Journal of Micromechanics and Microengineering最新文献_第10页

Bottom-up micromachined PZT film-based ultrasonic microphone with compressible parylene tube 基于PZT薄膜的自底向上微机械可压缩聚对二甲苯管超声传声器

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-08-09 DOI: 10.1088/1361-6439/acee89

Chung-Hao Huang, G. Feng

{"title":"Bottom-up micromachined PZT film-based ultrasonic microphone with compressible parylene tube","authors":"Chung-Hao Huang, G. Feng","doi":"10.1088/1361-6439/acee89","DOIUrl":"https://doi.org/10.1088/1361-6439/acee89","url":null,"abstract":"This paper reports on a micromachined ultrasonic microphone using a bottom-up fabrication scheme. Starting with a 4 μm-thick titanium foil as the substrate, each functional film and key element was added to the foil substrate to complete the ultrasonic microphone. The piezoelectric lead zirconate titanate film hydrothermally grown on the patterned substrate with low residual stress effectively deflected the unimorph-sensing cantilever array of the microphone under ultrasound pressure. The created cantilever array structure secured on a 250 μm-thick SU8 hollow plate formed an ultrasonic microphone plate that was tested with a sensitivity of −60 dBV Pa−1 at 21 kHz (with 0 dB gain amplification) and an operation bandwidth of 5–55 kHz. Different thicknesses of parylene films ranging from 0.5 to 2 μm overlaid over the entire sensing region and converted the cantilever-to-diaphragm-structured microphone for further investigation. An enhanced result was observed when the deposited parylene film thickness was in the submicron range. The sensitivity of the microphone can be further enhanced by up to 33% by adding a parylene-film-made compressible tube to act as a Helmholtz resonator (HR). The HR model was discussed and compared with the experimental results. The output amplitude of the developed microphone assembled with the compressible tube demonstrates a 15 dB increase compared to that of a commercial capacitive MEMS ultrasonic microphone.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":" ","pages":""},"PeriodicalIF":2.3,"publicationDate":"2023-08-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49003953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Flexible pressure/temperature sensors with heterogeneous integration of ultra-thin silicon and polymer 超薄硅和聚合物异质集成柔性压力/温度传感器

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-08-09 DOI: 10.1088/1361-6439/acee8b

Weiwen Feng, Peng Li, Haozhi Zhang, Ke Sun, Wei Li, Xinxin Li

{"title":"Flexible pressure/temperature sensors with heterogeneous integration of ultra-thin silicon and polymer","authors":"Weiwen Feng, Peng Li, Haozhi Zhang, Ke Sun, Wei Li, Xinxin Li","doi":"10.1088/1361-6439/acee8b","DOIUrl":"https://doi.org/10.1088/1361-6439/acee8b","url":null,"abstract":"Flexible pressure sensors and temperature sensors are widely used in various fields because of their advantages in high flexibility, good shape retention and extremely small thickness. However, it is quite challenging to fabricate ultra-thin flexible pressure sensors with reliable sensing performance. In this work, we propose a new type of silicon–polymer heterogeneously integrated MEMS flexible sensor with an ultra-thin silicon-based absolute pressure sensing element and a thermistor. In the study, a flexible MEMS fabrication process is developed, which enables simultaneous fabrication in two different substrates and self-release of the thin and slim flexible sensor. The front-end section of the flexible sensor is with the width as 125 μm, length as 3.2 cm and total thickness as 12 μm, where the integrated silicon substrate thickness is only 3 μm. The sensor takes a slender shape to allow for medical invasive measurement by inserting it into a slim medical catheter or a syringe needle-tube. The sensitivity of the fabricated ultra-thin absolute pressure sensor is tested as 45.2 μV kPa−1 under 3.3 V supplied voltage, with the nonlinearity as only ±0.16% FS. The sensitivity of the thermistor is 10.4 Ω °C−1 in the range of 0 °C–100 °C. Moreover, the polysilicon thermistor can also serve as a micro-heater, where an electric heating power of 107 μW results in a temperature increase of 13.5 °C. With ultra-thin slim structure and satisfactory performance, the MEMS flexible sensor is promising in various fields like biomedical applications.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":" ","pages":""},"PeriodicalIF":2.3,"publicationDate":"2023-08-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46272677","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Design and research of a valve-based piezoelectric pump with low forward resistance and high reverse shutoff 低正向阻力高反向关断阀基压电泵的设计与研究

