FEM Simulation of cracks in MLCC during reflow soldering

Abstract

This paper presents results of FEM Simulation and a statistical analysis for cracks in Multilayer Ceramic Capacitors (MLCCs). The main objective of the analysis is to validate the results of bending experiments on MLCCs and mainly the influence of solder type on fracture susceptibility and fracture form in ceramic body. The model also considers the prestresses occurring in the capacitor during firing and soldering process and their corresponding failure mechanisms.