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A First-Order All-Pass Filter Based on the Current Differential Amplifier 基于电流差分放大器的一阶全通滤波器
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959226
Ricardo M. Rocha-Torres, A. Díaz-Sánchez, J. M. Rocha-Pérez, G. Zamora-Mejía
{"title":"A First-Order All-Pass Filter Based on the Current Differential Amplifier","authors":"Ricardo M. Rocha-Torres, A. Díaz-Sánchez, J. M. Rocha-Pérez, G. Zamora-Mejía","doi":"10.1109/ICEV56253.2022.9959226","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959226","url":null,"abstract":"In this work the design and implementation of a first-order all-pass filter (APF) based on the current differential amplifier is presented. The proposed APF is composed by only seven MOS transistors and one capacitor. One major advantage is that the current-mode signal is only processed by NMOS transistors while avoids any extra PMOS signal paths. Due to its compactness, this APF can operate under nominal and low voltage supply, allowing high-frequency or low-voltage low-power operation modes. To validate the propose circuit a high-frequency and a low-voltage low-power APFs were designed and simulated using a 0.18 μm TSMC CMOS technology under Cadence Virtuoso environment.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122250203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrical Engineer performance competencies from the Faculty of Mechanical and Electrical Engineering: Result of self-assessment exercise for acreditation 机电工程学院的电气工程师表现能力:认证自我评估的结果
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959564
Morales Martínez Martha Edith, Camarillo Montero Jesús Antonio, Ricaño Herrera Francisco, Cruz Capitaine Roberto, Hernández García Cristián Dumay, Espinosa Arroyo Francisco
{"title":"Electrical Engineer performance competencies from the Faculty of Mechanical and Electrical Engineering: Result of self-assessment exercise for acreditation","authors":"Morales Martínez Martha Edith, Camarillo Montero Jesús Antonio, Ricaño Herrera Francisco, Cruz Capitaine Roberto, Hernández García Cristián Dumay, Espinosa Arroyo Francisco","doi":"10.1109/ICEV56253.2022.9959564","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959564","url":null,"abstract":"Nowadays, the assessment of the graduate’s competencies becomes more important in Higher Education Institutions (HEI) that seek continuous improvement, due to the impact that these have on the achievement of graduate profile and relevance of the Educational Program (EP). The main objective of the present investigation is to present the performance competences analysis results from the Electrical Engineering graduates of the Facultad de Ingeniería Mecánica Eléctrica (FIME) of the Universidad Veracruzana, because of the self-assessment a view to the EP accreditation. The type of research carried out was non-experimental, exploratory, and descriptive, under a theoretical and conceptual methodology established by the CACEI 2018 Reference Framework in the International Context. The results show the graduation attributes assessment achievement and educational objectives of the EP students and graduates, as well as the Universidad Veracruzana’s competencies educational model which will allow assessing the performance of the electrical engineer’s competencies and the EP relevance.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131008369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Superconducting qubits based on Al Josephson junctions and coplanar waveguide resonators 基于Al Josephson结和共面波导谐振器的超导量子比特
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959317
Daniel Rocha-Aguilera, J. Molina-Reyes, G. Méndez-Jerónimo
{"title":"Superconducting qubits based on Al Josephson junctions and coplanar waveguide resonators","authors":"Daniel Rocha-Aguilera, J. Molina-Reyes, G. Méndez-Jerónimo","doi":"10.1109/ICEV56253.2022.9959317","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959317","url":null,"abstract":"Superconducting qubits are one of the most promising candidates for the physical implementation of quantum computing. In this paper, a brief review of superconducting qubits based on Josephson tunnel junctions and coplanar waveguide resonators is presented, focusing on Al/Al2O3/Al junctions, fabrication techniques, and important areas of opportunity for these devices. Simulation results of Al-based MIM capacitor structures and coplanar waveguide resonators are presented as an initial approach to the study of these devices and the impact of certain design parameters on their performance.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133120423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Distribution of Microwave Signals Using Space Division Multiplexing Technique 利用空分复用技术实现微波信号的分布
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959601
J. R. Warnes-Lora, B. Tshibangu-Mbuebue, J. Rodríguez-Asomoza, A. García-Juárez, I. Zaldívar-Huerta