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-08-02 DOI: 10.1088/1361-6439/acec7f

Yong Zhang, Jinyu Li, Xiaoliang Wang, Junqing Shao, Shanlin Liu, Qiaosheng Pan

引用次数: 0

A novel multi-axis pendulum sandwich structure accelerometer 一种新型多轴摆夹芯结构加速度计

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-08-02 DOI: 10.1088/1361-6439/acec7e

Zhenyu Wei, C. Si, G. Han, Y. Zhao, Jin Ning, L. Jia, Y. Zeng, Fuhua Yang

{"title":"A novel multi-axis pendulum sandwich structure accelerometer","authors":"Zhenyu Wei, C. Si, G. Han, Y. Zhao, Jin Ning, L. Jia, Y. Zeng, Fuhua Yang","doi":"10.1088/1361-6439/acec7e","DOIUrl":"https://doi.org/10.1088/1361-6439/acec7e","url":null,"abstract":"This paper proposes a new scheme of pendulum accelerometer with sandwich structure. In this scheme, the electrical signal on the mass is connected to the wafer surface through glass isolated through-silicon-via (TSV), so that the basic characteristics of the accelerometer can be obtained by wafer-level testing. Compared with the current commercial device process scheme, the packaging and testing cost of the device can be greatly reduced. The glass-in-silicon (GIS) encapsulation caps on both sides of the device are prepared by glass isolated TSV and GIS reflow process. By designing the shape and size of the silicon electrode area and glass area of the GIS caps, the parasitic capacitance between the pendulum structure and the fixed electrode is reduced. Another advantage of using TSV to extract the electrical signal of the mass is that the Z-axis inertial force can be detected when the pendulum structure is placed perpendicular to the direction of gravity acceleration. In addition, electrodes are grown on the side of the split device, and when the pendulum structure is placed parallel to the direction of gravity acceleration, the inertial force of the XY-axis can be detected. The test shows that when the range of the pendulum accelerometer based on this scheme is ±2 g, the noise density of the accelerometer is 42 μg √Hz−1 (X-axis), 40 μg √Hz−1 (Y-axis) and 27 μg √Hz−1 (Z-axis), and the bias instability is 6.6 μg (X-axis), 7.1 μg (Y-axis) and 6.8 μg (Z-axis), reaching the level of commercial devices.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":" ","pages":""},"PeriodicalIF":2.3,"publicationDate":"2023-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44854530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Corrigendum: On overtravel and skate in cantilever-based probes for on-wafer measurements (2022 J. Micromech. Microeng. 32 057001) 勘误:用于晶圆上测量的悬臂式探头的超行程和滑动(2022 J. Micromech.)。Microeng. 32 057001)

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-07-27 DOI: 10.1088/1361-6439/ace834

S. Arscott

引用次数: 0

A simple way to predict the flip–chip gap 一个简单的方法来预测倒装芯片的间隙

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-07-27 DOI: 10.1088/1361-6439/aceb00

Yue Huang, Zhi-Kai Gan, Chun Lin

引用次数: 0

The effect of tool wear on the damaged layer thickness and tool wear rate in ultra-precision turning of quartz glass 超精密车削石英玻璃时刀具磨损对损伤层厚度和刀具磨损率的影响

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-07-26 DOI: 10.1088/1361-6439/acea8b

