低正向阻力高反向关断阀基压电泵的设计与研究

IF 2.4 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Micromechanics and Microengineering Pub Date : 2023-08-02 DOI:10.1088/1361-6439/acec7f

Yong Zhang, Jinyu Li, Xiaoliang Wang, Junqing Shao, Shanlin Liu, Qiaosheng Pan

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引用次数: 0

摘要

本文提出、设计、制造并实验研究了一种由双位移放大器振动器（DDAV）驱动的楔形阀压电泵。设计、制造和分析了一种新型的楔形阀，并对其静态性能进行了测试。试验结果表明，它具有较小的正向阻力和较高的反向关断能力。设计了DDAV和泵体，搭建了测试实验平台。结果表明，楔形阀的静态开启压力为0.27kPa，反向关闭压力可达200kPa。当驱动电压为700 Vpp，驱动频率为425 Hz时，最大流量为491.2 ml min−1，最大输出压力为160 kPa。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design and research of a valve-based piezoelectric pump with low forward resistance and high reverse shutoff

This paper proposes, designs, manufactures and experimentally studies a wedge valve piezoelectric pump driven by a double displacement amplifier vibrator (DDAV). A novel wedge valve is designed, manufactured and analyzed, and the static performance of the wedge valve is tested. The test results show that it has less forward resistance and high reverse shutoff. The DDAV and pump body are designed, and the test experimental platform is built. Results indicate that the static opening pressure of the wedge valve is 0.27 kPa, and the reverse shutoff pressure can reach 200 kPa. When the driving voltage is 700 Vpp and the driving frequency is 425 Hz, the maximum flow rate is 491.2 ml min−1 and the maximum output pressure is 160 kPa.

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来源期刊

Journal of Micromechanics and Microengineering 工程技术-材料科学：综合

CiteScore

4.50

自引率

4.30%

发文量

136

审稿时长

2.8 months

期刊介绍： Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.