2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第4页

Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules 大功率可调色温板载白光LED模组的发光机理分析

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926245

Jiajie Fan, Chaoyi Xie, C. Qian, Xuejun Fan, Guoqi Zhang

{"title":"Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules","authors":"Jiajie Fan, Chaoyi Xie, C. Qian, Xuejun Fan, Guoqi Zhang","doi":"10.1109/EUROSIME.2017.7926245","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926245","url":null,"abstract":"Recently, with the increasing requirements on guaranteeing the color uniformity and improving the luminous efficacy and manufacturing efficiency, a wafer level chip scale packaging (WLCSP) technology has been developed by thermally impressing a thin multiple phosphor film on a LED wafer, then being segmented into individual LED chips. In this paper, a high power white LED Chip-on-Board (COB) module with high color rendering index (CRI, Ra>93) and tunable correlated color temperatures (CCTs) is prepared. In this COB module, the tunable color temperatures are achieved by using two types of white LED WLCSPs with different target CCTs of 3000K and 5000K, and twelve CSPs are mounted in series with the flip-chip soldering technology. The thermal dissipation effect and luminescence mechanism of this COB module are studied through the finite element analysis (FEA) and Monte-Carlo Ray-tracing simulations respectively. The results reveal that: firstly, the measured spectral power distribution (SPD) intensity of the prepared COB module are smaller than the arithmetic sum of SPD intensities of its each series connected CSPs, which may be attribute to the light absorption happened among CSPs. Secondly, the case temperature and driven current have the different effects on the optical and color performances of COB module (such as luminous flux, CCT and CRI).","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122053756","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Fracture probability of MLCC in dependence of solder fillet height MLCC的断裂概率与焊角高度的关系

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926256

J. Al Ahmar, E. Wiss, S. Wiese

引用次数: 5

Effect of voids on crack propagation in AuSn die attach for high-temperature power modules 高温功率模块AuSn模具接头中孔洞对裂纹扩展的影响

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926230

F. Arabi, L. Théolier, T. Youssef, M. Medina, J. Delétage, E. Woirgard

{"title":"Effect of voids on crack propagation in AuSn die attach for high-temperature power modules","authors":"F. Arabi, L. Théolier, T. Youssef, M. Medina, J. Delétage, E. Woirgard","doi":"10.1109/EUROSIME.2017.7926230","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926230","url":null,"abstract":"Eutectic AuSn solder is increasingly used in high reliability and/or high temperature applications where conventional Pb-free solders exhibit insufficient strength, creep resistance, thermal conductivity, and resistance to corrosion. Excessive void presence and growth and irregular phase formation are critical factors governing the solder joint reliability as long as they act as crack initiation sites. As a whole, the thermal resistance of test vehicles assembled using AuSn solder has experienced significant variation during aging [−55/+175]°C. On the other hand, inspection of as-prepared die-attachments by X-ray and SEM (observation of cross-section) showed that the initial voids sizes were increased and a propagation of transverse cracks inside the joint between voids had appeared. In this paper, the joint strength and fracture surface of AuSn solder power assemblies after thermal-aging testing were studied experimentally. Finite-element method (FEM) simulations were performed on the joint to study the influence of the voids size and position on the initiation and propagation of cracks. Simulation results were in good agreement with the experiments. Additional challenges, possibilities, and recommendations for how the reliability of a high-temperature AuSn bonding can be improved are also discussed.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116491471","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Experimental determination of the Young's modulus of various electronic packaging materials 各种电子封装材料杨氏模量的实验测定

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926239

F. Kraemer, M. Roellig, R. Metasch, S. Wiese, J. Al Ahmar, K. Meier

引用次数: 2

Multi-physics models and condition-based monitoring for 3D-Printing of electronic packages 电子封装3d打印的多物理模型和基于状态的监测

