2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

Understanding the transport phenomena leading to tarnishing of the reflecting silver layer causing reduced light output of LEDs 了解导致反射银层失去光泽导致led光输出减少的传输现象

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-05-10 DOI: 10.1109/EUROSIME.2017.7926238

A. Herrmann, S. Erich, L. V. Ven, W. V. van Driel, M. van Soestbergen, A. Mavinkurve, F. de Buyl, O. Adan

引用次数: 2

Requirements specification for multi-domain LED compact model development in Delphi4LED Delphi4LED中多域LED紧凑型模型开发的需求规范

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926296

A. Alexeev, R. Bornoff, S. Lungten, G. Martin, G. Onushkin, A. Poppe, M. Rencz, J. Yu

{"title":"Requirements specification for multi-domain LED compact model development in Delphi4LED","authors":"A. Alexeev, R. Bornoff, S. Lungten, G. Martin, G. Onushkin, A. Poppe, M. Rencz, J. Yu","doi":"10.1109/EUROSIME.2017.7926296","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926296","url":null,"abstract":"Light-emitting diode (LED) technology has been rapidly developing due to high energy efficiency and longer lifetimes of LED luminaires. One of the main challenges in designing LED components is to manage the inter-twined relation between thermal, electrical, and optical performances. These dependencies are required to be well understood in order to operate LEDs efficiently and have accurate performance prediction at different levels of the product value chain. Delphi4LED project aims at developing standardised method to create multi-domain (thermal, electrical, and optical) compact models from the measurement data. To obtain highly reliable and representative data sets via characterisation and calibration, end-user requirements specification for diverse LED samples are needed. In this paper, we report the lists of LED parameters and components selected for measurements, simulation and calibration considering end-user needs. We also show some of the methodologies for compact thermal model development that are recommended in Delphi4LED, followed by definition of simulation benchmark problems.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122699598","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Transient thermal simulation of high power LED and its challenges 大功率LED瞬态热模拟及其挑战

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926221

S. Tandon, E. Liu, T. Zahner, S. Besold, Wolfgang Kalb, G. Elger

{"title":"Transient thermal simulation of high power LED and its challenges","authors":"S. Tandon, E. Liu, T. Zahner, S. Besold, Wolfgang Kalb, G. Elger","doi":"10.1109/EUROSIME.2017.7926221","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926221","url":null,"abstract":"Transient thermal analysis (TTA) is widely used to measure the transient thermal impedance (Zth) and the thermal resistance of LEDs because reliability and lifetime of LED depends critically on junction temperature. To predict up-front in the product development process the lifetime of LED modules, calibrated finite element (FE) models are used. In this paper a FE-model for a family of high power LED is developed, i.e. different number of LED dies on ceramic sub-mounts of different sizes and calibrated to the Zth measurements. Based on the CAD data for the selected LED module (two LED dies on ceramic carrier), different modern FE tools (ANSYS, Comsol and Flo-EFD) are used for transient FE simulation and benchmarked. All tools deliver appropriate results when best practice FE modeling is applied i.e. mesh quality, correct boundary condition, material data and contact resistances. To model the Zth (t) measurement correctly, the suited approach of thermal boundary condition is investigated and a temperature boundary condition is proven as correct, practical and numerical efficient approach. The specific effect of heat generated in the converter of white LEDs on the transient impedance curve is revealed and investigated. Afterwards one FE-tool is coupled with the commercial optimizer OptiSLang. Based on available material data the FE model of the 2-chip LED module is calibrated to the experimental measured transient impedance curve. The calibrated model parameters are used to simulate the Zth (t) curves of another high power LED module of this family. It was found that the simulated curves matched the experimental Zth (t) curves of the LED modules. This validates the calibrated material properties for this entire LED family.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"367 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125623071","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Packaging effects on Q factor of MEMS resonator 封装对MEMS谐振器Q因子的影响

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926220

Kisoo Shin, Do-Hwan Park, Seungoh Han

引用次数: 0

Towards high fidelity silicon microphones: Evaluating the potential of industrial microsystems applying tailored system-level models 迈向高保真硅麦克风:评估应用定制系统级模型的工业微系统的潜力

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926291

G. Schrag, T. Künzig

引用次数: 1

A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load 一种原位透射电镜研究金属中碳纳米管在拉伸载荷下破坏行为的试验装置

