可选铜柱凸点设计,减少倒装芯片组装过程中产生的热机械应力

M. Lofrano, V. Cherman, Mario Gonzalez, E. Beyne
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引用次数: 2

摘要

在这项工作中,铜柱设计结合了硬金属基座和软聚合物作为缓冲层,已集成在专用测试车辆中,以研究倒装芯片组装过程中引起的热机械应力。在凹凸辅助BEOL稳定性压痕(BABSI)测试中,对专用应力传感器进行了现场电测量,以评估凹凸设计的强度。此外,通过测量和比较应力传感器在封装前后的离子电流,对测试芯片不同区域的封装诱导应力进行监测。通过结合原位电测量和有限元建模,可以量化封装后Si模中引起的应力水平。结果表明,使用刚性底座可以有效地减轻包装引起的应力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly
In this work a Cu pillar design that combines a stiff metal pedestal with a soft polymer as buffer layer has been integrated in a dedicated test vehicle to investigate the thermo mechanical stress induced during flip chip assembly. In-situ electrical measurements of dedicated stress sensors during a Bump Assisted BEOL Stability Indentation (BABSI) test were performed to assess the strength of the bump designs. Furthermore, the package induced stress was monitored in different regions of the test chips by measuring and comparing the ION current of the stress sensors before and after packaging. By combining in-situ electrical measurements and finite element modeling it was possible to quantify the stress level induced in the Si die after packaging. The results show that the use of a stiff pedestal is very efficient to mitigate packaging induced stress.
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