{"title":"Vibration investigation in power module busbar design","authors":"M. Packwood, Daohui Li, Xiapoing Dai, Steve Jones","doi":"10.1109/EUROSIME.2017.7926276","DOIUrl":null,"url":null,"abstract":"The structural response of power module busbars under harmonic loads is considered using finite element method simulation. Simulation parameters and boundary conditions are considered in terms of their effect on the accuracy of simulation results with relation to real life application. Vibrational analysis was found to be highly sensitive to geometry preparation and constraint in terms of both mechanical stress magnitude and location. Overall the simulation process was determined to be a valuable tool in terms of reducing time/cost involved in iteratively designing power module busbars to withstand mechanical vibration with relation to life time application as well as ultrasonic weld process.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2017.7926276","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The structural response of power module busbars under harmonic loads is considered using finite element method simulation. Simulation parameters and boundary conditions are considered in terms of their effect on the accuracy of simulation results with relation to real life application. Vibrational analysis was found to be highly sensitive to geometry preparation and constraint in terms of both mechanical stress magnitude and location. Overall the simulation process was determined to be a valuable tool in terms of reducing time/cost involved in iteratively designing power module busbars to withstand mechanical vibration with relation to life time application as well as ultrasonic weld process.