Yujie Liu, H. Tong, Yong Li, Jialong Chen

{"title":"The effect of tool wear on the damaged layer thickness and tool wear rate in ultra-precision turning of quartz glass","authors":"Yujie Liu, H. Tong, Yong Li, Jialong Chen","doi":"10.1088/1361-6439/acea8b","DOIUrl":"https://doi.org/10.1088/1361-6439/acea8b","url":null,"abstract":"Quartz glasses have been extensively used for many fields, such as semiconductor technology, optical instruments, inertial navigation and others. Ultra-precision turning with diamond tools can achieve high surface accuracy when processing non-ferrous materials. In recent years, ultra-precision turning has also been tried to be applied to process brittle materials, but there are constraints including small removal amount and tool wear. When diamond tools are used to cut quartz glass, tool wear occurs under the combined action of thermal effect and mechanical friction, which will affect the damaged layer thickness of the processed quartz glass. In this paper, the tool wear factor is led into the calculation of the extrusion volume, and the damaged layer thickness is calculated by the extrusion volume. Combined with the results of quartz glass turning experiments and the calculated results by simulation, the effect of tool wear factor on the damaged layer thickness and the tool wear rate is analyzed. The analysis shows that tool wear will lead to chip fracture thickness decrease and extrusion volume increase. Combined action of these two aspects, the damage layer thickness keeps unchanged at first and then rises with the increase of tool wear. In addition, the experimental results show that the tool wear rate rises with the increase of tool wear.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":" ","pages":""},"PeriodicalIF":2.3,"publicationDate":"2023-07-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42870744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Voice coil motor-driven multi-DOF compliant parallel micropositioning stage based on a large range beam-based spherical hinge and fully symmetrical layout 基于大范围波束球面铰链和全对称布局的音圈电机驱动多自由度柔性并联微定位平台

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-07-20 DOI: 10.1088/1361-6439/ace918

Yunzhuang Chen, Leijie Lai, Yu Fang, Li-Min Zhu

{"title":"Voice coil motor-driven multi-DOF compliant parallel micropositioning stage based on a large range beam-based spherical hinge and fully symmetrical layout","authors":"Yunzhuang Chen, Leijie Lai, Yu Fang, Li-Min Zhu","doi":"10.1088/1361-6439/ace918","DOIUrl":"https://doi.org/10.1088/1361-6439/ace918","url":null,"abstract":"With the recent rapid developments in the field of precision engineering, demand for the large range multi-degrees-of-freedom (DOF) micropositioning stage has increased significantly. In this paper, to solve the problems of small motion range, local stress concentration, and low motion accuracy caused by the parasitic motion of the traditional flexure hinge in the multi-DOF micropositioning stage, we first propose a type of large-range beam-based flexure spherical hinge (BFSH). Subsequently, based on the proposed BFSH, a large range 3-DOF θxθyz spatial micropositioning stage driven by the voice coil motor is designed employing parallel branch chains and a fully symmetrical layout. This arrangement realizes theoretical motion decoupling in structural design. Furthermore, we use the geometric method to derive kinematic equations of the moving platform, which are used as the decoupling matrix of the control loop. Based on the compliance matrix method and Lagrange’s method, the compliance matrix model of the BFSH, the 3-DOF micropositioning stage, and the stage dynamic model are determined respectively. Additionally, finite element analysis and experimental tests are conducted to verify the accuracy of the analytical model and assess the static and dynamic performance of the designed 3-DOF stage. Moreover, a fractional order phase advanced proportional integral controller is designed for closed-loop control to track the sinusoidal trajectory and spherical trajectory. The results reveal that the stage can achieve the desired large workspace of ± 21.5 mrad × ± 20.3 mrad × ± 3.23 mm, as well as excellent decoupling and trajectory tracking performance.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":" ","pages":""},"PeriodicalIF":2.3,"publicationDate":"2023-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42751702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

First multiplexed electrochemical wax-on-plastic chip: PNA/GO interface integration for DNA detection 首个多路电化学塑料上蜡芯片:PNA/GO接口集成DNA检测

