2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第5页

Considerations on pre-stress in a 3D-printed capacitive force/pressure sensor 3d打印电容式力/压力传感器中预应力的考虑

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926279

L. Faller, H. Zangl

引用次数: 7

Adsorption of gases on monolayer GeSe: A first principle study 气体在单层GeSe上的吸附:第一性原理研究

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926280

Lian Liu, Qun Yang, H. Ye, Xianping Chen, Guoqi Zhang

引用次数: 7

A laser speckle photometry based non-destructive method for measuring stress conditions in direct-copper-bonded ceramics for power electronic application 基于激光散斑光度法的电力电子用直接铜结合陶瓷应力条件无损测量方法

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926273

S. Muench, M. Roellig, U. Cikalova, B. Bendjus, L. Chen, S. Sudip

{"title":"A laser speckle photometry based non-destructive method for measuring stress conditions in direct-copper-bonded ceramics for power electronic application","authors":"S. Muench, M. Roellig, U. Cikalova, B. Bendjus, L. Chen, S. Sudip","doi":"10.1109/EUROSIME.2017.7926273","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926273","url":null,"abstract":"Power electronic applications come along with very high requirements in terms of reliability. Thermal loadings stress whole electronic packages while powering the semiconductor and by environmental temperature changes. Direct copper bonding (DCB) substrates are widely used in electronic applications due to its high thermal conductivity performance. They consists of copper layers sintered onto an Al2O3-ceramic sheet. Because of the very high process temperature, thermal inducted stresses arise along the substrate while cooling to ambient temperatures. The DCB substrates carry residual stresses usually which are concentrated along the edges of copper structures. Under service condition or even during the electronic manufacturing process the stress concentration might increase and in consequence copper structure rip off the substrate by cracking and conchoidal fractures in the ceramic sheet. To avoid the critical cracking situation the knowledge about the residual stress condition is required. The target will be a stress mapping across the DCB substrate. Within the paper one potential approach to measure the stress condition will be presented.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129871523","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

FEM Simulation of cracks in MLCC during reflow soldering MLCC回流焊裂纹的有限元模拟

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926257

J. Al Ahmar, S. Wiese

引用次数: 7

Understanding and controlling chromaticity shift in LED devices 理解和控制LED器件的色度偏移

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926223

J. Davis, K. Mills, M. Lamvik, C. Perkins, Georgiy, Bobashev, Joseph Young, Robert Yaga, C. Johnson

{"title":"Understanding and controlling chromaticity shift in LED devices","authors":"J. Davis, K. Mills, M. Lamvik, C. Perkins, Georgiy, Bobashev, Joseph Young, Robert Yaga, C. Johnson","doi":"10.1109/EUROSIME.2017.7926223","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926223","url":null,"abstract":"Chromaticity shift in light-emitting diode (LED) devices arises from multiple mechanisms, and at least five different chromaticity shift modes (CSMs) have been identified to date. This paper focuses on the impacts of irreversible phosphor degradation as a cause of chromaticity shifts in LED devices. The nitride phosphors used to produce warm white LEDs are especially vulnerable to degradation due to thermal and chemical effects such as reactions with oxygen and water. As a result, LED devices utilizing these phosphors were found to undergo either a green shift or, less commonly, a red shift depending on the phosphor mix in the LED devices. These types of chromaticity shifts are classified as CSM-2 (green shift) and CSM-5 (red shift). This paper provides an overview of the kinetic processes responsible for green and red chromaticity shifts along with examples from accelerated stress testing of 6″ downlights. Both CSMs appear to proceed through analogous mechanisms that are initiated at the surface of the phosphor. A green shift is produced by the surface oxidation of the nitride phosphor that changes the emission profile to lower wavelengths. As the surface oxidation reaction proceeds, reactant limitations slow the rate and bulk oxidation processes become more prevalent. We found that a red chromaticity shift arises from quenching of the green phosphor, also possibly due to surface reactions of oxygen, which shift the emission chromaticity in the red direction. In conclusion, we discuss the implications of these findings on projecting chromaticity.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117115099","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Uncertainty quantification in polysilicon MEMS through on-chip testing and reduced-order modelling 通过片上测试和降阶建模的多晶硅MEMS中的不确定度量化

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926242

Ramin Mirzazadeh, S. E. Azam, E. Jansen, S. Mariani

{"title":"Uncertainty quantification in polysilicon MEMS through on-chip testing and reduced-order modelling","authors":"Ramin Mirzazadeh, S. E. Azam, E. Jansen, S. Mariani","doi":"10.1109/EUROSIME.2017.7926242","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926242","url":null,"abstract":"In this paper, micro-scale uncertainties affecting the behaviour of microelectromechanical systems (MEMS) are investigated through a mixed numerical/experimental approach. An on-chip test device has been designed and fabricated using standard MEMS fabrication techniques, to deform a (microstructured) polysilicon beam. To interpret the experimental data and also the relevant scatterings in the system response, a high fidelity, parametric finite element (FE) model of the device is developed in ANSYS. Uncertainties in the parameters governing the polysilicon mechanical properties and the geometry of the movable structure are estimated through an inverse analysis. To systematically quantify the uncertainty levels within the realm of a cost-effective statistical analysis, a model order reduction technique based on a synergy of proper orthogonal decomposition (POD) and Kriging interpolation is proposed. The resulting reduced order model is finally fed into a transitional Markov chain Monte Carlo (TMCMC) algorithm for the estimation of the unknown parameters.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131903481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Investigation and optimization of microfluidic flow-through chambers for homogeneous reaction space 均匀反应空间微流控通流室的研究与优化

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926218

Péter Pálovics, M. Rencz

引用次数: 4

Influence of Under Bump Metalization dimensions on passivation nitride stress 凹凸下金属化尺寸对钝化氮化应力的影响

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926225

R. Sethu, S. Kulkarni, H. U. Ha, K. Soon

引用次数: 5

Model order reduction as an integral part of e-mobility development process 模型订单减少作为电动汽车开发过程的一个组成部分

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926301

Thomas Iberer

引用次数: 0

Rapid testing method for interface crack analysis of an adhesive bonded joint using an electrodynamic shaker 用电动振动筛分析粘接接头界面裂纹的快速试验方法

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926246

C. Vernier, M. Dressler, H.-P. Seebich, B. Wunderle

引用次数: 1