2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第6页

A tool for aided multi-scale model derivation and its application to the simulation of a micro mirror array 一种辅助多尺度模型推导工具及其在微镜阵列仿真中的应用

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926269

W. Belkhir, N. Ratier, D. Nguyen, N. Trinh, M. Lenczner, F. Zamkotsian

引用次数: 2

Simulation of delamination initiation and subsequent propagation using cohesive zones 利用内聚带模拟分层的产生和随后的扩展

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926297

Maofen Zhang, Daoguo Yang, L. Ernst, Bingbing Zhang

{"title":"Simulation of delamination initiation and subsequent propagation using cohesive zones","authors":"Maofen Zhang, Daoguo Yang, L. Ernst, Bingbing Zhang","doi":"10.1109/EUROSIME.2017.7926297","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926297","url":null,"abstract":"Delamination is one of the main problems in electronic packaging due to the relatively weak adhesion strength of interfaces. Delamination failure includes two processes: crack initiation and crack propagation. Various experimental setups and theories have been built to study these processes. Among these studies the cohesive zone method being implemented in various finite element packages is becoming a popular tool for crack propagation modelling. In our previous work [1–4] the efficient use of cohesive zone modelling of the delamination propagation process of pre-cracked samples was discussed. Here also an appropriate method to establish the cohesive zone parameters was given. Among this a fitting method to establish the critical energy release rate through cohesive zone modelling was presented. Although the modelling of delamination propagation for packages with assumed pre-cracks at various spots now is quite feasible, in the thermal-mechanical designing of packages the initiation of delamination (without assumed pre-cracks) is much more important. Therefore, the present work primarily focuses on applying the cohesive zone method for the modelling of the initiation of delamination, followed by the subsequent delamination propagation. The paper will primarily investigate the crack initiation (without pre-crack) for a chosen interface. The influences of mesh size, number of loading increments and the critical stress values are investigated and discussed in detail. The computing time is considered and compared for various settings, such as to overcome convergence problems. The present study will help to make proper choices for future correct and economically feasible simulations of delamination initiation and subsequent propagation.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"177 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130711210","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The scope of applicability of DPL model to the heat transfer in electron devices DPL模型对电子器件传热的适用范围

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926288

M. Zubert, T. Raszkowski, A. Samson, M. Janicki, A. Napieralski

引用次数: 2

Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures 三维集成硅微结构中力学材料性能与应力的关系

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926250

M. Stiebing, D. Vogel, W. Steller, M. Wolf, U. Zschenderlein, B. Wunderle

{"title":"Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures","authors":"M. Stiebing, D. Vogel, W. Steller, M. Wolf, U. Zschenderlein, B. Wunderle","doi":"10.1109/EUROSIME.2017.7926250","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926250","url":null,"abstract":"Three-dimensional (3D) electronic systems enable higher integration densities compared to their 2D counterparts, a gain required to meet the demands of future exa-scale computing, cloud computing, big data systems, cognitive computing, mobile devices and other emerging technologies. Through-silicon vias (TSVs) open a pathway to integrate electrical connections for signaling and power delivery through the silicon (Si) carrier used in 3D-stacked microstructures. As a limitation, TSVs induce locally thermomechanical stress in the Si lattice due to a mismatch in the coefficients of thermal expansion between Si and the TSV-filling metals and therefore enforce temperature related expansion and shrinkage during the annealing cycle. This temperature-induced crowding and relaxation of the Si lattice in proximity of the TSV (called “keep-out-zone” forbidden for active device positioning) can cause a variety of issues ranging from stress-induced device performance degradation, interfacial delamination or interconnect failures due to cracking of the bond or even of the entire Si microstructures at stress hotspots upon assembly or operation. Additionally also the interconnect structures induce stress that will overlap with the TSV induced stress.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125118552","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Effect of excitation conditions on the durability of high standoff electronic components and assemblies under multiaxial vibration excitation 激励条件对多轴振动激励下高距电子元件和组件耐久性的影响

