2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第2页

Strength characterization of TEOS and FTEOS interlayer dielectric materials to compare fracture risk in die stack by 3D FE simulation approach 采用三维有限元模拟方法对TEOS和FTEOS层间介质材料进行强度表征，比较模具堆的断裂风险

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926241

N. Lakhera, J. Howell, Scott Kipperman, Evan Welsh, I. Schmadlak

{"title":"Strength characterization of TEOS and FTEOS interlayer dielectric materials to compare fracture risk in die stack by 3D FE simulation approach","authors":"N. Lakhera, J. Howell, Scott Kipperman, Evan Welsh, I. Schmadlak","doi":"10.1109/EUROSIME.2017.7926241","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926241","url":null,"abstract":"Interlayer dielectric (ILD) fracture was investigated to better understand and mitigate failures in the interconnect systems of wafer back-end-of-line (BEOL) stacks. Variation in strength can cause fracture or delamination flaws resulting in reliability issues in the final product due to chip-package interactions (CPI). This study developed means to identify potential strength weaknesses induced during wafer processing. The ILD material has significant impact of introducing weaknesses during wafer production. In this study, two very common ILD materials, tetraethyl orthosilicate (TEOS) and fluorinated tetraethyl orthosilicate (FTEOS) were compared with respect to their fracture toughness in a wafer stack. A combination of mechanical testing, mechanical modeling and simulation were performed to identify fracture parameter of the particular bulk materials and material interfaces, translate them into fracture stresses and compare different BEOL structures with respect to their potential fracture risk. To estimate the critical fracture stress, a simple 2D Finite Element Analysis (FEA) was conducted. In a second step a much more complex 3D sub-modelling approach was used to investigate the specific differences of die locations with respect to fracture risk and considered the BEOL stack metal layout in greater detail. The simulations used stress-based as well as energy-based parameters for comparison. The simulation results showed the correct trend in failure risk as observed in failure analysis.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127036946","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks 标准铝铜厚金属轨道与高鲁棒性铝铜厚金属轨道的仿真对比研究

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926226

R. Sethu, V. Hein, M. Erstling, K. Weide-Zaage

引用次数: 6

Modelling of thermal aging of Moulding Compound by using an equivalent layer assumption 基于等效层假设的模塑复合材料热老化模型

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926271

Bingbing Zhang, A. Lion, M. Johlitz, L. Ernst, K. Jansen, D. Vu, L. Weiss

{"title":"Modelling of thermal aging of Moulding Compound by using an equivalent layer assumption","authors":"Bingbing Zhang, A. Lion, M. Johlitz, L. Ernst, K. Jansen, D. Vu, L. Weiss","doi":"10.1109/EUROSIME.2017.7926271","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926271","url":null,"abstract":"Currently, the use of electronic components for automotive and aerospace applications is developing quickly. More and more components will be exposed to harsh environments, such as high temperature and high moisture. In general, this high temperature is always above the glass transition temperature (Tg) of the encapsulation material, being Epoxy Molding Compound (EMC). EMC exposed to high temperature could induce reliability problems of components due to changes of its material properties accompanied with volume shrinkage. Therefore, the characterization and modelling of the aging process in EMCs during high-temperature conditions has become an important issue. In our previous work [1], the characterization methods to obtain the material properties as function of aging time were discussed and introduced. The present work focuses on a new and efficient method to model the impact of the aging process of EMCs on the warpage and the stress state of a package using FEM simulation. Here, an “equivalent layer” model, which includes a fully oxidized layer and an unaged core, is applied to simplify the modelling of the thermal aging effects. The current thickness of the “equivalent oxidized layer” is obtained by combining the experimental results and numerical analyses of properly chosen samples. At the end of the paper the aging shrinkage is estimated by using the equivalent thickness concept.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116456424","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Vibration investigation in power module busbar design 电源模块母线设计中的振动研究

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926276

M. Packwood, Daohui Li, Xiapoing Dai, Steve Jones

引用次数: 1

The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures 蓝色磷烯/g- iii -氮化物异质结构中有趣的电子和光学性质调制