{"title":"Distribution of Microwave Signals Using Space Division Multiplexing Technique","authors":"J. R. Warnes-Lora, B. Tshibangu-Mbuebue, J. Rodríguez-Asomoza, A. García-Juárez, I. Zaldívar-Huerta","doi":"10.1109/ICEV56253.2022.9959601","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959601","url":null,"abstract":"This work describes the use of a photonic lantern (PL) acting as a multiplexer to distribute microwave signals. The microwave signals are coded on filtered passband signals. The passband signals are obtained by using a Microwave Photonic Filter (MPF) whose operation is based on the use of the chromatic dispersion parameter of the optical fiber. The PL transmits RF signals centered at 1.29 GHz, 2.59 GHz, and 3.88 GHz. This proposal is situated in the area of Space Division Multiplexing (SDM). Computer-Aided Design (CAD) is used to demonstrate the transmission of microwave signals using the LP01, LP11a, and LP11b modes. In particular, a series of numerical simulations using the VPIphotonics Software is carried out. Simulation results are corroborated by a series of experiments. The measurement of the Signal-to-Noise-Ratio (SNR) parameter is used to evaluate the quality of the microwave transmitted signals.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126154274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A σ = 0.66 LSB 8-bit Time-to-Digital Converter with Variable Resolution in a 180nm CMOS Technology 基于180nm CMOS技术的σ = 0.66 LSB 8位变分辨率时数转换器
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959256
Jonathan Santiago-Fernandez, A. Díaz-Sánchez, J. M. Rocha-Pérez, V. H. Carbajal-Gómez, G. Zamora-Mejía
{"title":"A σ = 0.66 LSB 8-bit Time-to-Digital Converter with Variable Resolution in a 180nm CMOS Technology","authors":"Jonathan Santiago-Fernandez, A. Díaz-Sánchez, J. M. Rocha-Pérez, V. H. Carbajal-Gómez, G. Zamora-Mejía","doi":"10.1109/ICEV56253.2022.9959256","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959256","url":null,"abstract":"This work presents an 8-bit Time-to-Digital Converter (TDC) suitable for time-lapse measurement applications. The proposed TDC is composed of two nested 4-bit counters, a digital-logic control network, a register, and a decoder. Verilog language was used to synthesize the TDC using the standard cells of the technology. The system has a standard digital output and it is powered by a 1.8 V supply with a total power consumption of 9.86 mW. The characterization was performed by means of post-layout simulations using a TSMC 180 nm CMOS technology. The proposed structure exhibits a 355.4 μm × 105.8 μm area. In addition, this TDC has a standard deviation of 0.66 LSB with a fixed input time interval with a user-select operation frequency from 1 MHz to 1 GHz.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127214302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reengineering of a dedicated microcontroller for the technological improvement of an industrial CNC stone cutter 工业数控石材切割机工艺改进专用微控制器的再设计
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959250
Martín Hernández-Ordoñez, J. L. Palomeque-Loyo, Damaris Francela Villalvazo-Quintero, Jorge Arturo Mendoza-Sosa, Isaac Alemán-Cruz, José Camargo-Méndez, Evelyn Villalobos-Antonio
{"title":"Reengineering of a dedicated microcontroller for the technological improvement of an industrial CNC stone cutter","authors":"Martín Hernández-Ordoñez, J. L. Palomeque-Loyo, Damaris Francela Villalvazo-Quintero, Jorge Arturo Mendoza-Sosa, Isaac Alemán-Cruz, José Camargo-Méndez, Evelyn Villalobos-Antonio","doi":"10.1109/ICEV56253.2022.9959250","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959250","url":null,"abstract":"This document presents the implementation of a conventional electronic system, where ESP32 chips are used to replace the límited design plate that has been damaged in the CNC model TOP CUT 500 4X, thus showing that the good design of a control system, can replace a system that is límited, this arises the industry of finishes and cuts of stones. The ESP32 provides a great advantage since it is a board that has the ability to handle the 4 axes of the cutter and high speeds, being of modern technology, since it also has a wireless connection system, after several versions of development the desired system was reached that could achieve the operation similar to the one that the machine had, before being damaged.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124623907","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Changes in Measurement of Direct Current Photoplethysmography signals with a Wireless Transillumination System 用无线透照系统测量直流光电容积脉搏波信号的变化
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959184
D. A. Lara-López, J. Martínez-Castillo, E. Delgado-Alvarado, E. Morales-González, J. J. Espinoza-Maza, G. Mendoza-Barron, Josué Domínguez-Márquez, P. Mabil-Espinosa, E. Manjarrez
