Design of high voltage 140×100 footprint IGBT module

A new type of novel high voltage IGBT module package with a 140mm×100mm footprint half-bridge has been developed. The module aims to provide the market a new type of high power density, high reliability standardised package. The module is scalable and suitable for multi-module parallel connection without degradation, is a low inductance design for both the internal structure and external connection, and has balanced current distribution at internal substrate level and module level, etal. At the design and sample build stage, new types of electromagnetic (EM), electrical circuitry, thermal, mechanical simulation techniques have been used to verify the design to speed up the development cycle.