超薄硅和聚合物异质集成柔性压力/温度传感器

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Weiwen Feng, Peng Li, Haozhi Zhang, Ke Sun, Wei Li, Xinxin Li
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引用次数: 0

摘要

柔性压力传感器和温度传感器以其高柔性、良好的形状保持性和极小的厚度等优点被广泛应用于各个领域。然而,制造具有可靠传感性能的超薄柔性压力传感器是相当具有挑战性的。在这项工作中,我们提出了一种新型的硅-聚合物非均匀集成MEMS柔性传感器,该传感器具有超薄硅基绝对压力传感元件和热敏电阻。在这项研究中,开发了一种柔性MEMS制造工艺,该工艺能够在两种不同的衬底上同时制造,并实现薄柔性传感器和薄柔性传感器的自释放。柔性传感器的前端部分宽度为125μm,长度为3.2cm,总厚度为12μm,其中集成硅衬底厚度仅为3μm。传感器采用细长形状,通过将其插入细长的医疗导管或注射器针管中进行医疗侵入性测量。所制备的超薄绝对压力传感器在3.3 V供电电压下的灵敏度为45.2μV kPa−1,非线性仅为±0.16%FS。热敏电阻的灵敏度在0°C–100°C范围内为10.4Ω°C−1。此外,多晶硅热敏电阻还可以用作微加热器,107μW的电加热功率会使温度升高13.5°C。MEMS柔性传感器具有超薄的结构和令人满意的性能,在生物医学等领域有着广阔的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Flexible pressure/temperature sensors with heterogeneous integration of ultra-thin silicon and polymer
Flexible pressure sensors and temperature sensors are widely used in various fields because of their advantages in high flexibility, good shape retention and extremely small thickness. However, it is quite challenging to fabricate ultra-thin flexible pressure sensors with reliable sensing performance. In this work, we propose a new type of silicon–polymer heterogeneously integrated MEMS flexible sensor with an ultra-thin silicon-based absolute pressure sensing element and a thermistor. In the study, a flexible MEMS fabrication process is developed, which enables simultaneous fabrication in two different substrates and self-release of the thin and slim flexible sensor. The front-end section of the flexible sensor is with the width as 125 μm, length as 3.2 cm and total thickness as 12 μm, where the integrated silicon substrate thickness is only 3 μm. The sensor takes a slender shape to allow for medical invasive measurement by inserting it into a slim medical catheter or a syringe needle-tube. The sensitivity of the fabricated ultra-thin absolute pressure sensor is tested as 45.2 μV kPa−1 under 3.3 V supplied voltage, with the nonlinearity as only ±0.16% FS. The sensitivity of the thermistor is 10.4 Ω °C−1 in the range of 0 °C–100 °C. Moreover, the polysilicon thermistor can also serve as a micro-heater, where an electric heating power of 107 μW results in a temperature increase of 13.5 °C. With ultra-thin slim structure and satisfactory performance, the MEMS flexible sensor is promising in various fields like biomedical applications.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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