{"title":"Changes in Measurement of Direct Current Photoplethysmography signals with a Wireless Transillumination System","authors":"D. A. Lara-López, J. Martínez-Castillo, E. Delgado-Alvarado, E. Morales-González, J. J. Espinoza-Maza, G. Mendoza-Barron, Josué Domínguez-Márquez, P. Mabil-Espinosa, E. Manjarrez","doi":"10.1109/ICEV56253.2022.9959184","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959184","url":null,"abstract":"Recent work has shown that it is possible to design a wireless system for the transmission of direct current photoplethysmography (DC-PPG) signals using photodetectors and Light Emitting Diodes and their application in the detection of the associated hemodynamic response in the spinal cord and brain in humans and various animal models. In this study, we have developed a system capable of wirelessly measuring and transmitting amplitude changes in low-intensity DC-PPG signals in humans from a transmitting to a receiving stage. To obtain changes in DC-PPG signals, to be wirelessly transmitted and received in a receiving stage, a transmitting circuit linked to four optodes was positioned on a test subject, of which one of them was arranged, in transmittance mode, on his index finger. At the same time, a baumanometer was placed on the humeral region of the subject’s right arm. In this way, we verified that our wireless system could measure a significant increase in DC-PPG amplitude due to compression episodes by the baumanometer. We suggest that the optode array arrangement of our system may allow wireless, real-time monitoring of the hemodynamic response in different regions of the human brain","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121444255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Atomic-layer deposition for development of advanced electron devices 发展先进电子器件的原子层沉积
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959116
J. Molina-Reyes
{"title":"Atomic-layer deposition for development of advanced electron devices","authors":"J. Molina-Reyes","doi":"10.1109/ICEV56253.2022.9959116","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959116","url":null,"abstract":"This work resumes some of the most important results that have been obtained in our research group regarding the use of atomic-layer deposition (ALD) as the main thin-film deposition technique for metal oxides with high dielectric constant. ALD has been applied for the development of logic, memory, sensing and quantum technologies in which ultra-thin metal oxides (Al2O3, HfO2 and TiO2 with a physical thickness of less than 10nm), are the active part of the final devices under study.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116872286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Review of Microwave Resonant Sensors for Liquid Samples Detection 微波谐振传感器在液体样品检测中的研究进展
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959603
G. Méndez-Jerónimo, H. Lobato-Morales
{"title":"A Review of Microwave Resonant Sensors for Liquid Samples Detection","authors":"G. Méndez-Jerónimo, H. Lobato-Morales","doi":"10.1109/ICEV56253.2022.9959603","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959603","url":null,"abstract":"Microwave sensors have been used for numerous applications and one of the most important is as material sensors due to their high sensitivity for detecting permittivity variations. According to the method of operation, they can be classified into resonant and broadband sensors. This article presents a brief review on the principal structures used as resonant sensors, with particular focus on liquid samples. Its main characteristics and applications are also discussed in the manuscript.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126590355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Correlational analysis of the learning process of higher-level students in times of covid-19 新冠肺炎疫情时期高等学校学生学习过程的相关分析
2022 IEEE International Conference on Engineering Veracruz (ICEV) Pub Date : 2022-10-24 DOI: 10.1109/ICEV56253.2022.9959143
Mejia Gracia César, Gazca Herrera Luis, Culebro Castillo, Sánchez Hernández
{"title":"Correlational analysis of the learning process of higher-level students in times of covid-19","authors":"Mejia Gracia César, Gazca Herrera Luis, Culebro Castillo, Sánchez Hernández","doi":"10.1109/ICEV56253.2022.9959143","DOIUrl":"https://doi.org/10.1109/ICEV56253.2022.9959143","url":null,"abstract":"As of the start of COVID-19 pandemic, the need to change the modality in which classes were being taught arose in the administrative computer systems undergraduate program of the faculty of accounting and administration of the Universidad Veracruzana, which brought within the problem to ensure that the learning process was equally effective under dual modality. The main goal of the presented research is to carry out a correlational analysis to determine if certain variables had a positive impact in the students learning process under the face-to-face and virtual modalities. An exploratory and descriptive research was carried under a quantitative data collection to test a hypothesis based on a statistical and inferential analysis. The research shows, it can be stated that the learning delivery model for the selected sample was better under the face-to-face modality. And that the use of technological platforms for online classes was a factor that positively contributed to online learning.","PeriodicalId":178334,"journal":{"name":"2022 IEEE International Conference on Engineering Veracruz (ICEV)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128180634","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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