Aerosol Jet Printing Process for Semi-Embedded Power Assembly

Abstract

High integration in power electronics is a key to address higher frequency applications, size reduction in power converter and higher converters efficiency. Up to date power modules using wire-bonding in conventional package present weakness in term of stray inductances, wire-bonding lift-off, heat spreading and as a consequence reliability issue. The proposed paper focuses on the use of Aerosol Jet Printing Technology for designing the technological bricks of high integrated power assembly using a semi-embedded approach. Single switches, based on the association of a power transistor (Si-IGBT) and a power diode (Si-Diode) inserted in surface cavities, have been fabricated on an AlN substrate. Preliminary assemblies, with electrical and mechanical tests have been investigated showing promising results for the Aerosol Jet Printing Technology for low to medium power application.