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926262

N. Jöhrmann, S. Hartmann, K. Jacob, J. Bonitz, Kathrine E. MacArthur, S. Hermann, S. Schulz, B. Wunderle

{"title":"A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load","authors":"N. Jöhrmann, S. Hartmann, K. Jacob, J. Bonitz, Kathrine E. MacArthur, S. Hermann, S. Schulz, B. Wunderle","doi":"10.1109/EUROSIME.2017.7926262","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926262","url":null,"abstract":"This paper presents an in situ pull-out test device to characterize interfaces between single-walled carbon nanotubes (SWCNTs) and metals. After summarizing results of maximum stresses calculated from molecular dynamics simulations and obtained from in situ scanning electron microscope experiments the need for an in situ experimental method with atomic resolution to study the mechanics of SWCNT-metal interfaces in further detail is outlined. For that purpose, a silicon-based micromechanical test stage with a thermal actuator for pull-out tests inside a transmission electron microscope was developed and characterized. To measure actuator movements digital image correlation was used. First experiments showed a stable movement of the metal electrode in the focal plane of the electron microscope. On the other hand, image drift due to the heat impact of the thermal actuators was observed. Finite element simulations were applied to further investigate the cause of the drift and to evaluate different approaches to solve the issue. Finally, a successful drift compensation by preheating the test device and keeping power consumption constant during the pull out experiment is demonstrated. In the future the presented system may be also used and further developed for in situ characterization of other materials.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130778045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A study on the correlation between experiment and simulation board level drop test for SSD 固态硬盘仿真板跌落试验与实验的相关性研究

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926215

T. Kang, Yong Chang Lee, Byung Kwon Bae, Won Seob Song, Jae Sung Lee

{"title":"A study on the correlation between experiment and simulation board level drop test for SSD","authors":"T. Kang, Yong Chang Lee, Byung Kwon Bae, Won Seob Song, Jae Sung Lee","doi":"10.1109/EUROSIME.2017.7926215","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926215","url":null,"abstract":"Recently, handheld electronic products are prone to being dropped during their useful service life because of their size and weight. Board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The packages are susceptible to solder joint failures, induced by a combination of PCB bending and mechanical shock during impact. Therefore, board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this study, we examine and compare simulation the board level drop test of SSD. Applying the JEDEC (JESD22-B111) standard present a finite element modeling of the BGA package assembly was performed to study the stress and strain behavior of the solder joints during drop test. The simulation revealed that maximum stress was located at the outermost solder ball in the PCB or Package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124566881","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Characterization of thermal conductivity in polymer composite heat exchanger parts 聚合物复合热交换器部件导热性能的表征

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926300

I. Darawsheh, A. Diana, P. Rodgers, V. Eveloy, F. Almaskari

{"title":"Characterization of thermal conductivity in polymer composite heat exchanger parts","authors":"I. Darawsheh, A. Diana, P. Rodgers, V. Eveloy, F. Almaskari","doi":"10.1109/EUROSIME.2017.7926300","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926300","url":null,"abstract":"Fiber-reinforced, injection-molded polymer composite materials can provide heat exchanger heat transfer rates comparable to those of metallic materials. However, the relationship between fiber orientation and thermal conductivity, and its effects on the heat transfer rate need to be investigated. In this study, a methodology to determine the anisotropic thermal conductivity of an injection-molded commercially-available, thermally-enhanced polymer composite, based on numerical simulation combined with experimentation is presented. The injection molding process is numerically modeled to predict fiber orientation. The filler characteristics of injection-molded polymer composite parts are experimentally determined to derive the composite material thermal conductivity distribution using Nielsen semi-empirical model. This methodology is applied to a heat exchanger unit air channel geometry, that is virtually manufactured using either injection molding or a combination of injection molding and machining. The numerically predicted thermal conductivity values range from approximately 14 W/m.K to 16 W/m.K, depending on geometric location and manufacturing process. These values are underpredicted by up to 18% compared with laser flash measurements on physical prototypes manufactured using a combination of injection molding and machining, and are lower than the vendor-reported effective thermal conductivity (i.e., 19–21 W/m.K).","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123242947","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Determination of E, CTE of thin films from curvature measurement 用曲率法测定薄膜的E、CTE

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926213

S. Ananiev, M. Schneegans

引用次数: 0

SnS monolayer as gas sensors: Insights from a first-principles investigation 作为气体传感器的单层SnS:来自第一性原理研究的见解

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926281

F. Hu, Chun-Jian Tan, H. Ye, Xianping Chen, Guoqi Zhang

{"title":"SnS monolayer as gas sensors: Insights from a first-principles investigation","authors":"F. Hu, Chun-Jian Tan, H. Ye, Xianping Chen, Guoqi Zhang","doi":"10.1109/EUROSIME.2017.7926281","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926281","url":null,"abstract":"Using the first-principle calculations with density functional theory (DFT), we investigate systematically the adsorption of small gas molecules (CO, NH3, SO2 and NO2) on monolayer SnS. The energetics, charge transfer are obtained. We determine the styles of molecule doping, and discuss the nature of interaction mechanism between gas molecules and SnS sheet. According to the calculated results, the adsorption of the specified molecules except SO2 gas on monolayer SnS is a physisorption process with moderate adsorption energy and charge transfer, while SO2 is chemsisorption. CO, SO2 and NO2 act as charge acceptors for the monolayer while NH3 which is found to be charge donors. The results show that the sensing performance of SnS is superior to other layered materials such as graphene and phosphorene. The optical properties results exhibit that WFs could be effectively adjusted by selectively adsorbed different gas molecules. These results suggest that monolayer SnS is a promising candidate for gas sensing applications.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123144975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7