一个简单的方法来预测倒装芯片的间隙

IF 2.4 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Micromechanics and Microengineering Pub Date : 2023-07-27 DOI:10.1088/1361-6439/aceb00

Yue Huang, Zhi-Kai Gan, Chun Lin

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引用次数: 0

摘要

利用激光扫描共聚焦显微镜测量，首次建立了一种在微电子技术中提取铟凸块形状的简明方法。提取的凸起形状然后被用作有限元分析的输入。模型化的单凸块变形用于预测键合后的最终倒装芯片间隙。随着横截面扫描电子显微镜的结果，这种预测10微米或更小数量级倒装芯片间隙的简单无损方法最终得到了验证。

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A simple way to predict the flip–chip gap

Using laser scanning confocal microscopy measurement, a concise method for extracting the indium bump shape in microelectronics was first established. The extracted bump shape was then used as the input for finite element analysis. The modeled one-bump deformation was used to predict the final flip–chip gap after bonding. Dovetailed with the results of cross-sectional scanning electron microscopy, this simple and non-destructive method for predicting a flip–chip gap of the order of 10 microns or less was eventually validated.

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来源期刊

Journal of Micromechanics and Microengineering 工程技术-材料科学：综合

CiteScore

4.50

自引率

4.30%

发文量

136

审稿时长

2.8 months

期刊介绍： Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.