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-07-12 DOI: 10.1088/1361-6439/ace6b1

P. Das, O. Adil, M. Shamsi

{"title":"First multiplexed electrochemical wax-on-plastic chip: PNA/GO interface integration for DNA detection","authors":"P. Das, O. Adil, M. Shamsi","doi":"10.1088/1361-6439/ace6b1","DOIUrl":"https://doi.org/10.1088/1361-6439/ace6b1","url":null,"abstract":"This study presents the fabrication of the first multiplexed wax-on-plastic electrochemical chip with low-temperature sintering of the conductive layers. A total of 169 sensing electrodes (1.2 mm diameter each) were printed on a wax-patterned plastic substrate using silver inkjet printing. Fidelity of the device was confirmed using optical and electrical techniques. The sensing electrodes were modified using graphene oxide (GO) ink and peptide nucleic acid (PNA) probes through simple drop-casting. The PNA/GO interface on the multiplexed chip was used to detect DNA using differential pulse voltammetry, which records the electrons transfer from the diffusion of a soluble redox probe. The PNA/GO interface was then tested against a target concentration, target size, and mismatched target. The response of the DNA-PNA duplex on the surface was additionally compared with the prehybridized duplex, and the lower affinity of the duplexes for the GO surface was confirmed by removing Mg2+. The interface was responsive to such variables at attomolar concentrations. The low volume of the target (300 nL) at that concentration level demonstrated the chip sensitivity with only 18 target molecules on the surface.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":" ","pages":""},"PeriodicalIF":2.3,"publicationDate":"2023-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44708684","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Noise analysis and modeling for a digital control architecture for Lissajous frequency-modulated MEMS gyroscope with amplitude-modulated readout 具有调幅读出的Lissajous调频MEMS陀螺仪数字控制体系结构的噪声分析与建模

IF 2.3 4区工程技术

Journal of Micromechanics and Microengineering Pub Date : 2023-07-12 DOI: 10.1088/1361-6439/ace6af

Xuetong Wang, Xu-dong Zheng, Yaojie Shen, Chenhao Xia, Wenyuan Tong, Zhonghe Jin, Zhipeng Ma

{"title":"Noise analysis and modeling for a digital control architecture for Lissajous frequency-modulated MEMS gyroscope with amplitude-modulated readout","authors":"Xuetong Wang, Xu-dong Zheng, Yaojie Shen, Chenhao Xia, Wenyuan Tong, Zhonghe Jin, Zhipeng Ma","doi":"10.1088/1361-6439/ace6af","DOIUrl":"https://doi.org/10.1088/1361-6439/ace6af","url":null,"abstract":"We report a digital control architecture that demodulates both amplitude-modulated (AM) and frequency-modulated (FM) rate information simultaneously from a gyroscope working in Lissajous frequency-modulated (LFM) mode. The angular rate information is derived from both quadrature (X and Y) resonance modes of the gyroscope simultaneously. A noise model for the AM signal processing channel of the LFM gyroscope is built, analyzed and compared with that of a conventional AM gyroscope, which shows that methods to improve the performance of the conventional AM gyroscope can also be applied to the AM signal processing channel of the LFM gyroscope. The angular rate output obtained from the AM information of the LFM gyroscope has better noise characteristics, which therefore supplements the low precision inadequacy of the FM signal channel of the LFM mode. Tests on the same gyroscope working in different control architectures are conducted. The angle random walk (ARW) and bias instability (BI) of the AM channel of the proposed architecture are 0.51 deg √h−1 and 1.8 deg h−1, respectively, which are better than the results obtained from the FM channel in the same architecture, with values of 0.99 deg √h−1 and 4.3 deg h−1, respectively. Also ARW amd BI of the same gyroscope working in conventional AM mode is 0.50 deg √h−1 and 5.2 deg h−1, respectively.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":" ","pages":""},"PeriodicalIF":2.3,"publicationDate":"2023-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47786976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0