Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)最新文献_第6页

Copper metallization for advanced interconnects: the electrochemical revolution 用于高级互连的铜金属化:电化学革命

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345663

P. Haumesser, M. Cordeau, S. Maitrejean, T. Mourier, L. Gosset, W. Besling, G. Passemard, J. Torres

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引用次数: 7

Air gap technology by selective ozone/TEOS deposition 选择性臭氧/TEOS沉积气隙技术

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345723

Z. Gabric, W. Pamler, G. Schindler, W. Steinhogl, M. Traving

引用次数: 6

Reliability of air-gap Cu interconnect and approach to selective W sealing using 90nm node technology 采用90nm节点技术的气隙铜互连可靠性及选择性W密封方法

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345693

J. Noguchi, K. Sato, N. Konishi, S. Uno, T. Oshima, U. Tanaka, K. Ishikawa, H. Ashihara, T. Saito, M. Kubo, H. Aoki, T. Fujiwara

引用次数: 3

Comprehensive electromigration studies on dual-damascene Cu interconnects with ALD WC/sub x/N/sub y/ barriers 具有ALD WC/sub x/N/sub y/势垒的双damascene Cu互连的综合电迁移研究

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345666

C. Bruynseraede, A. Fischer, F. Ungar, J. Schumacher, V. Sutcliffe, J. Michelon, K. Maex

引用次数: 1

A 90nm high volume manufacturing logic technology featuring Cu metallization and CDO low-k ILD interconnects on 300 mm wafers 90nm高容量制造逻辑技术，在300mm晶圆上实现铜金属化和CDO低k ILD互连

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345747

C. Jan, N. Anand, C. Allen, J. Bielefeld, M. Buehler, V. Chikamane, K. Fischer, K. Jain, J. Jeong, S. Klopcic, T. Marieb, B. Miner, P. Nguyen, A. Schmitz, M. Nashner, T. Scherban, B. Schroeder, C. Ward, R. Wu, K. Zawadzki, S. Thompson, M. Bohr

引用次数: 7

Inductance enhancement in global clock distribution networks 全球时钟分配网络中的电感增强

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345711

H. Luman, J. Davis

引用次数: 2

Effect of bridging groups of precursors on modulus improvement in plasma co-polymerized low-k films 前驱体桥接基团对等离子体共聚低钾薄膜模量改善的影响

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345719

N. Kunimi, J. Kawahara, A. Nakano, K. Kinoshita, Y. Hayashi, M. Komatsu, Y. Seino, R. Ichikawa, Y. Takasu, T. Kikkawa

引用次数: 0

Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration 32nm节点Cu/超低k (k=1.6-1.8)集成CMP过程中图案化低k薄膜分层的表征

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345761

B. Yoo, S. Kondo, S. Tokitoh, A. Namiki, K. Misawa, K. Inukai, N. Ohashi, N. Kobayashi

引用次数: 6

Robust multilevel interconnects with a nano-clustering porous low-k (k<2.3) 具有纳米聚类多孔低k (k<2.3)的鲁棒多级互连

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345733

T. Nakamura, A. Nakashima

引用次数: 11

Intrachip optical interconnect: an above IC approach 片内光互连:一种以上的集成电路方法

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345766

S. Jeannot, N. Schnell, Régis Orobtchouk, J. Fédéli, F. Fusalba, Vincent Jousseaume, P. Maury, F. Gaillard, T. Benyattou, G. Passemard

引用次数: 1