Remy Caillaud, Johan Le Lesle, C. Buttay, F. Morel, R. Mrad, N. Degrenne, S. Mollov
{"title":"Evaluation of the PCB-embedding technology for a 3.3 kW converter","authors":"Remy Caillaud, Johan Le Lesle, C. Buttay, F. Morel, R. Mrad, N. Degrenne, S. Mollov","doi":"10.1109/IWIPP.2019.8799080","DOIUrl":null,"url":null,"abstract":"This paper presents a converter fully made using PCB embedding technology (including the semiconductor devices, but also their gate driver circuits as well as the passive components). This converter is rated at a high-power (3.3 kW) considering the PCB technology. Here, the focus is given to the experimental validation of the embedding process, with the characterization of many of the embedded devices (SiC MOSFETs, diodes, capacitors). These results show that most of the components were unaffected by the process, with the noticeable exception of the large inductors which exhibit variations in the inductance values as well as a large ac resistance. Finally, the converter is successfully assembled an tested at low power.","PeriodicalId":150849,"journal":{"name":"2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWIPP.2019.8799080","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
This paper presents a converter fully made using PCB embedding technology (including the semiconductor devices, but also their gate driver circuits as well as the passive components). This converter is rated at a high-power (3.3 kW) considering the PCB technology. Here, the focus is given to the experimental validation of the embedding process, with the characterization of many of the embedded devices (SiC MOSFETs, diodes, capacitors). These results show that most of the components were unaffected by the process, with the noticeable exception of the large inductors which exhibit variations in the inductance values as well as a large ac resistance. Finally, the converter is successfully assembled an tested at low power.