2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第8页

Nonlinear modeling and characterization of a thermally driven MEMS actuator with a folded spring reference beam 具有折叠弹簧参考梁的热驱动MEMS致动器的非线性建模与表征

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926251

Shahabeddin Vamegh Estahbanati, M. Bakri-Kassem, R. Dhaouadi

引用次数: 1

Transfer function order reducing method for successive network reduction in complex frequency space 复频率空间中连续网络降阶的传递函数降阶方法

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926265

M. Németh, Péter Pálovics, A. Poppe

引用次数: 1

Modelling and design of Micro-Opto-Mechanical Pressure Sensors in the presence of residual stresses 残余应力存在下的微光机械压力传感器建模与设计

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926285

V. Rochus, R. Jansen, R. Haouari, B. Figeys, V. Mukund, F. Verhaegen, J. Goyvaerts, P. Neutens, J. O Callaghan, A. Stassen, S. Lenci, X. Rottenberg

引用次数: 3

Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints 焊点热循环过程中原位力和位移监测的加速寿命测量

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926287

R. Metasch, M. Roellig, M. Kuczynska, N. Schafet, U. Becker, K. Meier, I. Panchenko

引用次数: 3

IR imaging of laser structures for thermal control of Photonics Integrated circuits (PICs) 用于光子集成电路热控制的激光结构红外成像

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926228

N. Richardson, J. Punch, E. Dalton, Marian Carroll

{"title":"IR imaging of laser structures for thermal control of Photonics Integrated circuits (PICs)","authors":"N. Richardson, J. Punch, E. Dalton, Marian Carroll","doi":"10.1109/EUROSIME.2017.7926228","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926228","url":null,"abstract":"The Thermally Integrated Smart Photonics Systems (TIPS) H2020 project aims to develop a solution to meet the significant demands of data traffic growth, by designing a scalable, thermally-enabled, 3D integrated optoelectronic platform. Micro-thermoelectric coolers (TECs) and microfluidics will be integrated with optoelectronic devices to precisely control device temperature, and thus device wavelength. To understand the thermal-hydraulic behaviour of micro-scale heat exchangers, a range of exchanger geometries will be characterised hydraulically (via manometry and velocimetry) and thermally (via infra-red imaging). This paper will discuss the optical and thermal characterisation of existing active laser devices using infra-red imaging in order to obtain a baseline thermal resistance for the development of the heat exchangers. Thermographs of existing active devices were recorded to determine the thermal characteristics of the laser structure and the spatial temperature variation across the laser surface. The increase in temperature of an active laser as a function of dissipated power was found to be linear at 45°C/W. Repeatability and laser-to-laser variation tests showed good agreement. The spatial temperature variations in the x- and y- directions were ±8°C and ±3°C of the mean temperature, respectively. An understanding of the thermal characteristics of existing laser devices will allow for appropriate testing of the viability of microfluidic heat exchangers as coolers for micro-TECs.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131337657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus NO和H2S吸附砷磷的电学和光学性质

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926283

Yingying Zhang, K. Zheng, Xianping Chen, Guoqi Zhang, Lian Liu, Chun-Jian Tan, Qun Yang, Junke Jiang, H. Ye

引用次数: 0

Thermal simulation of hybrid circuits with variable heat transfer coefficient 变传热系数混合电路的热模拟

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926266

T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski

引用次数: 2

Life prediction of lead alloy based on multi-failure criteria 基于多失效准则的铅合金寿命预测

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926217

K. Jankowski, A. Wymyslowski

{"title":"Life prediction of lead alloy based on multi-failure criteria","authors":"K. Jankowski, A. Wymyslowski","doi":"10.1109/EUROSIME.2017.7926217","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926217","url":null,"abstract":"The aim of the study is to carrying out a series of experimental reliability tests for lead solder alloy Sn63Pb37 regarding to the so-called model of damage accumulation. In spite of Sn63Pb37 is prohibited in mostly cases by RoHS directive it is still used in lots of electronic devices which have influence on human life safety e.g. life-support machines, airplanes etc. That's why authors decided to examine the behavior of this solder alloy. Obviously the proposed method can be also used with lead-free solder alloys as well. The research is concerned on an identification of important solder alloys parameters and properties, which determine the description of solder joints reliability, especially in the microscale. In order to extract an essential properties of solder alloy, measurements will be executed mainly for the analysis of conventional individual failure modes i.e. creep, fatigue. Additionally an integrated mode, typical for the multi-failure criteria, i.e. creep plus fatigue, will be taken into account, which helps studying an appropriate model of damage accumulation and thereby for more accurate analysis and reliability forecasting due to an existence of multi-failure modes. A confirmation of the validity of the above-mentioned hypothesis is that results and tests, performed by the authors, indicate a significance of multi-failure on behavior and reliability parameters solder alloys in microscale. This requires a development of appropriate models and measuring techniques what will effect in improved quality of solder joints used in modern electronic devices. Thereby it will be able to increase the lifespan, i.e. reliability of these electronic devices, which are used in the processes under severe ambient conditions (dust, high humidity, high temperatures, mechanical stress), e.g. medical, automotive, military or airport industry.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134253760","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A practical application of the response surface methodology to power electronics failure prediction 响应面法在电力电子系统故障预测中的实际应用

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926231

A. Renaud, E. Woirgard

引用次数: 0

Theoretical and experimental study of thermal resistance & temperature distribution in high-power AlGaInN LED arrays 大功率AlGaInN LED阵列热阻及温度分布的理论与实验研究

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926232

A. Chernyakov, A. Aladov, A. L. Zakgeim, M. N. Mizerov, V. Ustinov, I. A. Kalashnikov, A. Gavrikov, V. Smirnov, V. Sergeev

{"title":"Theoretical and experimental study of thermal resistance & temperature distribution in high-power AlGaInN LED arrays","authors":"A. Chernyakov, A. Aladov, A. L. Zakgeim, M. N. Mizerov, V. Ustinov, I. A. Kalashnikov, A. Gavrikov, V. Smirnov, V. Sergeev","doi":"10.1109/EUROSIME.2017.7926232","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926232","url":null,"abstract":"The driving current, chip area of high-power AlGaInN light emitting diodes (LEDs) and the level of integration of LED arrays are continuously increased to provide ever higher output light flux. The new developments require more attention to pay to the thermal management of LEDs, commonly assessed in terms of the thermal resistance. Temperature distribution in a LED array and its effect on the chip thermal resistance has been studied both theoretically and experimentally. The thermal measurements were performed with the help of a temperature-sensitive parameter - forward voltage drop on the p-n junction under the action of heating current. Two methods of heat exciting were used: step-like or harmonically pulse-width modulated heating current. Analysis of forward voltage relaxation at transient thermal processes allows determination of thermal impedance components corresponding to the structural elements of the LEDs and arrays. The temperature distribution in the LED array predicted by coupled simulations of the heat transfer agrees well with the experimental measured temperature mapping by the IR-microscopy.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131287148","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0