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926299

Qun Yang, Chun-Jian Tan, H. Ye, Xianping Chen, Guoqi Zhang

{"title":"The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures","authors":"Qun Yang, Chun-Jian Tan, H. Ye, Xianping Chen, Guoqi Zhang","doi":"10.1109/EUROSIME.2017.7926299","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926299","url":null,"abstract":"In this work, the structural, electronic and optical properties of blue phosphorene (BP) and graphene-like III-nitrides, denoted as g-XN (AlN and GaN) nanocomposites are investigated by the first-principles method. Our results unveil that the hybridized BP/g-XN bilayers exhibit a decreased band gap. We also find that the optically active states of the maximum valence and minimum conduction bands are localized on opposite monolayers, leading to electrons and holes spontaneously separated, which enhances the photocatalytic efficiency. More interestingly, despite of the indirect band gap nature of the BP and g-AlN monolayers, BP/g-AlN heterostructure in most energetic preferable pattern exhibits a moderate direct band gap. The BP/g-XN heterobilayers also exhibit a significant improved visible light and UV adsorption peak, comparable or even superior to pristine BP, and the superior optical properties is robust, independent of stacking pattern. Therefore, the g-XN layers can be an excellent solution to protect the BP layer from its degradation in ambient conditions. We predict that such effective electronic band gap engineering, together with intriguing optical properties, point toward the potential of BP/g-XN heterobialyers for applications in a variety of nanodevices.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133562405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Thermo-mechanical properties of ABS parts fabricated by fused deposition modeling and vapor smoothing 采用熔融沉积建模和蒸汽平滑制备ABS零件的热力学性能

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-03 DOI: 10.1109/EUROSIME.2017.7926222

Sung-Uk Zhang, Jonghyeuk Han, Hyun-Wook Kang, B. Shin

{"title":"Thermo-mechanical properties of ABS parts fabricated by fused deposition modeling and vapor smoothing","authors":"Sung-Uk Zhang, Jonghyeuk Han, Hyun-Wook Kang, B. Shin","doi":"10.1109/EUROSIME.2017.7926222","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926222","url":null,"abstract":"FDM is one of the popular 3D printing technologies due to an inexpensive extrusion machine and multi-material printing. However, FDM could only use thermoplastics such as ABS and PLA and has a problem related to the post-processing. In this study, we measured the mechanical property of ABS parts fabricated by FDM and the vapor smoothing technique which is one of the post-processing methods. Using dynamic mechanical analysis (DMA) and dilatometer, we observed temperature-dependent storage modulus and CTE for specimens varying with amount of acetone in the vapor smoothing process. In result, we could not observe the effect of the amount of acetone in the given range but differentiate one without the vapor smoothing process and the others with the vapor smoothing process in terms of the storage modulus and CTE. Moreover, we could perform finite element analysis using the measured mechanical properties and make a design guideline for an ABS product. We could conclude that the vapor smoothing process weakens thermal stability of ABS 3D printed parts.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114267042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Prognostics & health management for LED-based applications 基于led应用的预测和健康管理

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926293

W. V. van Driel, B. Jacobs, D. Schenkelaars, M. Klompenhouwer, R. Poelma, B. El Mansouri, L. Middelburg

引用次数: 0

Topology optimization of a 3D printed acoustic chamber for photoacoustic spectroscopy 用于光声光谱的3D打印声腔拓扑优化

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926292

R. Haouari, V. Rochus, L. Lagae, X. Rottenberg

引用次数: 0

Lead free solder joints characterisation using single lap shear tests 使用单搭接剪切试验表征无铅焊点

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926234

S. Pin, H. Frémont, A. Gracia

{"title":"Lead free solder joints characterisation using single lap shear tests","authors":"S. Pin, H. Frémont, A. Gracia","doi":"10.1109/EUROSIME.2017.7926234","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926234","url":null,"abstract":"The study aims at characterizing the mechanical behaviour of a lead free solder material at a representative scale. The specific alloy considered in this work is SnAg0.3Cu0.5. The test bench comprises a specific single lap shear specimen geometry with grooves associated to a contactless method of monitoring. This allows to test solder joints with a thickness representative of microelectronics applications with good thermal gradients during the reflow process and thus metallurgic properties similar to the ones get with BGA dimensions. The campaign consists in monotonic shear tests and creep tests at 3 different temperatures. An emphasis on the fabrication process and the monitoring data treatment is given in this paper as it can leads to non-consistent results if not managed with precautions due to the reduced scale of the joint. Once the microstructure has been validated, experimental data are used to identify a specific viscoplastic material behaviour. Indeed, the primary creep strain has been found to be significant regarding the common secondary creep rate. Primary creep strain accumulation in cyclic loads could lead to an error of estimation in future predictive calculations if only secondary creep strain was considered as for the former solder materials. It is highlighted by successive creep steps at various stress levels performed in this study. Cyclic hardening has also been investigated but turns to be not relevant to model this particular plastic behaviour. The final set of material coefficients is provided for a full creep behaviour combining primary and secondary creep states coupled with Young's moduli at −40, 25 and 125°C monotonic loads.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124644188","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components 单晶无铅焊点对球栅阵列元件可靠性影响的模拟

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926289

Andreas Lövberg, P. Tegehall, G. Wetter, K. Brinkfeldt, D. Andersson

引用次数: 9