, Lingbo Zhu, Jiongxin Lu, C. Wong

引用次数: 5

Sn2.5Ag0.5Cu lead free solder balls with "Ge" and "Ni" 含“Ge”和“Ni”的Sn2.5Ag0.5Cu无铅钎料球

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432060

R. Lee, Wha Soo Sin, J. K. Jeon, Heui Seog Kim

引用次数: 1

No-bleed die attach adhesives 无出血模贴胶

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI: 10.1109/ISAPM.2005.1432051

B. Neff, J. Huneke, M. Nguyen, P. Liu, T. Herrington, S.K. Gupta

引用次数: 7