凹凸下金属化尺寸对钝化氮化应力的影响

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2017-04-01 DOI:10.1109/EUROSIME.2017.7926225

R. Sethu, S. Kulkarni, H. U. Ha, K. Soon

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引用次数: 5

摘要

由于热应力导致的焊料凸起附近的模具钝化裂纹可能导致多种故障，包括焊盘提升。修改焊料回流温度-时间曲线并非易事，因为这可能会影响焊料球的冶金性能。在这项工作中，利用有限元分析(FEA)和响应面法(RSM)优化了凹凸金属化(UBM)的尺寸，以获得氮化硅(Si3N4)钝化层的最低第一主应力。有限元优化得到的最小应力值在RSM预测的置信区间内。

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Influence of Under Bump Metalization dimensions on passivation nitride stress

Cracks in die passivation adjacent to solder bumps due to thermal stress can lead to a multitude of failures including bond pad lifting. Modifying the solder reflow temperature-time profile is not trivial as this may impact the metallurgical properties of the solder ball. In this work, Under Bump Metalization (UBM) dimensions were optimized using finite element analysis (FEA) and response surface methodology (RSM) to obtain the lowest first principal stress for the Silicon Nitride (Si3N4) passivation layer. The optimized minimum stress value using FEA was well within the confidence interval predicted using RSM.

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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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