Optimization of Through Crackstop via using finite element modeling

Abstract

The ability of Through Crackstop Via (TCV) to prevent cracks from propagation is compared to conventional crackstop using a novel systematic simulation methodology. The design of TCV is, then, optimized by varying the angle between the metal layers as well as the TCV width. The larger angle and width result in a better TCV. The improvement in the TCV saturates at a specific TCV width.