Experimental determination of the Young's modulus of various electronic packaging materials

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI:10.1109/EUROSIME.2017.7926239

F. Kraemer, M. Roellig, R. Metasch, S. Wiese, J. Al Ahmar, K. Meier

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引用次数: 2

Abstract

The paper presents details about the adequate experimental determination of the Young's modulus on miniaturized specimens for material used in electronic packaging. The difficulty to determine accurately the Young's modulus is caused by the requirements of representative specimens for the area of electronic packaging. In many cases such specimens, e.g. solder balls, are connected with the issues of inhomogeneous stress distributions, small dimensions, or special gripping requirements, that create a number of challenges to conduct mechanical experiments. In addition there are problems that arise from the nonlinearities in the constitutive behaviour of the material to be characterized, such as creep deformation. Therefore any attempt to accurately determine the Young's modulus needs a case to case consideration of the specific issues for the given specimen and material.

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各种电子封装材料杨氏模量的实验测定

本文详细介绍了用于电子封装材料的微型化样品上杨氏模量的充分实验测定。准确测定杨氏模量的困难是由于电子封装领域对代表性试样的要求。在许多情况下，这样的样品，例如焊料球，与应力分布不均匀，尺寸小或特殊夹持要求的问题有关，这给进行机械实验带来了许多挑战。此外，还有一些问题是由要表征的材料的本构行为的非线性引起的，例如蠕变变形。因此，任何准确确定杨氏模量的尝试都需要对给定试样和材料的具体问题进行具体的考虑。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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