2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)最新文献_第2页

IWIPP 2019 Index

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/iwipp.2019.8799076

引用次数: 0

Evaluation of the PCB-embedding technology for a 3.3 kW converter 评估 3.3 千瓦变流器的 PCB 嵌入技术

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799080

Remy Caillaud, Johan Le Lesle, C. Buttay, F. Morel, R. Mrad, N. Degrenne, S. Mollov

引用次数: 4

A study of dielectric breakdown of a half-bridge switching cell with substrate integrated 650V GaN dies 衬底集成650V GaN芯片半桥开关电池的介电击穿研究

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799104

Eduard Dechant, N. Seliger, R. Kennel

引用次数: 3

Silver sinter paste for SiC bonding with improved mechanical properties 银烧结浆料用于SiC键合，具有改善的机械性能

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799082

W. Schmitt, Ly May Chew, David Stenzel

{"title":"Silver sinter paste for SiC bonding with improved mechanical properties","authors":"W. Schmitt, Ly May Chew, David Stenzel","doi":"10.1109/IWIPP.2019.8799082","DOIUrl":"https://doi.org/10.1109/IWIPP.2019.8799082","url":null,"abstract":"Silver sintering become a mature interconnection technology for high reliability or high temperature electronic devices. Different sintering processes are applied depending upon application requirements, for instance pressure sintering process is optimized for elevated life time power modules. The pressure of the sintering process can be adjusted in order to modify the properties of the sinter layer. In general, higher pressure or temperature leads to higher Young’s modulus. With respect to the lifetime of an interconnection, the Young’s modulus, the dimension of the connected area and the CTE mismatch of the joint materials play an important role in temperature cycling. Thermo-mechanical tension might not be reduced easily by the interconnection material if the Young’s modulus of the material itself is high. A brittle die attach material might crack due to the bending of the package caused by the CTE mismatch of the used materials. This leads to a degradation of thermal conductivity and a reduced life time of the components, particularly on components which are operated at above 175°C. Silver sinter material with a reduced Young’s modulus as well as an adjusted CTE is desired to avoid crack, especially for the interconnection of large areas. This paper shows the result of silver sinter paste with improved mechanical properties. By adding non-silver particles to the sinter paste the Young’s modulus became independent of process parameters and became stable against further thermal exposure. This investigation is part of the public project HHK funded by BMBF.","PeriodicalId":150849,"journal":{"name":"2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124379776","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Measurement of Space Charge Distribution in Epoxy Resin Package at High Temperature under High DC Stress 高温高压下环氧树脂封装空间电荷分布的测量

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799088

Kosuke Sato, S. Konishi, H. Miyake, Y. Tanaka

{"title":"Measurement of Space Charge Distribution in Epoxy Resin Package at High Temperature under High DC Stress","authors":"Kosuke Sato, S. Konishi, H. Miyake, Y. Tanaka","doi":"10.1109/IWIPP.2019.8799088","DOIUrl":"https://doi.org/10.1109/IWIPP.2019.8799088","url":null,"abstract":"Space charge accumulation properties were investigated on epoxy resin under high dc stresses at high temperature. Due to the recent improvement in operable temperature of semiconductors, it is required to develop a new insulating material for semiconductor packaging, which exhibit a high insulation performance even at high temperature under the high electric stress. To estimate the insulation performance, it is said that the space charge accumulation is characteristic one of important factors for the evaluation of the materials. Therefore, in this study, the space charge behavior in epoxy resin, that is widely used as a semiconductor packaging material, is evaluated using PEA (Pulsed Electro Acoustic) method at high temperature under high electric field. While there are many demand to know the insulating properties in epoxy resin at relatively high temperature like more than 100 °C the ordinary PEA system was applicable to the measurement at temperature from room temperature to about 80 °C. Therefore, we improved the PEA system available to the measurement at 100 °C. In this report, two types of epoxy plate samples were used: one is made using an amine type curing agent (EP-A) and another is made using acid anhydride curing agent (EP-NH). As a result, it was found that an obvious amount of space charge accumulation was observed in EP-A, while it was not observed in EP-NH even under the dc stress of more than 100 kV/mm at 100 °C.","PeriodicalId":150849,"journal":{"name":"2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132604547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

