MLCC回流焊裂纹的有限元模拟

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI:10.1109/EUROSIME.2017.7926257

J. Al Ahmar, S. Wiese

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引用次数: 7

摘要

本文介绍了多层陶瓷电容器裂纹的有限元模拟和统计分析结果。分析的主要目的是验证mlcc弯曲实验的结果，主要是焊料类型对陶瓷体断裂敏感性和断裂形式的影响。该模型还考虑了电容器在烧制和焊接过程中产生的预应力及其失效机理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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FEM Simulation of cracks in MLCC during reflow soldering

This paper presents results of FEM Simulation and a statistical analysis for cracks in Multilayer Ceramic Capacitors (MLCCs). The main objective of the analysis is to validate the results of bending experiments on MLCCs and mainly the influence of solder type on fracture susceptibility and fracture form in ceramic body. The model also considers the prestresses occurring in the capacitor during firing and soldering process and their corresponding failure mechanisms.

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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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