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926286

C. Bailey, S. Stoyanov, T. Tilford, G. Tourloukis

{"title":"Multi-physics models and condition-based monitoring for 3D-Printing of electronic packages","authors":"C. Bailey, S. Stoyanov, T. Tilford, G. Tourloukis","doi":"10.1109/EUROSIME.2017.7926286","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926286","url":null,"abstract":"3D-Printing technology, or additive manufacturing, is seeing increased interest in the electronic packaging community as it has the potential to enable cost-effective, potentially high-throughput and high degree of design customisation. At the same time there are a number of challenges related to quality, performance and reliability of the fabricated products. Technological advances and other capabilities to address successfully these challenges are required and need to be developed. This include the development of process models that can be used to predict characteristics of products manufactured with 3D printing techniques. This paper gives an overview of the current state of 3D printing in the context of technology use for electronics packaging. It details in particular the developments made in the modelling for 3D ink-jet printing of packaged electronic components which is taking place in the EU funded project NextFactory (http://www.nextfactory-project.eu). This project is developing an all-in-one manufacturing platform that integrates 3D-printing (multi-material ink-jet), material cure and sintering and micro-assembly technologies for electronic packaging applications. Particular areas of novelty in the presented work relate to: (1) development of Smooth Particle Hydrodynamics solver for ink-jet droplet deposition and coalescence, (2) development of finite element models for predicting deformation and residual stress due to cure shrinkage as each layer is deposited, and (3) development of machine-learning and surrogate modelling based framework for condition-based monitoring of the fabrication process.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124845465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Thermal expansion multi physic simulation methodology for LED headlamps LED大灯热膨胀多物理模拟方法

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926302

H. Mechmeche, Y. Cheng, C. Roucoules, D. Vilette

引用次数: 0

Simulation-driven development of a novel SiC embedded power module design concept 仿真驱动开发一种新型SiC嵌入式电源模块设计理念

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926252

Yafan Zhang, K. Neumaier, Olaf Zschieschang, G. Weis, G. Schmid, M. Bakowski, H. Nee

{"title":"Simulation-driven development of a novel SiC embedded power module design concept","authors":"Yafan Zhang, K. Neumaier, Olaf Zschieschang, G. Weis, G. Schmid, M. Bakowski, H. Nee","doi":"10.1109/EUROSIME.2017.7926252","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926252","url":null,"abstract":"Silicon carbide embedded power modules enable a compact and cost competitive packaging solution for high-switching frequency and high-temperature operation applications. Power module packaging technologies span several engineering domains. At the early design stage, simulation-driven development is necessary to shorten the design period and reduce the design cost. This paper presents a novel design concept of a three-phase embedded power module (1200 V, 20 A, 55 mm × 36 mm × 0.808 mm) including silicon carbide metal-oxide-semiconductor field-effect transistor and antiparallel diode dies. Based on the E/CAD design data different layer built-up designs have been tested against thermal, mechanical, and electrical behavior. The obtained simulation data then have been evaluated against a commercial available power module (Motion Smart Power Module SMP33) which utilizes over mold direct bonded copper substrates with soldered semiconductor dies and bond wire contacts. Compared to the conventional module, the loop conductive interconnection parasitic inductance and resistance of the design concept (Vdc+ to Vdc−) reduces approximately by 88 % and 72 %, respectively. The average junction to case thermal resistance has been improved by approximately more than 10 % even though the total package size reduces by approximately 88 %. Furthermore, the contours of deformation and stresses have been investigated for the design concept in the thermomechanical simulation.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133865746","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Optimization of Through Crackstop via using finite element modeling 通过有限元建模优化通过裂纹停止

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926212

M. Rabie, N. Polomoff

引用次数: 2

Thermal design of monocular vision system used in automotive application 汽车单目视觉系统的热设计

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926243

G. Refai-Ahmed, Hoa Do, A. Raghupathy, Rubab Kadam, J. Gillis

{"title":"Thermal design of monocular vision system used in automotive application","authors":"G. Refai-Ahmed, Hoa Do, A. Raghupathy, Rubab Kadam, J. Gillis","doi":"10.1109/EUROSIME.2017.7926243","DOIUrl":"https://doi.org/10.1109/EUROSIME.2017.7926243","url":null,"abstract":"Advanced driver assistance systems such as Forward Collision Warning or Lane Departure Warning on automobiles rely heavily on a vision-based system. One such system is a monocular camera that is mounted inside the cabin on the center of the windshield. This module has a temperature sensitive FPGA and Image Sensor. The module sees extreme temperature environments due to high solar radiation in the dashboard section of the vehicle. It is important to keep such a system under specified temperatures for reliable functioning and safety. This study presents a detailed methodology to analyze and design thermal management solutions for the automotive camera by factoring in the transient nature of its immediate surroundings. The transient environment that accounts for the temperature drop from the high initial ambient temperatures includes factors such as movement of the vehicle and/or turning on the air conditioner. Experiments help understand the boundary conditions required for the computational thermal analysis and appropriate experimental measurements are taken to define the relevant boundary conditions of the system.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130057661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

The numerical analysis of heat transfer at nanoscale using full and reduced DPL models 采用全DPL模型和简化DPL模型的纳米尺度传热数值分析

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI: 10.1109/EUROSIME.2017.7926261

T. Raszkowski, A. Samson, M. Zubert, M. Janicki, A. Napieralski

引用次数: 6