2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

{"title":"Nonlocal continuum damage mechanics approach in the Finite Element simulation of lead-free solder joints","authors":"Y. Maniar, B. Métais, M. Kuczynska, A. Kabakchiev, P. Binkele, S. Schmauder","doi":"10.1109/EUROSIME.2017.7926254","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926254","url":null,"abstract":"Realistic material modelling is at the heart of accurate reliability prognosis of electronics hardware by means of Finite Element (FE) calculations. It is usually achieved on the basis of material testing using standardized samples, where well defined, homogeneous stress states and loading conditions can be realized. Both the deformation behaviour in the initial state, as well as the materials degradation during repetitive loading can then be mapped by calibrated damage mechanics FE-models. Such models employ the calculation of internal damage state variables at integration point level, which are functions of stress, strain, time and temperature. However, in the simulation of real components accommodating inhomogeneous stress states due to their complex geometries, damage localization effects can take place. As reported in previous works, local enhancement of damage variables at integration points and significant impact of the FE-mesh quality on the results are commonly obtained in the simulations. Such numerical features can hamper the applicability of damage mechanics models derived from standard material testing samples onto real solder joints geometries. In order to overcome mesh dependency and localization of damage evolution, we adopt a spatial weighted averaging of the damage state variable in a visco-plastic Chaboche material model. This approach overcomes the numerical localization of damage on discrete numerical points and is often referred to as nonlocal damage concept. Here, we highlight the algorithm of nonlocal damage calculation at integration point level, which we implemented for the use in a commercial FE software package. We achieve a spatial damage distribution on a finite microscopic scale with the aim to resemble the physical material degradation, known to happen on the scale of microscopic cracks, grain and grain-boundary modifications. Finally, we discuss the advantages and implications of the nonlocal damage approach on the basis of the damage evolution obtained by simulations of a Low Cycle Fatigue (LCF) specimen.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122629047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Fin-tube and plate heat exchangers — Evaluation of transient performance","authors":"I. Belov, Andréas Nordh, K. Salomonsson, P. Leisner","doi":"10.1109/EUROSIME.2017.7926214","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926214","url":null,"abstract":"A methodology for evaluation of transient performance of, and comparison between plate heat exchanger and plate-fin-and-tube heat exchanger was developed and realized, including experiment and 3-D simulation. Heat transfer from water to a gas medium was addressed. The heated gas volume was the same for both heat exchanger designs. This was achieved by placing the plate-fin-and-tube heat exchanger into enclosure. The volume average temperature of the gas as function of time was computed. Estimated material cost for the studied designs was at least seven times lower than for the stainless steel plate heat exchanger. The performance of the selected plate-fin-and-tube heat exchanger design was found comparable to the plate heat exchanger, when both fin and tube materials were set to Al, and the enclosure was a light-weight thermal insulator. Transient behavior of the studied heat exchangers should be of interest for micro-grid applications, but also for thermal management in electronic cabinets and data centers.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116365950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Predictive reliability with signal based meta-models","authors":"S. Kunath, V. Bayer, R. Niemeier","doi":"10.1109/EUROSIME.2017.7926255","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926255","url":null,"abstract":"The development of algorithms and models to be used for prediction of the reliability and health monitoring of components and sensors is of great importance in aerospace, automotive and power generation industry. For this purpose metamodels have been developed that are based on physical simulations and that are able to quantify the impact of uncertainties on system behavior. These surrogate metamodels for time dependent signals can approximate the failure behavior and detect symptoms of aging. Furthermore, the prediction which input parameter combination can be run by the measurement setup without risk of failure or break in testing is an important application. Our approach has been validated for a high lift system in the aerospace industry.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131154836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design of high voltage 140×100 footprint IGBT module","authors":"Daohui Li, M. Packwood, Fang Qi, Steve Jones, X. Dai","doi":"10.1109/EUROSIME.2017.7926270","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926270","url":null,"abstract":"A new type of novel high voltage IGBT module package with a 140mm×100mm footprint half-bridge has been developed. The module aims to provide the market a new type of high power density, high reliability standardised package. The module is scalable and suitable for multi-module parallel connection without degradation, is a low inductance design for both the internal structure and external connection, and has balanced current distribution at internal substrate level and module level, etal. At the design and sample build stage, new types of electromagnetic (EM), electrical circuitry, thermal, mechanical simulation techniques have been used to verify the design to speed up the development cycle.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125686117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study","authors":"Hongyu Tang, H. Ye, Xianping Chen, Xuejun Fan, Guoqi Zhang","doi":"10.1109/EUROSIME.2017.7926247","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926247","url":null,"abstract":"Heat transfer across thermal interface material, such as graphene-polymer composite, is a critical issue for microelectronics thermal management. To improve its thermal performance, we use chemical functionalization on the graphene with hydrocarbon chains in this work. Molecular dynamics simulations are used to identify the thermal conductivity of monolayer graphene and graphene-polymer nanocomposites with and without grafted hydrocarbon chain. The influence of functionalization with hydrocarbon chains on the interfacial thermal conductance of graphene-polyethylene nanocomposites was investigated using a non-equilibrium molecular dynamics (NEMD) simulation. We also study the effects of the graft density (number of hydrocarbon chain) on the thermal conductivity of graphene and the nanocomposite.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126263963","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Air-coupled PMUT at 100 kHz with PZT active layer and residual stresses: Multiphysics model and experimental validation","authors":"G. Massimino, L. D'Alessandro, F. Procopio, R. Ardito, M. Ferrera, A. Corigliano","doi":"10.1109/EUROSIME.2017.7926253","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926253","url":null,"abstract":"In this paper a complete Multiphysics modelling via the Finite Element Method (FEM) of an air-coupled Piezoelectric Micromachined Ultrasonic Transducer (PMUT) is described, with its experimental validation related to the mechanical and acoustic responses.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129181010","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The onset of plastic flow in copper materials used for rigid and flexible PCB","authors":"S. Wiese, F. Kraemer, J. Al Ahmar","doi":"10.1109/EUROSIME.2017.7926240","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926240","url":null,"abstract":"The study focused on the onset of plastic flow in various copper raw materials. The tested copper sheets varied by the way they were manufactured (e.g. electroplated, cold rolled), by post treatments (e.g. chromate coating) or by pre ageing. Tests were conducted at different temperatures (25°C, 60°C, 100°C, 150°C). The results show that the onset of plastic flow depends strongly on the manufacturing condition of the copper materials. Microstructural investigations were carried out in order to correlate the particular mechanical behaviour with established knowledge about copper as a fcc material. The paper will point out how certain properties of the copper sheets relate to the onset of plastic flow.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126149553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor","authors":"J. Auersperg, C. Collet, T. Dean, D. Vogel, T. Winkler","doi":"10.1016/j.microrel.2016.07.084","DOIUrl":"https://doi.org/10.1016/j.microrel.2016.07.084","url":null,"abstract":"","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115197694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}