3D-FE electro-thermo-magnetic modeling of automotive power electronic modules - Wire-bonding and Copper clip technologies comparison 汽车电力电子模块的3D-FE电-热-磁建模-线粘接和铜夹技术比较

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799092

Thiam Abdoulahad, Sarraute Emmanuel, Sanfins William, Richardeau Frederic, Durand Maël

引用次数: 7

Aerosol Jet Printing Process for Semi-Embedded Power Assembly 半嵌入式电源组件的气溶胶喷射打印工艺

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799091

S. Azzopardi, J. Lelièvre, T. Youssef, D. Labrousse, Elodie Pereira, P. Lasserre

引用次数: 0

Rate controlled sintering: A novel approach to improve quality and yield of die-attach interconnects 速率控制烧结:一种提高模具连接质量和成品率的新方法

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799103

Simon Merkert, A. Hutzler, T. Krebs

{"title":"Rate controlled sintering: A novel approach to improve quality and yield of die-attach interconnects","authors":"Simon Merkert, A. Hutzler, T. Krebs","doi":"10.1109/IWIPP.2019.8799103","DOIUrl":"https://doi.org/10.1109/IWIPP.2019.8799103","url":null,"abstract":"Silver (or copper) sintering is nowadays the best choice for power electronics systems with high requirements on reliability, lifetime and application temperature. Especially SiC power modules can only achieve a peak performance together with sintered interconnects. Due to the higher melting temperature and better mechanical properties of silver or copper compared to soft-solder alloys, sintering is used as interconnect material in power modules. But the sintering process itself requires a high pressure up to 30 MPa onto the devices and the process itself is more cost-intensive. To achieve an economical process and make sintering worthwhile to invest, a high yield as a result of a stable process is needed. The idea of rate-controlled sintering (RCS) is a novel approach to make the sintering process robust and profitable. It improves the mechanical properties of sintered die-attach interconnects and decrease their deviation by using vacuum and nitrogen to control the different stages of the sintering reaction. Within this paper the mechanisms of sintering will be introduced, on which the idea of RCS is founded on. A case-study will be presented to demonstrate how rate-controlled sintering works, how it can improve the shear-values of die-attaches and lower die shear deviation.","PeriodicalId":150849,"journal":{"name":"2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115763053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IWIPP 2019 Leadership

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/iwipp.2019.8799074

引用次数: 0

Silver Sintering Die Attach – Myths & Physics 银烧结模具附件-神话和物理

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799095

G. Dutt, M. Marczi, O. Khaselev

{"title":"Silver Sintering Die Attach – Myths & Physics","authors":"G. Dutt, M. Marczi, O. Khaselev","doi":"10.1109/IWIPP.2019.8799095","DOIUrl":"https://doi.org/10.1109/IWIPP.2019.8799095","url":null,"abstract":"Silver sintering offers a proven technology to overcome many of the thermal dissipation and high temperature stability challenges associated with power module interconnects (die attach, wire-bonds and heat sink attach). It is rapidly becoming the technology of choice for die attach (and top-side attach) for EV & HEV traction inverter applications. However, there are many different versions of sintering die attach and the process and performance tradeoffs are not clear.This paper strives to clear the mystery behind different versions of silver sintering and other silver based die attach technologies in the running for power packaging and inverter assembly. We describe the bonding mechanism and the resulting material structure for each material technology. The key structure attributes include the nature of interaction between particles (and the metallization at the die and substrate interfaces), porosity and density. Then we relate structure to typical properties achieved with these different materials. Based on material properties we suggest the functional application mission profiles (like power cycling, maximum operating temperature) suitable for each material technology.","PeriodicalId":150849,"journal":{"name":"2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132121005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1