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926295

Raman Sridharan, A. Dasgupta

{"title":"Effect of excitation conditions on the durability of high standoff electronic components and assemblies under multiaxial vibration excitation","authors":"Raman Sridharan, A. Dasgupta","doi":"10.1109/EUROSIME.2017.7926295","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926295","url":null,"abstract":"Electronic assemblies often experience multiaxial vibration environments in use and tall, heavy components are more vulnerable under such loading than are short, light components. The added vulnerability comes from higher response due to nonlinear dynamic amplification of the response under simultaneous multiaxial excitation, termed multi degree of freedom (MDoF) excitation. This paper investigates the geometric nonlinearities and the resulting cross-axis interactions that tall and heavy electronic components experience when subjected to vibration excitation simultaneously along two orthogonal axes. Multiaxial vibration experiments were conducted on tip-loaded cantilever beams to explore the nonlinear vibration response of tall, heavy electronic components. Harmonic base-excitation was simultaneously applied in two orthogonal axes (with a different frequency in each axis), and the phase “difference” between these two harmonic signals was parametrically varied to see the effect on the response amplitude. Based on prior studies, the frequency of the transverse excitation was selected to be the fundamental natural frequency of the cantilever beam and that of the axial direction was selected to be twice as large to maximize the cross-axis interaction. Phase is seen to have a very significant effect on the nonlinear amplification of the response. Nonlinear finite element simulations were conducted to verify and explain the experimental observations.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124288669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Highly parallel computations of creep deformation in flip-chip interconnections 倒装片互连中蠕变变形的高度并行计算

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926259

C. Bouchard, J. Sylvestre

引用次数: 0

First principle design of CdS/germanene heterostructures with tunable electronic and transport properties 具有可调谐电子和输运性质的CdS/锗烯异质结构的第一性原理设计

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926284

K. Zheng, H. Ye, Guoqi Zhang, Yingying Zhang, Lian Liu, Junke Jiang, Qun Yang, Chun-Jian Tan, Xianping Chen

引用次数: 0

A model of the electric field in a one-dimensional Micro-Mirror Array and electromechanical simulations and optimization in a single cell 一维微镜阵列的电场模型及单单元的机电仿真与优化

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926268

D. Nguyen, N. Trinh, M. Lenczner, F. Zamkotsian, S. Cogan

引用次数: 1

Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses 用模拟和精密光学变形分析对汽车用消费部件板级可靠性进行评估

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926277

R. Dudek, M. Hildebrand, S. Rzepka, J. Beintner, R. Döring, L. Scheiter, B. Seiler, T. Fries, R. Ortmann

{"title":"Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses","authors":"R. Dudek, M. Hildebrand, S. Rzepka, J. Beintner, R. Döring, L. Scheiter, B. Seiler, T. Fries, R. Ortmann","doi":"10.1109/EUROSIME.2017.7926277","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926277","url":null,"abstract":"The development of automotive electronics (AE) towards autonomous driving applications generates various challenges, in particular also on the reliable functionality. In various cases dedicated automotive grade components are lacking and consumer components have to be used instead, which hardly fulfil automotive standards. Some of the reliability challenges are therefore thermo-mechanical in nature. Some example issues, which are related to consumer electronics (CE) packaging, in particular MEMS-packaging, are given in the paper. Main focus is laid on the development of FE-simulation based evaluation methodologies accompanied by experimental characterization methods, in particular with regard to solder fatigue. It is shown that secondary effects such as, for example, intrinsic warpage of the component and of the circuit board, that are system related effects, can play an important role in AE application. A newly developed optical multi-sensor metrology method is presented for the thermo-mechanical deformation measurement of electronic components and systems for different size and resolution ranges. Thermally induced intrinsic warpage of circuit boards and components were analyzed both by means of the method. It was found that significant intrinsic deformations and warpages can occur and should be considered directly in AE system design and indirectly when evaluation stress risks, e.g. for solder fatigue.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129682798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly 可选铜柱凸点设计，减少倒装芯片组装过程中产生的热机械应力

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926236

M. Lofrano, V. Cherman, Mario Gonzalez, E. Beyne

引用次数: 2