聚合物/金属界面断裂韧性的水分降解工程模型

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI:10.1109/ISAPM.2005.1432093

T. P. Ferguson, J. Qu

{"title":"聚合物/金属界面断裂韧性的水分降解工程模型","authors":"T. P. Ferguson, J. Qu","doi":"10.1109/ISAPM.2005.1432093","DOIUrl":null,"url":null,"abstract":"Based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"94 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"An engineering model for moisture degradation of polymer/metal interfacial fracture toughness\",\"authors\":\"T. P. Ferguson, J. Qu\",\"doi\":\"10.1109/ISAPM.2005.1432093\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.\",\"PeriodicalId\":181674,\"journal\":{\"name\":\"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.\",\"volume\":\"94 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.2005.1432093\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2005.1432093","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

基于界面断裂力学和界面的疏水性，建立了其工程模型。利用该模型，当界面附近的水分浓度已知时，可以预测聚合物/金属界面断裂韧性的退化。

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An engineering model for moisture degradation of polymer/metal interfacial fracture toughness

Based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.

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来源期刊

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

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