评估 3.3 千瓦变流器的 PCB 嵌入技术

Remy Caillaud, Johan Le Lesle, C. Buttay, F. Morel, R. Mrad, N. Degrenne, S. Mollov
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引用次数: 4

摘要

本文介绍了一种完全采用印刷电路板嵌入技术制造的转换器(包括半导体器件、栅极驱动电路以及无源元件)。考虑到 PCB 技术,该转换器的额定功率很高(3.3 kW)。这里的重点是嵌入工艺的实验验证,以及许多嵌入器件(SiC MOSFET、二极管、电容器)的特性分析。这些结果表明,大多数元件不受工艺影响,但大型电感器明显例外,其电感值会出现变化,而且交流电阻较大。最后,转换器组装成功,并进行了低功率测试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of the PCB-embedding technology for a 3.3 kW converter
This paper presents a converter fully made using PCB embedding technology (including the semiconductor devices, but also their gate driver circuits as well as the passive components). This converter is rated at a high-power (3.3 kW) considering the PCB technology. Here, the focus is given to the experimental validation of the embedding process, with the characterization of many of the embedded devices (SiC MOSFETs, diodes, capacitors). These results show that most of the components were unaffected by the process, with the noticeable exception of the large inductors which exhibit variations in the inductance values as well as a large ac resistance. Finally, the converter is successfully assembled an tested at low power.
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