S. Jeannot, N. Schnell, Régis Orobtchouk, J. Fédéli, F. Fusalba, Vincent Jousseaume, P. Maury, F. Gaillard, T. Benyattou, G. Passemard
{"title":"Intrachip optical interconnect: an above IC approach","authors":"S. Jeannot, N. Schnell, Régis Orobtchouk, J. Fédéli, F. Fusalba, Vincent Jousseaume, P. Maury, F. Gaillard, T. Benyattou, G. Passemard","doi":"10.1109/IITC.2004.1345766","DOIUrl":null,"url":null,"abstract":"This paper describes a new approach for optical interconnects, based on an above IC clock signal distribution with high compacity, using polymers with high refractive index difference. We investigate the design and its feasibility study and show the results on the first components obtained with similar materials. We demonstrate a high level of integration using materials compatible with microelectronic process, allowing an intra-chip optical distribution.","PeriodicalId":148010,"journal":{"name":"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2004.1345766","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper describes a new approach for optical interconnects, based on an above IC clock signal distribution with high compacity, using polymers with high refractive index difference. We investigate the design and its feasibility study and show the results on the first components obtained with similar materials. We demonstrate a high level of integration using materials compatible with microelectronic process, allowing an intra-chip optical distribution.