片内光互连:一种以上的集成电路方法

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI:10.1109/IITC.2004.1345766

S. Jeannot, N. Schnell, Régis Orobtchouk, J. Fédéli, F. Fusalba, Vincent Jousseaume, P. Maury, F. Gaillard, T. Benyattou, G. Passemard

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引用次数: 1

摘要

本文介绍了一种基于高容量IC时钟信号分布的光互连新方法，该方法采用高折射率差聚合物。我们对设计及其可行性进行了研究，并展示了用类似材料获得的第一个部件的结果。我们展示了使用与微电子工艺兼容的材料的高水平集成，允许芯片内光学分布。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Intrachip optical interconnect: an above IC approach

This paper describes a new approach for optical interconnects, based on an above IC clock signal distribution with high compacity, using polymers with high refractive index difference. We investigate the design and its feasibility study and show the results on the first components obtained with similar materials. We demonstrate a high level of integration using materials compatible with microelectronic process, allowing an intra-chip optical distribution.

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Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)

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