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Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2016-09-01 DOI:10.1016/j.microrel.2016.07.084
J. Auersperg, C. Collet, T. Dean, D. Vogel, T. Winkler
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残余应力对航空电子MEMS压力传感器开裂和分层风险的影响
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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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