Corrigendum: On overtravel and skate in cantilever-based probes for on-wafer measurements (2022 J. Micromech. Microeng. 32 057001)

IF 2.4 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Micromechanics and Microengineering Pub Date : 2023-07-27 DOI:10.1088/1361-6439/ace834

S. Arscott

引用次数: 0

Abstract

This corrigendum reformulates the equations for the normal contact force of the probe and the condition for tip skate in the presence of friction. This enables a formulation of the effective spring constant of a tilted probe to be written down. This model is compared to that of others.

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勘误:用于晶圆上测量的悬臂式探头的超行程和滑动(2022 J. Micromech.)。Microeng. 32 057001)

本更正重新表述了探针法向接触力的方程和存在摩擦时尖端滑板的条件。这使得能够写下倾斜探针的有效弹簧常数的公式。将此模型与其他模型进行比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Micromechanics and Microengineering 工程技术-材料科学：综合

CiteScore

4.50

自引率

4.30%

发文量

136

审稿时长

2.8 months

期刊介绍： Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.