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2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)最新文献

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Development and evaluation of SiC inverter using Ni micro plating bonding power module 采用Ni微镀键合电源模块的SiC逆变器的研制与评价
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 2019-04-01 DOI: 10.1109/IWIPP.2019.8799079
A. Kawagoe, Tomoya Itose, Akihiro Imakiire, M. Kozako, M. Hikita, K. Tatsumi, T. Iizuka, I. Morisako, Nobuaki Sato, K. Shimizu, Kazutoshi Ueda, K. Sugiura, K. Tsuruta, Keiji Toda
{"title":"Development and evaluation of SiC inverter using Ni micro plating bonding power module","authors":"A. Kawagoe, Tomoya Itose, Akihiro Imakiire, M. Kozako, M. Hikita, K. Tatsumi, T. Iizuka, I. Morisako, Nobuaki Sato, K. Shimizu, Kazutoshi Ueda, K. Sugiura, K. Tsuruta, Keiji Toda","doi":"10.1109/IWIPP.2019.8799079","DOIUrl":"https://doi.org/10.1109/IWIPP.2019.8799079","url":null,"abstract":"This paper reports on evaluation of inverter system using silicon carbide (SiC) power module with a novel packaging technology of Ni micro plating bonding. The power module is developed to make the structure maximize the performance of SiC attracting attention in recent years. As a result, it was found that the developed inverter reduces the inverter loss and improves the efficiency of the entire inverter system as compared with in-vehicle product using Si-IGBT and the inverter consisting of the conventional package structure using SiC MOSFET. Moreover, it was confirmed that switching was possible even when the chip temperature exceeded 200°C, suggesting that the developed inverter can be driven under the high temperature environment.","PeriodicalId":150849,"journal":{"name":"2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127898503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
IWIPP 2019 Tutorial
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Pub Date : 1900-01-01 DOI: 10.1109/iwipp.2019.8799075
Aaron D. Brovont
{"title":"IWIPP 2019 Tutorial","authors":"Aaron D. Brovont","doi":"10.1109/iwipp.2019.8799075","DOIUrl":"https://doi.org/10.1109/iwipp.2019.8799075","url":null,"abstract":"Provides an abstract of the tutorial presentation and may include a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.","PeriodicalId":150849,"journal":{"name":"2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124235005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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