变传热系数混合电路的热模拟

T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski
{"title":"变传热系数混合电路的热模拟","authors":"T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski","doi":"10.1109/EUROSIME.2017.7926266","DOIUrl":null,"url":null,"abstract":"This paper demonstrates, based on a practical example of a test hybrid circuit, the importance of proper modeling of the heat transfer coefficient dependence on the surface temperature rise and fluid velocity in air cooled electronic systems. Hybrid circuits usually have large surface area and consequently important temperature gradients could occur in them, hence the local values of the heat transfer coefficient might differ considerably. In order to show the significance of the problem, dynamic thermal responses of the test circuit were measured for various dissipated power levels and air velocities. The measurement results allowed then the generation of compact thermal models. Owing to the fact that these models take into account the variation of heat transfer coefficient value with cooling conditions, it was possible to increase significantly the accuracy of thermal simulations.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"84 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Thermal simulation of hybrid circuits with variable heat transfer coefficient\",\"authors\":\"T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski\",\"doi\":\"10.1109/EUROSIME.2017.7926266\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper demonstrates, based on a practical example of a test hybrid circuit, the importance of proper modeling of the heat transfer coefficient dependence on the surface temperature rise and fluid velocity in air cooled electronic systems. Hybrid circuits usually have large surface area and consequently important temperature gradients could occur in them, hence the local values of the heat transfer coefficient might differ considerably. In order to show the significance of the problem, dynamic thermal responses of the test circuit were measured for various dissipated power levels and air velocities. The measurement results allowed then the generation of compact thermal models. Owing to the fact that these models take into account the variation of heat transfer coefficient value with cooling conditions, it was possible to increase significantly the accuracy of thermal simulations.\",\"PeriodicalId\":174615,\"journal\":{\"name\":\"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"84 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2017.7926266\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2017.7926266","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文通过一个测试混合电路的实例,论证了在风冷电子系统中,正确建模传热系数随表面温升和流体速度变化的重要性。混合电路通常具有较大的表面积,因此其中可能出现重要的温度梯度,因此传热系数的局部值可能相差很大。为了说明该问题的重要性,在不同的耗散功率水平和空气速度下,测量了测试电路的动态热响应。测量结果允许然后生成紧凑的热模型。由于这些模型考虑了传热系数值随冷却条件的变化,因此可以显著提高热模拟的准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal simulation of hybrid circuits with variable heat transfer coefficient
This paper demonstrates, based on a practical example of a test hybrid circuit, the importance of proper modeling of the heat transfer coefficient dependence on the surface temperature rise and fluid velocity in air cooled electronic systems. Hybrid circuits usually have large surface area and consequently important temperature gradients could occur in them, hence the local values of the heat transfer coefficient might differ considerably. In order to show the significance of the problem, dynamic thermal responses of the test circuit were measured for various dissipated power levels and air velocities. The measurement results allowed then the generation of compact thermal models. Owing to the fact that these models take into account the variation of heat transfer coefficient value with cooling conditions, it was possible to increase significantly the accuracy of thermal simulations.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信