基于PZT薄膜的自底向上微机械可压缩聚对二甲苯管超声传声器

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Chung-Hao Huang, G. Feng
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引用次数: 0

摘要

本文报道了一种采用自底向上制造方法的微机械超声传声器。以4 μm厚的钛箔为衬底,在衬底上加入各功能薄膜和关键元件,完成超声波传声器。在具有低残余应力的图像化衬底上水热生长的锆钛酸铅压电薄膜在超声压力下有效偏转了传声器的均匀传感悬臂阵列。将所创建的悬臂阵列结构固定在250 μm厚的SU8中空板上,形成了在21 kHz下灵敏度为−60 dBV Pa−1(增益为0 dB)、工作带宽为5 ~ 55 kHz的超声波传声器板。在整个传感区域上覆盖了0.5 ~ 2 μm厚度的聚对二甲苯薄膜,将悬臂-膜片结构的传声器转换为进一步的研究。当沉积的聚对二甲苯薄膜厚度在亚微米范围内时,效果明显增强。通过添加聚苯乙烯薄膜制成的可压缩管作为亥姆霍兹谐振器(HR),麦克风的灵敏度可以进一步提高33%。对HR模型进行了讨论,并与实验结果进行了比较。与商用电容式MEMS超声波传声器相比,采用可压缩管组装的传声器的输出振幅提高了15 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Bottom-up micromachined PZT film-based ultrasonic microphone with compressible parylene tube
This paper reports on a micromachined ultrasonic microphone using a bottom-up fabrication scheme. Starting with a 4 μm-thick titanium foil as the substrate, each functional film and key element was added to the foil substrate to complete the ultrasonic microphone. The piezoelectric lead zirconate titanate film hydrothermally grown on the patterned substrate with low residual stress effectively deflected the unimorph-sensing cantilever array of the microphone under ultrasound pressure. The created cantilever array structure secured on a 250 μm-thick SU8 hollow plate formed an ultrasonic microphone plate that was tested with a sensitivity of −60 dBV Pa−1 at 21 kHz (with 0 dB gain amplification) and an operation bandwidth of 5–55 kHz. Different thicknesses of parylene films ranging from 0.5 to 2 μm overlaid over the entire sensing region and converted the cantilever-to-diaphragm-structured microphone for further investigation. An enhanced result was observed when the deposited parylene film thickness was in the submicron range. The sensitivity of the microphone can be further enhanced by up to 33% by adding a parylene-film-made compressible tube to act as a Helmholtz resonator (HR). The HR model was discussed and compared with the experimental results. The output amplitude of the developed microphone assembled with the compressible tube demonstrates a 15 dB increase compared to that of a commercial capacitive MEMS ultrasonic microphone.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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