{"title":"分子气相沉积(MVD/spl trade/) -一种用于包装应用的防潮屏障的新方法","authors":"M. Wanebo, B. Kobrin, F. Helmrich, J. Chinn","doi":"10.1109/ISAPM.2005.1432063","DOIUrl":null,"url":null,"abstract":"We propose that a composite hydrophobic SAM film with 100% coverage of all exposed surfaces can be used in many advance packaging applications. For example, a SAM moisture barrier with conventional plastic packaging could be a low cost alternative to hermetic ceramic housed devices and SAMs could be barriers to prevent moisture induced corrosion.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Molecular vapor deposition (MVD/spl trade/) - a new method of applying moisture barriers for packaging applications\",\"authors\":\"M. Wanebo, B. Kobrin, F. Helmrich, J. Chinn\",\"doi\":\"10.1109/ISAPM.2005.1432063\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose that a composite hydrophobic SAM film with 100% coverage of all exposed surfaces can be used in many advance packaging applications. For example, a SAM moisture barrier with conventional plastic packaging could be a low cost alternative to hermetic ceramic housed devices and SAMs could be barriers to prevent moisture induced corrosion.\",\"PeriodicalId\":181674,\"journal\":{\"name\":\"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.2005.1432063\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2005.1432063","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Molecular vapor deposition (MVD/spl trade/) - a new method of applying moisture barriers for packaging applications
We propose that a composite hydrophobic SAM film with 100% coverage of all exposed surfaces can be used in many advance packaging applications. For example, a SAM moisture barrier with conventional plastic packaging could be a low cost alternative to hermetic ceramic housed devices and SAMs could be barriers to prevent moisture induced corrosion.